Brian T Ormond

US Patent:

6436793, Aug 20, 2002

Filed:

Dec 28, 2000

Appl. No.:

09/749692

Inventors:

Gary A. Kneezel - Webster NY
Daniel E. Kuhman - Fairport NY
Brian T. Ormond - Webster NY
Ackerman C. John - Rochester NY
Almon P. Fisher - Rochester NY
Allan F. Camp - Brockport NY
Lawrence H. Herko - Palmyra NY

Assignee:

Xerox Corporation - Stamford CT

International Classification:

H01L 2130

US Classification:

438458, 438 21

Abstract:

A method of forming a semiconductor structure from a first wafer and a second wafer. A pit or groove is formed in a lower surface of the first wafer. The lower surface of the first wafer is bonded to an upper surface of the second wafer. A groove is then formed on an upper surface of the first wafer, such that an opening is formed in the first wafer that exposes at least one alignment reference target on the upper surface of the second wafer. The bonded first wafer and second wafer is then diced using the exposed at least one alignment reference target to form a semiconductor structure.

US Patent:

61658138, Dec 26, 2000

Filed:

Apr 3, 1995

Appl. No.:

8/416127

Inventors:

Kraig A. Quinn - Webster NY
Brian T. Ormond - Webster NY
Josef E. Jedlicka - Rochester NY

Assignee:

Xerox Corporation - Stamford CT

International Classification:

H01L 2100
H01L 2146
H01L 2130

US Classification:

438 67

Abstract:

Semiconductor chips, such as photosensor arrays for a full-page-width scanner or printhead chips for a full-page-width ink-jet printer, are mounted on a substrate to maintain reasonably consistent spacing among adjacent chips. To remove a defective chip from the array, the substrate is urged evenly against a work surface defining a convex bow. Alternately, back-cuts are provided along abutting edges of the chips, and the silicon around these back-cuts can be sawed away to space defective chips from neighboring good chips.

US Patent:

61980935, Mar 6, 2001

Filed:

Nov 19, 1998

Appl. No.:

9/196394

Inventors:

Brian T. Ormond - Webster NY
Josef E. Jedlicka - Rochester NY
Thomas Grimsley - Fairport NY

Assignee:

Xerox Corporation - Stamford CT

International Classification:

G01J 350

US Classification:

250226

Abstract:

The present invention relates to semiconductor devices with a reduced filter thinning of outer photosites and a method for reducing the thinning of filter layers of the outer photosites. A semiconductor device includes a main surface including a plurality of photosites and bonding pads defined in the main surface, wherein the photosites include inner photosites and outer photosites. The semiconductor device further includes a clear layer deposited over the main surface exclusive of the bonding pads and outer photosites, and a first primary color filter layer deposited over at least first inner photosite and first outer photosite, the first primary color filter transmitting a primary color.

US Patent:

62012932, Mar 13, 2001

Filed:

Nov 19, 1998

Appl. No.:

9/196462

Inventors:

Brian T. Ormond - Webster NY
Josef E. Jedlicka - Rochester NY
Thomas Grimsley - Fairport NY
Paul A. Hosier - Rochester NY

Assignee:

Xerox Corporation - Stamford CT

International Classification:

H01L 23495

US Classification:

257667

Abstract:

The present invention relates to electro optical devices with a reduced filter thinning on the edge pixels and a method for reducing the thinning of filter layers on the pixels closest to the edge of an electro optical device such as a photosensitive chip, as would be used, for example, in a full-color digital copier or scanner. A semiconductor wafer includes a main surface defining a plurality of chip areas and tab regions separated by grooves, wherein the chip areas include inner photosites, outer photosites and bonding pads. A plurality of dams are deposited over the main surface in the tab regions, and a clear layer is deposited over the main surface exclusive of the bonding pads. Alternatively, a clear layer is deposited over the main surface exclusive of the bonding pads, and a plurality of tabs is then deposited in the tab regions on the main surface. A first primary color filter layer is deposited over at least first inner photosite and first outer photosite, and the first primary color filter layer transmits a primary color.

US Patent:

62221809, Apr 24, 2001

Filed:

Sep 25, 2000

Appl. No.:

9/669124

Inventors:

Brian T. Ormond - Webster NY
Josef E. Jedlicka - Rochester NY
Thomas Grimsley - Fairport NY

Assignee:

Xerox Corporation - Stamford CT

International Classification:

G01J 350

US Classification:

250226

Abstract:

The present invention relates to semiconductor devices with a reduced filter thinning of outer photosites and a method for reducing the thinning of filter layers of the outer photosites. A semiconductor device includes a main surface including a plurality of photosites and bonding pads defined in the main surface, wherein the photosites include inner photosites and outer photosites. The semiconductor device further includes a clear layer deposited over the main surface exclusive of the bonding pads and outer photosites, and a first primary color filter layer deposited over at least first inner photosite and first outer photosite, the first primary color filter transmitting a primary color.

US Patent:

51282828, Jul 7, 1992

Filed:

Nov 4, 1991

Appl. No.:

7/787445

Inventors:

Brian T. Ormond - Webster NY
Kraig A. Quinn - Webster NY
Paul A. Hosier - Rochester NY
Josef E. Jedlicka - Rochester NY

Assignee:

Xerox Corporation - Stamford CT

International Classification:

H01L 21302
H01L 21304

US Classification:

437226

Abstract:

A process for separating image sensor dies and the like from a wafer in which pairs of separation grooves separating each row of dies are formed in the active side of the wafer, with the tab between each groove pair being substantially equal to the width of the dicing blade, cutting a single bottom groove in the inactive side of the wafer opposite to and spanning each pair of separation grooves, and aligning the dicing blade with the midpoint of the wall of one groove in each pair of grooves so as to cut between the rows of dies. In a second embodiment, a two-pass separation process is enabled in which the tab between separation grooves is slightly larger than the width of the dicing blade, with the dicing blade first aligned with the midpoint of one separation groove to cut one row of dies from the wafer together with part of the tab, with the blade realigned with the midpoint of the other separate groove to cut a second row of dies and the remainder of the tab.

US Patent:

52197964, Jun 15, 1993

Filed:

Nov 4, 1991

Appl. No.:

7/787444

Inventors:

Kraig A. Quinn - Webster NY
Brian T. Ormond - Webster NY
Josef E. Jedlicka - Rochester NY

Assignee:

Xerox Corporation - Stamford CT

International Classification:

H01L 21302

US Classification:

437227

Abstract:

An improved process for forming individual dies having faces that allow the dies to be assembled against other like dies to form one and/or two dimensional scanning arrays with minimal chipping and fracturing wherein the active side of a wafer is etched to form separation grooves with the wall of the grooves adjoining the die presenting a relatively wide surface to facilitate sawing, wide grooves are cut in the inactive side of the wafer opposite each separation grooves, and the wafer cut by sawing along the separation grooves, the saw being located so that the side of the saw blade facing the die is aligned with the midpoint of the wide wall so that on sawing the bottom half of the wall and the remainder of the grooves are obliterated leaving the top half of the wall to prevent cracking and chipping during sawing.

US Patent:

56043627, Feb 18, 1997

Filed:

Feb 20, 1996

Appl. No.:

8/603513

Inventors:

Josef E. Jedlicka - Rochester NY
Brian T. Ormond - Webster NY
Debra S. Vent - Webster NY

Assignee:

Xerox Corporation - Stamford CT

International Classification:

H01L 27148

US Classification:

257233

Abstract:

In a photosensitive chip suitable for full-color imaging, separate photosites on the chip correspond to different primary colors in an original image. Each primary-color photosite is filtered with a polyimide doped to a particular primary color. The red-filtering layer and the blue-filtering layer are left on the non-photosensitive portions of the main surface of the chip, and together serve as a non-reflective area which prevents stray reflections from the chip. The chip is further provided with a base layer of infrared-filtering polyimide.