Alan Grieve

US Patent:

6489380, Dec 3, 2002

Filed:

Apr 27, 2000

Appl. No.:

09/561852

Inventors:

Xiao-Qi Zhou - San Diego CA
Henry Wevick - Rialto CA
Nancy E. Iwamoto - Ramona CA
Shao Wei Li - San Diego CA
Alan Grieve - San Diego CA

Assignee:

Johnson Matthey Electronics, Inc. - Spokane WA

International Classification:

C08K 308

US Classification:

523427, 523428, 523434, 525113, 525122, 525524

Abstract:

Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Preferably the organic component further comprises a Bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.

US Patent:

6844379, Jan 18, 2005

Filed:

Nov 19, 2002

Appl. No.:

10/300493

Inventors:

Xiao-Qi Zhou - San Diego CA, US
Henry Wevick - Rialto CA, US
Nancy Iwamoto - Ramona CA, US
Shao Wei Li - San Diego CA, US
Alan Grieve - El Cajon CA, US

Assignee:

Honeywell International Inc. - Morristown NJ

International Classification:

C08K 308
C08L 6300
C08L 7900

US Classification:

523427, 523428, 523434, 525113, 525122, 525524

Abstract:

Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Preferably the organic component further comprises a Bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.

US Patent:

7888411, Feb 15, 2011

Filed:

Feb 19, 2008

Appl. No.:

12/071280

Inventors:

Matthew Wrosch - San Diego CA, US
Miguel Albert Capote - Carlsbad CA, US
Janet Fox, legal representative - Carlsbad CA, US
Alan Grieve - Springfield VA, US

Assignee:

Creative Electron, Inc. - Carlsbad CA

International Classification:

C08K 3/08
C08L 63/02

US Classification:

523459, 523457, 523458, 523460, 525533

Abstract:

A thermally conductive adhesive composition includes a powder of a high melting point metal or metal alloy, a powder of a low melting point metal or metal alloy, and a polymerizable fluxing polymer matrix composition having a polyepoxide polymer resin and a low-melting solid or liquid acid-anhydride and a polymer diluent or diluents with carbon carbon double bonds and/or functional hydroxyl groups. The ratio by weight of the low melting point powder to high melting point powder ranges from about 0. 50 to about 0. 80, and may range from about 0. 64 to about 0. 75, and may be 0. 665. Heretofore unpredicted substantially higher thermal conductivity improvements in performance have been found using these ratios of low melting point powder to high melting point powder.

US Patent:

20050148695, Jul 7, 2005

Filed:

Jan 13, 2005

Appl. No.:

11/035391

Inventors:

Xiao-Qi Zhou - San Diego CA, US
Henry Wevick - Rialto CA, US
Nancy Iwamoto - Ramona CA, US
Shao Li - San Diego CA, US
Alan Grieve - El Cajon CA, US

International Classification:

C08L063/00

US Classification:

523427000, 525528000, 156330000

Abstract:

Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a lewis acid catalyst. Preferably the organic component further comprises a bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.

US Patent:

20060194920, Aug 31, 2006

Filed:

Mar 30, 2004

Appl. No.:

10/550408

Inventors:

Miguel Capote - Carlsbad CA, US
Alan Grieve - San Diego CA, US

International Classification:

C08K 3/10
C08F 20/02

US Classification:

524779000, 524832000

Abstract:

Thermally conductive, sinterable, adhesive compositions, free of fugitive solvents, that include a powder of a relatively high melting point metal or metal alloy, a powder of a relatively low melting point metal or metal alloy powder and a thermally curable adhesive flux composition that comprises (i) a polymerizable fluxing agent; (ii) an inerting agent to react with the fluxing agent at elevated temperature, rendering it inert. The fluxing agent preferably comprises a compound with formula RCOOH, wherein R comprises a moiety having one or more polymerizable carbon-carbon double bonds. Optionally, the inventive compositions also include (a) a diluent that is capable of polymerizing with the fluxing agent's polymerizable carbon-carbon double bonds; (b) free radical initiators; (c) a curable resin; and (d) crosslinking agents and accelerators. The compositions can be applied directly onto the surfaces of devices to be joined mechanically and/or electrically and are ideally suited for semiconductor die attachment. During heating, the fluxing agent promotes wetting of the high melting point powder by the molten low melting point powder, causing liquid phase sintering of the powders. The fluxing agent also promotes wetting of the metallizations on the die and substrate by the molten low melting point alloy, providing improved thermal conductivity. Simultaneously, the fluxing agent itself crosslinks to further mechanically bond the adherent surfaces. The absence of fugitive solvents creates a void-free bond.

US Patent:

63126214, Nov 6, 2001

Filed:

Nov 12, 1999

Appl. No.:

9/439249

Inventors:

Jesse L. Pedigo - Chippewa Falls WI
Nancy E. Iwamoto - Ramona CA
Alan Grieve - San Diego CA
Xiao-Qi Zhou - San Diego CA

Assignee:

Johnson Matthey Electronics, Inc. - Spokane WA

International Classification:

H01B 100

US Classification:

252500

Abstract:

A via fill formulation including electrically and/or thermally conductive particulate filler, or non-conductive, electrically conductive polymer and a resin vehicle.

US Patent:

6057402, May 2, 2000

Filed:

Aug 12, 1998

Appl. No.:

9/133507

Inventors:

Xiao-Qi Zhou - San Diego CA
Henry Wevick - Rialto CA
Nancy E. Iwamoto - Ramona CA
Shao Wei Li - San Diego CA
Alan Grieve - San Diego CA

Assignee:

Johnson Matthey, Inc. - Valley Forge PA

International Classification:

C08K 308
C08L 6300
C08I 7900

US Classification:

525122

Abstract:

Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Preferably the organic component further comprises a Bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.

US Patent:

57445338, Apr 28, 1998

Filed:

Jun 4, 1997

Appl. No.:

8/868508

Inventors:

Nancy E. Iwamoto - Ramona CA
Jesse L. Pedigo - La Mesa CA
Shao Wei Li - San Diego CA
Alan Grieve - San Diego CA

Assignee:

Johnson Matthey, Inc. - Valley Forge PA

International Classification:

C08K 300

US Classification:

524440

Abstract:

Described is an adhesive composition suitable for bonding a semiconductor device to a substrate comprising about 60-90 wt. % particulate silver; about 10-40 wt. % of an adhesive material comprising at least one nonelectrically conductive organic compound; and a filler comprising at least one electrically conductive organic compound capable of forming a conductivity bridge between silver particles. The adhesive composition may additionally include at least one curing catalyst for the adhesive material, a flexibilizer to render the composition more flexible, a surfactant to facilitate contact with a substrate and/or a material to aid in adjusting the rheology of the composition.

Address:

8811 Bridle Wood Dr, Springfield, VA 22152

VIN:

1HGCM56357A033355

Make:

HONDA

Model:

ACCORD

Year:

2007