Flipchip International
Senior Product Engineer
Sumco 2008 - 2013
Quality Engineer
Stmicroelectronics 1998 - 2008
Senior Process Engineer
Cfm 1996 - 1998
Process Engineer
Education:
Lehigh University 1994 - 1996
Master of Science, Masters, Materials Science, Engineering
Rensselaer Polytechnic Institute 1990 - 1994
Bachelors, Bachelor of Science, Engineering
Skills:
Silicon Spc Semiconductor Industry Semiconductors Plasma Etch Etching Process Engineering Manufacturing Failure Analysis Design of Experiments Materials Science Root Cause Analysis Metrology Etch Fmea Cvd Iso Thin Films Jmp Process Integration Lean Manufacturing Characterization Pvd Cmos 8D Problem Solving Environmental Monitoring Bicmos Ts16949 Auditing Quality System Change Control
SUMCO USA 2008 - 2013
Quality Engineer
STMicroelectronics 1998 - 2008
Sr. Process Engineer
CFM Technologies 1996 - 1998
Process Engineer
Education:
Lehigh University 1994 - 1996
M.S., Materials Science and Engineering
Rensselaer Polytechnic Institute 1990 - 1994
B.S., Materials Engineering
Skills:
Silicon Semiconductor Industry Etching Plasma Etch Materials Science Process Engineering SPC Semiconductors Design of Experiments Failure Analysis Metrology Thin Films FMEA JMP CVD Etch CMOS Process Integration Characterization Manufacturing Root Cause Analysis ISO TS16949 Auditing Quality System 8D Problem Solving Change Control Environmental Monitoring BiCMOS Lean Manufacturing PVD
Honor & Awards:
ST Corporate Recognitions
2001 Cleans Consolidation Team
2006 Chip Crack Reduction Team
2007 Shenzen Assembly Line Down Team
Green Belt Certification March 2008
Internal Lead Auditor for ISO TS16949