Chandrashekar S Krishnaswamy

US Patent:

7289867, Oct 30, 2007

Filed:

Jun 8, 2005

Appl. No.:

11/148092

Inventors:

Richard J. Markle - Austin TX, US
Chandrashekar Krishnaswamy - Austin TX, US

Assignee:

Advanced Micro Devices, Inc. - Austin TX

International Classification:

G06F 19/00

US Classification:

700121

Abstract:

The system includes a plurality of process modules and an independent module controller for each of the plurality of process modules that is adapted to control the process tools within each of the process modules. Each of the independent module controllers performs at least run-to-run control of the processing tools, yield management analysis, scheduling of materials provided to and sent from the process module, and movement of wafers within the process module. One method of the present invention involves providing a plurality of process modules, each of which has an independent module controller that is adapted to perform at least run-to-run control of the processing tools within the process module, yield management analysis, scheduling of materials, and movement of wafers within the process module. The independent module controller for each of the process modules controls the process tools within its respective process module that are employed in forming a portion of the integrated circuit device.

US Patent:

7444200, Oct 28, 2008

Filed:

Jun 1, 2007

Appl. No.:

11/756710

Inventors:

Peng Qu - Austin TX, US
Chandrashekar Krishnaswamy - Austin TX, US

Assignee:

Advanced Micro Devices, Inc. - Austin TX

International Classification:

G06F 19/00

US Classification:

700121

Abstract:

A method for scheduling preventative maintenance tasks includes defining a set of global time periods. Members of a set of preventative maintenance tasks associated with a plurality of machines for are scheduled execution during the global time periods based on capacities of the machines and production targets for the machines. A plurality of time slots is defined for a selected global period having a selected preventative maintenance task scheduled for execution therein. A selected time slot from the plurality of time slots is scheduled for performing the selected preventative maintenance task based on work in process levels for with the associated machine over the time slots.

US Patent:

7460920, Dec 2, 2008

Filed:

Feb 22, 2006

Appl. No.:

11/359110

Inventors:

Peng Qu - Austin TX, US
Michael A. Hillis - Austin TX, US
Dax Middlebrooks - Kyle TX, US
Farzad Sadjadi - Austin TX, US
Chandrashekar Krishnaswamy - Austin TX, US

Assignee:

Advanced Micro Devices, Inc. - Austin TX

International Classification:

G06F 19/00

US Classification:

700101, 700100

Abstract:

A method for processing workpieces in a process flow including a plurality of operations includes employing a fabrication simulation model of the process flow to determine an estimated completion time for a selected workpiece. The fabrication simulation model simulates the processing of the selected workpiece and other workpieces in the process flow through the plurality of operations. The priority of the selected workpiece is adjusted based on a comparison between a target completion time for the selected workpiece and the estimated completion time.

US Patent:

7623936, Nov 24, 2009

Filed:

Feb 16, 2006

Appl. No.:

11/356267

Inventors:

Peng Qu - Austin TX, US
Vijay Devarajan - Arlington TX, US
Michael A. Hillis - Austin TX, US
Dax Middlebrooks - Kyle TX, US
Farzad Sadjadi - Austin TX, US
Chandrashekar Krishnaswamy - Austin TX, US

Assignee:

Advanced Micro Devices, Inc. - Austin TX

International Classification:

G06F 19/00

US Classification:

700101, 700121

Abstract:

A method for determining priority of a selected workpiece in a process flow including a plurality of operations includes providing an objective function relating manufacturing losses to workpiece priority for the operations in the process flow. The objective function is solved to generate priority metrics for at least a subset of the operations remaining for the selected workpiece to allow completion of the selected workpiece in the process flow by a target completion due time.

US Patent:

20090157216, Jun 18, 2009

Filed:

Dec 14, 2007

Appl. No.:

11/956941

Inventors:

CHANDRASHEKAR KRISHNASWAMY - Austin TX, US
Steven C. Nettles - Johnson City TX, US
Larry D. Barto - Austin TX, US

International Classification:

G06F 19/00

US Classification:

700121

Abstract:

An automated, computer-implemented method for managing test wafers in an integrated, automated semiconductor manufacturing environment includes: managing a test wafer inventory; consuming inventoried test wafers in the automated process flow; and distributing the consumed test wafers according to their level of usage after an evaluation thereof. An automated, computer-implemented method for use in semiconductor manufacturing includes: monitoring test wafer utilization in an automated process flow; maintaining an inventory of test wafers of a plurality of different types responsive to the monitored utilization; and managing the test wafer utilization of the test wafer inventory. An automated, computer-implemented method for use in semiconductor manufacturing includes: kitting a lot of test wafers; instantiating a software-implemented test lot scheduling agent for the kitted lot, the agent being capable of: scheduling a build for the kitted lot; or scheduling the kitted lot as a resource for consumption in an automated process flow.

US Patent:

7257502, Aug 14, 2007

Filed:

Feb 28, 2006

Appl. No.:

11/363748

Inventors:

Peng Qu - Austin TX, US
Chandrashekar Krishnaswamy - Austin TX, US

Assignee:

Advanced Micro Devices, Inc. - Austin TX

International Classification:

H01L 21/00

US Classification:

702 83, 702 82, 702 84, 438 7, 438 8

Abstract:

A method for determining metrology sampling rates for workpieces in a process flow includes determining a current status of the process flow. Future processing of the workpieces in the process flow is simulated based on the current status of the process flow over a predetermined time horizon to predict sampling rates for the workpieces. During the simulating, sampling rules are implemented that consider capacity constraints of a metrology resource in the process flow. Actual workpieces in the process flow are sampled based on the predicted metrology sampling rates.