Christian Sylvio Rheault

US Patent:

6885104, Apr 26, 2005

Filed:

May 22, 2002

Appl. No.:

10/153451

Inventors:

Timothy W. Ellis - Doylestown PA, US
Nikhil Murdeshwar - Abington PA, US
Mark A. Eshelman - Lansdale PA, US
Christian Rheault - Willow Grove PA, US

Assignee:

Kulicke & Soffa Investments, Inc. - DE

International Classification:

H01L029/40
H01L021/94
B23K020/12
B23K031/02
B23K001/00

US Classification:

257762, 257778, 257784, 257785, 438612, 438613, 228 15, 228120, 228127, 22826231

Abstract:

Electronic packages with uninsulated portions of copper circuits protected with coating layers having thicknesses that are suitable for soldering without fluxing and are sufficiently frangible when being joined to another metal surface to obtain metal-to-metal contact between the surfaces.

US Patent:

7199475, Apr 3, 2007

Filed:

Mar 21, 2005

Appl. No.:

11/084985

Inventors:

Timothy W. Ellis - Doylestown PA, US
Nikhil Murdeshwar - Abington PA, US
Mark A. Eshelman - Lansdale PA, US
Christian Rheault - Willow Grove PA, US

Assignee:

Kulicke and Soffa Industries, Inc. - Fort Washington PA

International Classification:

H01L 23/52

US Classification:

257762, 257779, 257734

Abstract:

Electronic packages with uninsulated portions of copper circuits protected with coating layers having thicknesses that are suitable for soldering without fluxing and are sufficiently frangible when being joined to another metal surface to obtain metal-to-metal contact between the surfaces.

US Patent:

20020054955, May 9, 2002

Filed:

Oct 5, 1999

Appl. No.:

09/412542

Inventors:

TIMOTHY W. ELLIS - DOYLESTOWN PA, US
NIKHIL MURDESHWAR - ABINGTON PA, US
MARK A. ESHELMAN - LANDSDALE PA, US
CHRISTIAN RHEAULT - WILLOW GROVE PA, US

International Classification:

B05D005/12

US Classification:

427/096000

Abstract:

Methods for protecting the surface of an uninsulated portion of a copper circuit from environmental contamination detrimental to joining the surface to another metal surface, said method comprising the step of coating the surface with a layer of a ceramic material having a thickness that is suitable for soldering without fluxing and that is sufficiently frangible when the surfaces are being joined to obtain metal-to-metal contact between the surfaces. Coated electronic packages including semiconductor wafers are also disclosed.