Brandon N Sorbom

US Patent:

20210313104, Oct 7, 2021

Filed:

Jun 11, 2021

Appl. No.:

17/345194

Inventors:

- Cambridge MA, US
James Irby - Natick MA, US
Rui Vieira - Billerica MA, US
William Beck - Watertown MA, US
Daniel Brunner - Cambridge MA, US
Jeffrey Doody - Melrose MA, US
Martin Greenwald - Belmont MA, US
Zachary Hartwig - Jamaica Plain MA, US
Philip Michael - Cambridge MA, US
Robert Mumgaard - Boston MA, US
Alexey Radovinsky - Cambridge MA, US
Brandon N. Sorbom - Cambridge MA, US
John Wright - Melrose MA, US
Lihua Zhou - Woburn MA, US

International Classification:

H01F 6/06
H01F 6/04

Abstract:

Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.

US Patent:

20200402693, Dec 24, 2020

Filed:

Dec 23, 2019

Appl. No.:

16/959600

Inventors:

- Cambridge MA, US
Daniel BRUNNER - Cambridge MA, US
Robert S. GRANETZ - Newton MA, US
James IRBY - Natick MA, US
Rui VIEIRA - Billerica MA, US
William BECK - Watertown MA, US
Jeffrey DOODY - Melrose MA, US
Martin GREENWALD - Belmont MA, US
Zachary HARTWIG - Jamaica Plain MA, US
Philip MICHAEL - Cambridge MA, US
Robert MUMGAARD - Boston MA, US
Brandon N. SORBOM - Cambridge MA, US
John WRIGHT - Melrose MA, US
Lihua ZHOU - Woburn MA, US

International Classification:

H01F 6/06
H01F 6/04

Abstract:

Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.

US Patent:

20200211744, Jul 2, 2020

Filed:

Dec 27, 2018

Appl. No.:

16/233410

Inventors:

- Cambridge MA, US
Robert GRANETZ - Newton MA, US
James IRBY - Natick MA, US
Rui VIEIRA - Billerica MA, US
William BECK - Watertown MA, US
Daniel BRUNNER - Cambridge MA, US
Jeffrey DOODY - Melrose MA, US
Martin GREENWALD - Belmont MA, US
Zachary HARTWIG - Jamaica Plain MA, US
Philip MICHAEL - Cambridge MA, US
Robert MUMGAARD - Boston MA, US
Alexey RADOVINSKY - Cambridge MA, US
Brandon N. SORBOM - Cambridge MA, US
John WRIGHT - Melrose MA, US
Lihua ZHOU - Woburn MA, US

International Classification:

H01F 6/04
H01F 41/04
H01F 6/06
H01F 6/02

Abstract:

Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.