Glenn C Forman

US Patent:

6474860, Nov 5, 2002

Filed:

May 21, 2001

Appl. No.:

09/861436

Inventors:

Robert John Wojnarowski - Ballston Lake NY
Glenn Alan Forman - Niskayuna NY
Yung Sheng Liu - Schenectady NY

Assignee:

General Electric Company - Schenectady NY

International Classification:

G06B 626

US Classification:

362555, 362554, 385 52, 359110, 359163, 250221, 250553

Abstract:

An optical interface for data communication that can be manufactured and aligned in a cost effective manner includes an array of optical emitters and an optical receiver are positioned within a predetermined tolerance with reference to each other so as to establish an optical data communication path. To search for and determine which of the emitters of the array achieves the best alignment, the optical emitters are individually energized in a sequence, while monitoring the output signal of the optical receiver. For subsequent data communications, the optical emitter determined to achieve the best alignment is employed.

US Patent:

6711312, Mar 23, 2004

Filed:

Dec 20, 2002

Appl. No.:

10/248148

Inventors:

William Kornrumpf - Schenectady NY
Glenn Claydon - Wynantskill NY
Samhita Dasgupta - Niskayuna NY
Robert Filkins - Niskayuna NY
Glenn Forman - Niskayuna NY
Joseph Iannotti - Glenville NY
Matthew Christian Nielsen - Schenectady NY

Assignee:

General Electric Company - Schenectady NY

International Classification:

G02B 612

US Classification:

385 14, 385 2, 385129, 359245

Abstract:

The invention comprises a novel combination of microwave and photonic packaging to arrive a compact, self contained MZI modulator. The nature of the NLO polymer, that is, its large electro-optic coefficient reduces the drive requirements for the integrated power amplifier, allowing a small to medium power amplifier to be used. Microwave high density interconnect (HDI) packaging techniques allow the medium power amplifier to be fabricated into a small assembly, which can be mounted directly to the MZI substrate. The integrated amplifier and modulator provides a significant reduced size and lower power, and high bandwidth advantage when compared with existing devices based on inorganic materials.

US Patent:

6818466, Nov 16, 2004

Filed:

Dec 4, 2003

Appl. No.:

10/728148

Inventors:

William Kornrumpf - Schenectady NY
Glenn Claydon - Wynantskill NY
Samhita Dasgupta - Niskayuna NY
Robert Filkins - Niskayuna NY
Glenn Forman - Niskayuna NY
Joseph Iannotti - Glenville NY
Matthew Christian Nielsen - Schenectady NY

Assignee:

General Electric Company - Schenectady NY

International Classification:

H01L 2100

US Classification:

438 31, 438 29, 438 99, 438107

Abstract:

A method of fabricating an integrated optoelectronic circuit. The method includes positioning a microchip on a first flexible dielectric substrate. A polymer electro-optic waveguide is positioned on or within the first flexible dielectric substrate. A ground electrode is positioned along the electro-optic waveguide. A signal electrode is positioned along the electro-optic waveguide opposite the ground electrode. A first patterned metallization layer is applied to the first flexible dielectric substrate. A second flexible dielectric substrate is positioned along the first flexible dielectric substrate. A plurality of via openings are provided in the first and second flexible dielectric substrates. A second patterned metallization layer is applied to the second flexible dielectric substrate.

US Patent:

6912183, Jun 28, 2005

Filed:

Feb 18, 2003

Appl. No.:

10/368170

Inventors:

Kelvin Ma - Clifton Park NY, US
Glenn Forman - Niskayuna NY, US
Jeannine Jones - Enfield CT, US

Assignee:

General Electric Company - Niskayuna NY

International Classification:

G11B007/00

US Classification:

369 4419, 369 4414, 369 4417

Abstract:

High-speed pick-up mechanisms operable for reading data from and/or writing data to an optical storage medium are disclosed. These mechanisms comprise a pivotable structure, a reflective element, a light source, a light receiving device, and an actuation device. The light source and the light receiving device are remotely located from the reflective element via the pivotable structure, and only the reflective element and a portion of the pivotable structure are positioned adjacent the surface of an optical storage medium. High-speed optical read/write devices and systems comprising these high-speed pick-up mechanisms are also disclosed. Additionally, high-speed methods for reading data from and/or writing data to an optical storage medium are disclosed.

US Patent:

6956796, Oct 18, 2005

Filed:

Feb 18, 2003

Appl. No.:

10/368162

Inventors:

Kelvin Ma - Clifton Park NY, US
Glenn Forman - Niskayuna NY, US

Assignee:

General Electric Company - Niskayuna NY

International Classification:

G11B007/00

US Classification:

369 4419, 369 4414, 369 4417

Abstract:

High-capacity pick-up mechanisms operable for selectively reading data from and/or writing data to one or more surfaces of one or more optical storage media are disclosed. These mechanisms comprise a first pivotable structure, a second pivotable structure, a first reflective element, a second reflective element, a light source, and a light receiving device. The light source and the light receiving device are remotely located from the reflective elements via the pivotable structures, and only the reflective elements and a portion of the pivotable structure are positioned adjacent the surface of an optical storage medium. High-capacity optical read/write devices and systems comprising these high-capacity pick-up mechanisms are also disclosed.

US Patent:

7173426, Feb 6, 2007

Filed:

Nov 29, 2005

Appl. No.:

11/288555

Inventors:

Selaka Bandara Bulumulla - Niskayuna NY, US
Glenn Alan Forman - Niskayuna NY, US

Assignee:

General Electric Company - Niskayuna NY

International Classification:

G01V 3/00

US Classification:

324318, 324322

Abstract:

An optical data link is provided for optically transmitting in free space data from a plurality of receiver coils in a magnetic resonance (MR) imaging system. This free space (e. g. , through-the-air) optical data link provides a tether-less (i. e. , no bundles of physical wires or optic fibers), essentially electro-magnetically immune (no interference as in radio-frequency wireless transmissions) and scalable solution to transmit data usable to create an MR image.

US Patent:

7277179, Oct 2, 2007

Filed:

Dec 13, 2004

Appl. No.:

11/010530

Inventors:

Kung-Li Justin Deng - Waterford NY, US
Glenn Alan Forman - Niskayuna NY, US

Assignee:

General Electric Company - Niskayuna NY

International Classification:

G01B 9/02

US Classification:

356483, 356478, 356461

Abstract:

A system for estimating a parameter selected from the group consisting of a current, a magnetic field, or combinations thereof comprises a resonant frequency tunable magneto-optical loop resonator, wherein the loop resonator comprises a magneto-optical sensing element coupled to an optical waveguide, and wherein the loop resonator is configured for receiving an originating optical signal from a broadband light source and providing a modulated signal indicative of the estimated parameter.

US Patent:

7327022, Feb 5, 2008

Filed:

Dec 30, 2002

Appl. No.:

10/248237

Inventors:

Glenn Scott Claydon - Wynantskill NY, US
Matthew Christian Nielsen - Schenectady NY, US
Samhita Dasgupta - Niskayuna NY, US
Robert John Filkins - Niskayuna NY, US
Glenn Alan Forman - Niskayuna NY, US

Assignee:

General Electric Company - Niskayuna NY

International Classification:

H01L 23/48
H01L 23/52
H01L 29/40
H01L 23/29
H01L 23/02

US Classification:

257689, 257 67, 257621, 257661, 257665, 257685, 257686, 257688, 257700, 257774, 257643, 257723, 257724, 257725, 257759, 257760, 257792

Abstract:

A novel micro optical system as a platform technology for electrical and optical interconnections, thermal and mechanical assembly and integration of electronic, optoelectronic, passive and active components. This platform provides optical coupling and chip-to-chip interconnection by microwave electrical, optical guided and unguided waves, and power or bias electrical contacts or interfaces by a novel chip in flexible circuit, rigid or inflexible embodiments.