Andre B Mckenzie

age ~63

from Pleasanton, CA

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Andre Mckenzie Phones & Addresses

a***[email protected]

License #:

A5182223

Category:

Airmen

Method Of Fabricating A Memory Card Using Sip/Smt Hybrid Technology
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US Patent:

8318535, Nov 27, 2012
Filed:

Jun 28, 2007
Appl. No.:

11/769942
Inventors:

Ning Ye - San Jose CA, US
Robert C. Miller - San Jose CA, US
Cheemen Yu - Madison WI, US
Hem Takiar - Fremont CA, US
Andre McKenzie - Pleasanton CA, US
Assignee:

SanDisk Technologies Inc. - Plano TX
International Classification:

H01L 21/00
US Classification:

438106, 438108, 257E21506
Abstract:

A portable memory card formed from a multi-die assembly, and methods of fabricating same, are disclosed. One such multi-die assembly includes an LGA SiP semiconductor package and a leadframe-based SMT package both affixed to a PCB. The multi-die assembly thus formed may be encased within a standard lid to form a completed portable memory card, such as a standard SD™ card. Test pads on the LGA SiP package, used for testing operation of the package after it is fabricated, may also be used for physically and electrically coupling the LGA SiP package to the PCB.

Strip For Integrated Circuit Packages Having A Maximized Usable Area
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US Patent:

20070163109, Jul 19, 2007
Filed:

Dec 29, 2005
Appl. No.:

11/321426
Inventors:

Hem Takiar - Fremont CA, US
Manickam Thavarajah - San Jose CA, US
Ken Wang - San Francisco CA, US
Chih-Chin Liao - Changhua, TW
Andre McKenzie - Pleasanton CA, US
Shrikar Bhagath - San Jose CA, US
Han-Shiao Chen - Da-an Township, TW
Chin-Tien Chiu - Taichung City, TW
International Classification:

H01R 43/00
US Classification:

029825000
Abstract:

A strip on which a plurality of integrated circuit package outlines may be fabricated within a plurality of process tools. The strip includes one or more fiducial notches and/or guide pin notches formed in an outer edge of the strip. The one or more fiducial and/or guide pin notches allow a position of the strip to be identified within at least one process tool of the plurality of process tools. By forming the notches in the outer periphery of the strip, the usable area on the strip on which integrated circuit package outlines may be formed is increased. The strip may alternatively include conventional fiducial and/or guide pin holes, with the molding compound applied at least partially around the holes on one or more sides of the strip. The strip may further alternatively include fiducial holes filled with a translucent material that provides stability to the strip while allowing the strip to be used with an optical recognition sensor.

Memory Card Fabricated Using Sip/Smt Hybrid Technology
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US Patent:

20090001365, Jan 1, 2009
Filed:

Jun 28, 2007
Appl. No.:

11/769954
Inventors:

Ning Ye - San Jose CA, US
Robert C. Miller - San Jose CA, US
Cheemen Yu - Madison WI, US
Hem Takiar - Fremont CA, US
Andre McKenzie - Pleasanton CA, US
International Classification:

H01L 23/58
H01L 23/48
US Classification:

257 48, 257692, 257E2301, 257E21523
Abstract:

A portable memory card formed from a multi-die assembly, and methods of fabricating same, are disclosed. One such multi-die assembly includes an LGA SiP semiconductor package and a leadframe-based SMT package both affixed to a PCB. The multi-die assembly thus formed may be encased within a standard lid to form a completed portable memory card, such as a standard SD™ card. Test pads on the LGA SiP package, used for testing operation of the package after it is fabricated, may also be used for physically and electrically coupling the LGA SiP package to the PCB.

Method Of Fabricating A Memory Card Using Sip/Smt Hybrid Technology
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US Patent:

20130084677, Apr 4, 2013
Filed:

Nov 26, 2012
Appl. No.:

13/685288
Inventors:

SanDisk Technologies Inc. - Plano TX, US
Robert C. Miller - San Jose CA, US
Cheemen Yu - Madison WI, US
Hem Takiar - Fremont CA, US
Andre McKenzie - Pleasanton CA, US
Assignee:

SANDISK TECHNOLOGIES INC. - Plano TX
International Classification:

H01L 21/50
US Classification:

438106
Abstract:

A portable memory card formed from a multi-die assembly, and methods of fabricating same, are disclosed. One such multi-die assembly includes an LGA SiP semiconductor package and a leadframe-based SMT package both affixed to a PCB. The multi-die assembly thus formed may be encased within a standard lid to form a completed portable memory card, such as a standard SDTM card. Test pads on the LGA SiP package, used for testing operation of the package after it is fabricated, may also be used for physically and electrically coupling the LGA SiP package to the PCB.