Graeme Russell Dickinson

age ~44

from Bothell, WA

Get Report

Also known as:

Graeme R Dickinson
Greeme R Dickinson
Graeme R Dickenson
Grae Dickinson
Graeme Dicksinson

Connected to:

Graeme Dickinson Phones & Addresses

Bothell, WA
Lynnwood, WA
Scottsdale, AZ
Florham Park, NJ
Morris Plains, NJ
Phoenix, AZ
Indianapolis, IN
West Lafayette, IN
Midland, MI

Work

Company:

Fluke corporation
May 2020
Position:

Global product director

Education

Degree:

Master of Business Administration, Masters
School / High School:

Arizona State University - W. P. Carey School of Business
Specialities:

Management

Skills

Account Management • Cross Functional Team Leadership • Management • Lean Manufacturing • Product Marketing • Strategy • Marketing Strategy • Manufacturing • Product Development • Product Management • Process Improvement • Competitive Analysis • Continuous Improvement • Forecasting • Pricing • Process Engineering • Program Management • Project Management • Six Sigma • Supply Chain Management • Operations Management • Business Development • Investor Relations • Business Strategy • Product Launch • Software Project Management • Business Requirements • Acquisition Integration • Research and Development • Materials Science • Software As A Service • Contract Negotiation • B2B Marketing Strategy • Profit and Loss Management • Investor Liaison • Global Client Management • Shareholder Agreements • Business Modeling • Value Propositions • Demand Forecasting • Product Costing • Kpi Implementation • Market Needs Analysis • Voice of the Customer Analysis • Supplier Management • Sku Management • Product Rationalization • Business Growth Strategies • Capital Projects • Channel Strategy • Market Share

Ranks

Certificate:

Six Sigma Green Belt Certification

Industries

Electrical/Electronic Manufacturing

Resumes

Global Product Director

view source

Location:

245 Railroad St, Woonsocket, RI 02895

Industry:

Electrical/Electronic Manufacturing

Work:

Fluke Corporation
Global Product Director
Lumiant Corporation 2017 - 2018
Chief Operating Officer | Acting President
Honeywell Mar 2015 - 2017
Global Business Manager
Honeywell 2012 - 2015
Senior Product Marketing Manager
Honeywell 2011 - 2012
Strategic Marketing Manager

Education:

Arizona State University - W. P. Carey School of Business
Master of Business Administration, Masters, Management Purdue University
Master of Science, Masters, Materials Science, Engineering Purdue University
Bachelors, Bachelor of Science, Materials Science, Engineering

Skills:

Account Management
Cross Functional Team Leadership
Management
Lean Manufacturing
Product Marketing
Strategy
Marketing Strategy
Manufacturing
Product Development
Product Management
Process Improvement
Competitive Analysis
Continuous Improvement
Forecasting
Pricing
Process Engineering
Program Management
Project Management
Six Sigma
Supply Chain Management
Operations Management
Business Development
Investor Relations
Business Strategy
Product Launch
Software Project Management
Business Requirements
Acquisition Integration
Research and Development
Materials Science
Software As A Service
Contract Negotiation
B2B Marketing Strategy
Profit and Loss Management
Investor Liaison
Global Client Management
Shareholder Agreements
Business Modeling
Value Propositions
Demand Forecasting
Product Costing
Kpi Implementation
Market Needs Analysis
Voice of the Customer Analysis
Supplier Management
Sku Management
Product Rationalization
Business Growth Strategies
Capital Projects
Channel Strategy
Market Share

Certifications:

Six Sigma Green Belt Certification
Software Product Management

Us Patents

Thermal Spray Coatings For Semiconductor Applications
view source
US Patent:

20120177908, Jul 12, 2012
Filed:

Jul 12, 2011
Appl. No.:

13/180592
Inventors:

Christopher Petorak - Carmel IN, US
Graeme Dickinson - Scottsdale AZ, US
International Classification:

B32B 18/00
C09D 1/00
B32B 5/14
C23C 4/10
US Classification:

4283105, 427453, 1062861
Abstract:

This invention relates to thermal spray coatings on a metal or non-metal substrate. The thermal spray coating comprises a ceramic coating having a functionally graded porosity across the ceramic coating thickness. The ceramic coating includes an inner layer and an outer layer. The inner layer has a porosity at or near the interface of the inner layer and the metal or non-metal substrate sufficient to provide a compliant ceramic coating capable of straining under thermal expansion mismatch between the ceramic coating and the metal or non-metal substrate at elevated temperature. The outer layer has a decreasing porosity extending from the surface of the inner layer to the surface of the ceramic coating sufficient to provide corrosion resistance and/or plasma erosion resistance to said ceramic coating. This invention also relates to methods of protecting metal and non-metal substrates by applying the thermal spray coatings. The coatings are useful, for example, in the protection of semiconductor manufacturing equipment, e.g., integrated circuit, light emitting diode, display, and photovoltaic, internal chamber components, and electrostatic chuck manufacture.

Thermal Spray Composite Coatings For Semiconductor Applications
view source
US Patent:

20120183790, Jul 19, 2012
Filed:

Jul 12, 2011
Appl. No.:

13/180748
Inventors:

Christopher Petorak - Carmel IN, US
Graeme Dickinson - Scottsdale AZ, US
Neill Jean McDill - Scottsdale AZ, US
International Classification:

B32B 18/00
B32B 15/04
C23C 4/12
C04B 35/48
C04B 35/04
C04B 35/10
B32B 5/00
C04B 35/01
US Classification:

428450, 428469, 428701, 428472, 428471, 428446, 501 94, 501103, 501104, 501105, 501108, 501119, 501123, 501125, 501127, 427446
Abstract:

This invention relates to thermal spray composite coatings on a metal or non-metal substrate. The thermal spray composite coatings comprise a ceramic composite coating having at least two ceramic material phases randomly and uniformly dispersed and/or spatially oriented throughout the ceramic composite coating. At least a first ceramic material phase is present in an amount sufficient to provide corrosion resistance to the ceramic composite coating, and at least a second ceramic material phase is present in an amount sufficient to provide plasma erosion resistance to the ceramic composite coating. This invention also relates to methods of protecting metal and non-metal substrates by applying the thermal spray coatings. The composite coatings provide erosion and corrosion resistance at processing temperatures higher than conventional processing temperatures used in the semiconductor etch industry, e.g., greater than 100 C. The coatings are useful, for example, in the protection of semiconductor manufacturing equipment, e.g., integrated circuit, light emitting diode, display, and photovoltaic, internal chamber components, and electrostatic chuck manufacture.

Thermal Spray Composite Coatings For Semiconductor Applications
view source
US Patent:

20120196139, Aug 2, 2012
Filed:

Jul 12, 2011
Appl. No.:

13/180904
Inventors:

Christopher Petorak - Carmel IN, US
Graeme Dickinson - Scottsdale AZ, US
Neill Jean McDill - Scottsdale AZ, US
International Classification:

B32B 15/04
B32B 18/00
B05D 1/02
US Classification:

428472, 427446, 428469, 428701, 4284722
Abstract:

This invention relates to thermal spray composite coatings on a metal or non-metal substrate. The thermal spray composite coatings comprise (i) a ceramic composite coating undercoat layer having at least two ceramic material phases randomly and uniformly dispersed and/or spatially oriented throughout the ceramic composite coating, and (ii) a ceramic coating topcoat layer applied to the undercoat layer. At least a first ceramic material phase is present in the undercoat layer in an amount sufficient to provide corrosion resistance to the ceramic composite coating, and at least a second ceramic material phase is present in the undercoat layer in an amount sufficient to provide plasma erosion resistance to the ceramic composite coating. This invention also relates to methods of protecting metal and non-metal substrates by applying the thermal spray coatings. The composite coatings provide erosion and corrosion resistance at processing temperatures higher than conventional processing temperatures used in the semiconductor etch industry, e.g., greater than 100 C. The coatings are useful, for example, in the protection of semiconductor manufacturing equipment, e.g., integrated circuit, light emitting diode, display, and photovoltaic, internal chamber components, and electrostatic chuck manufacture.

Thermal Spray Coatings For Semiconductor Applications
view source
US Patent:

20100272982, Oct 28, 2010
Filed:

Oct 20, 2009
Appl. No.:

12/582237
Inventors:

Graeme Dickinson - Scottsdale AZ, US
John Sirman - Bethlehem CT, US
Adil Ashary - Zionsville IN, US
Christopher Petorak - Chandler AZ, US
Neill Jean McDill - Scottsdale AZ, US
International Classification:

B32B 3/26
B32B 18/00
B32B 15/04
B05D 1/08
C09D 5/08
US Classification:

4283044, 428446, 428450, 428457, 428698, 205 50, 428702, 428472, 427446, 106 1405
Abstract:

This invention relates to thermal spray coatings on a metal or non-metal substrate. The thermal spray coating comprises a partially or fully stabilized ceramic coating, e.g., yttria stabilized zirconia coating, and has sufficiently high thermodynamic phase stability to provide corrosion and/or erosion resistance to the substrate. This invention also relates to methods of protecting metal and non-metal substrates by applying the thermal spray coatings. The coatings are useful, for example, in the protection of integrated circuit manufacturing equipment, internal chamber components, and electrostatic chuck manufacture.