Victor C Liew

US Patent:

20070267730, Nov 22, 2007

Filed:

May 16, 2006

Appl. No.:

11/435345

Inventors:

Victor Liew - Pleasanton CA, US
Giles Humpston - Aylesbury, GB
Belgacem Haba - Saratoga CA, US

Assignee:

Tessera, Inc. - San Jose CA

International Classification:

H01L 23/02

US Classification:

257678

Abstract:

A wafer having a front surface and contacts exposed at the front surface is treated by forming electrically conductive risers projecting upwardly from the contacts as, for example, by electroless plating, and then applying a flowable material over the front surface of the device, around the risers, to form a dielectric layer with the risers exposed at a top surface of the dielectric layer facing away from the device. Traces extending over the top surface of the dielectric layer may be formed, and may be connected to at least some of the risers.

US Patent:

20060138626, Jun 29, 2006

Filed:

Dec 29, 2004

Appl. No.:

11/025432

Inventors:

Victor Liew - Fremont CA, US
Giles Humpston - San Jose CA, US

Assignee:

Tessera, Inc. - San Jose CA

International Classification:

H01L 23/06

US Classification:

257684000

Abstract:

A microelectronic package includes a microelectronic device, a unitary ceramic substrate, and a plurality of terminals. The microelectronic device has a front surface and a plurality of electrical contacts thereon. The substrate has first and second opposing surfaces. A window extends from a first opening on the first surface along a side wall to a second opening on the second surface. A conductive region may be provided on the side wall and/or the second substrate surface. The substrate is located between the device and the terminals such that the first surface of the substrate faces the front surface of the device and the first opening is aligned with at least one contact on the front device surface. Also provided are methods for producing microelectronic packages and wafer-scale assemblies.