Tadashi Tr Takano

US Patent:

6822047, Nov 23, 2004

Filed:

Jan 2, 2003

Appl. No.:

10/336067

Inventors:

Tadashi Takano - Santa Ana CA

Assignee:

National Starch and Chemical Investment Holding Corporation - New Castle DE

International Classification:

C08L 6300

US Classification:

525107, 525114, 525117, 525122

Abstract:

An adhesive for use on metal substrates, and particularly on copper substrates, comprises (a) carboxyl benzotriazole, (b) an epoxy resin having a reactive double bond, (c) a radical curing resin, and (d) a radical initiator. The combination of elements (a) and (b) in a radical curing resin system composed of the elements (c) and (d) provides improved adhesion strength to copper metal compared to compositions containing (c) and (d) without (a) and (b).

US Patent:

8338536, Dec 25, 2012

Filed:

Sep 17, 2010

Appl. No.:

12/884300

Inventors:

My Nguyen - Poway CA, US
Tadashi Takano - Huntington Beach CA, US
Puwei Liu - San Marcos CA, US

Assignee:

Henkel Corporation - Rocky Hill CT

International Classification:

C08L 63/00
C08L 63/02
C08L 63/06
B32B 27/38
C09J 163/00
C09J 163/02
C09J 163/06

US Classification:

525 92H, 156329, 156330, 428413, 525525, 525526, 525529, 525531

Abstract:

Novel adhesive compositions that can be used in the die attach process. The adhesives include a curable resin component, a curing agent, and a block copolymer additive. The block copolymer additive has a glass transition temperature of at least about 40 C. The block copolymer additive improves the affinity of the adhesive composition to a hydrophilic substrate, such as a silicon wafer, during the die pickup process. Also disclosed is an assembly which includes a hydrophilic substrate and a layer of adhesive and methods of producing the assembly.

US Patent:

20100062260, Mar 11, 2010

Filed:

Sep 2, 2009

Appl. No.:

12/552331

Inventors:

Tadashi Takano - Irvine CA, US
Osama M. Musa - Hillsborough NJ, US

International Classification:

B32B 15/092
C08K 5/3415
B32B 15/08
B32B 15/082

US Classification:

428416, 524 90, 428457, 428463

Abstract:

An adhesive composition includes a curable resin and a porphyrin derivative, in which the porphyrin derivative has at least one carboxylic acid group that is typically pendant from the porphyrin ring. In another embodiment, this invention is a method for improving adhesion of an adhesive composition to a metal substrate in which a porphyrin derivative is added to a resin, wherein the porphyrin derivative has at least one carboxylic acid group pendant from the porphyrin ring. In a third embodiment, this invention is an assembly in which a semiconductor die is mounted on a metal substrate using an adhesive composition that contains a porphyrin derivative that has at least one carboxylic acid group. In one embodiment the porphyrin derivative is Protoporphyrin IX, having the structure

US Patent:

20110129673, Jun 2, 2011

Filed:

Dec 1, 2009

Appl. No.:

12/628966

Inventors:

Shashi Gupta - Tustin CA, US
Jie Bai - Aliso Viejo CA, US
Tadashi Takano - Irvine CA, US
GuiXiang Yang - Plainville MA, US

International Classification:

B32B 5/16
C08K 3/38
H01B 1/20

US Classification:

428403, 523200, 252500

Abstract:

In accordance with the present invention, there are provided filled epoxy-based formulations wherein the filler comprises silver-coated boron nitride particulate material. In accordance with a further embodiment of the present invention, there are provided articles comprising particulate boron nitride having a silver coating on at least a portion of the surface thereof. In additional embodiments of the present invention, there are provided methods for the use of invention articles and formulations.

US Patent:

20130079475, Mar 28, 2013

Filed:

Nov 19, 2012

Appl. No.:

13/680522

Inventors:

Henkel Corporation - Rocky Hill CT, US
Tadashi Takano - Irvine CA, US
Puwei Liu - San Marcos CA, US

Assignee:

Henkel Corporation - Rocky Hill CT

International Classification:

C09J 163/00

US Classification:

525453

Abstract:

Novel adhesive compositions that can be used in the die attach process. The adhesives include a curable resin component, a curing agent, and a block copolymer additive. The block copolymer additive has a glass transition temperature of at least about 40 C. The block copolymer additive improves the affinity of the adhesive composition to a hydrophilic substrate, such as a silicon wafer, during the die pickup process. Also disclosed is an assembly which includes a hydrophilic substrate and a layer of adhesive and methods of producing the assembly.

US Patent:

20170306100, Oct 26, 2017

Filed:

Jul 12, 2017

Appl. No.:

15/647648

Inventors:

- Duesseldorf, DE
Wenjuan Tan - Shanghai, CN
Wentao Xing - Shanghai, CN
Yong Zhang - Shanghai, CN
Mieko Sano - Yokohama, JP
Aya Hikita - Kanagawa, JP
Tadashi Takano - Irvine CA, US
Liwei Zhang - Shanghai, CN
Carol Yang - Shanghai, CN
Zhiming Li - Shanghai, CN
Juan Du - Shanghai, CN

International Classification:

C08G 77/20
C08G 77/08
C08G 77/12
C08K 5/3477

Abstract:

The present invention discloses an organopolysiloxane prepolymer and a curable organopolysiloxane composition comprising the same, particularly used as an encapsulant in light emitting diodes.

US Patent:

20140220337, Aug 7, 2014

Filed:

Dec 23, 2013

Appl. No.:

14/138615

Inventors:

- Rocky Hill CT, US
Tadashi Takano - Irvine CA, US
Puwei Liu - San Marcos CA, US

Assignee:

Henkel US IP LLC - Rocky Hill CT

International Classification:

C09J 163/00
C09J 7/02

US Classification:

428355EP, 525 92 H, 525 92 C

Abstract:

Novel adhesive compositions that can be used in the die attach process. The adhesives include a curable resin component, a curing agent, and a block copolymer additive. The block copolymer additive has a glass transition temperature of at least about 40 C. The block copolymer additive improves the affinity of the adhesive composition to a hydrophilic substrate, such as a silicon wafer, during the die pickup process. Also disclosed is an assembly which includes a hydrophilic substrate and a layer of adhesive and methods of producing the assembly.