Vice President & General Counsel at Reis, Inc. - 2007-present Owner/Principal at Alex Simpson PLLC - 2005-2008 Partner at King & Spalding LLP - 2002-2004 Associate at Davis Polk & Wardwell - 1993-2002
Education:
Duke University School of Law Degree - J.D. Graduated - 1993 Dartmouth College Degree - B.A. - Government Graduated - 1989
A method and apparatus of planarizing substrates is disclosed. A planarizing web medium is prepared for planarizing substrates to reduce defect generation. The planarizing web has a planarizing region and preparing region defined thereon, wherein at least one portion of the preparing region is outside the planarizing region. The web medium is advanced to move one portion of the web out of the planarizing region and another portion into the planarizing region.
Defect-Minimizing, Topology-Independent Planarization Of Process Surfaces In Semiconductor Devices
Peter Lahnor - Dresden, DE Alexander Simpson - Warrenville IL, US
Assignee:
Infineon Technologies AG - Munich
International Classification:
H01L021/311
US Classification:
438697, 438493, 438496, 438694
Abstract:
A process for planarizing a process layer having structures and has been applied to a working surface of a semiconductor device, includes abrading the process layer down to the working surface using a polishing device. The working surface is planarized, and a defect density in the working surface is minimized and the polishing process is topology-independent.
Method Of Determining The Endpoint Of A Planarization Process
A method of determining the endpoint of a planarizing process is disclosed. An endpoint detection signal is selectively sampled from at least one predetermined location within a planarizing region defined on a planarizing web. Planarization is stopped when the endpoint criterion based on the endpoint detection signal is detected.