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Dan Youngner

from Minneapolis, MN

Dan Youngner Phones & Addresses

  • Minneapolis, MN

Work

  • Company:
    Polychromix sandia
    2000 to 2005
  • Position:
    Observer

Skills

Manufacturing Engineer • Manufacturing • Solutions • Automation • Industrial Automation

Industries

Industrial Automation

Resumes

Dan Youngner Photo 1

Scientist At Honeywell Process Solutions

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Location:
4600 Business Park Blvd, Anchorage, AK 99503
Industry:
Industrial Automation
Work:
Polychromix Sandia 2000 - 2005
Observer

Honeywell 2000 - 2005
Scientist at Honeywell Process Solutions
Skills:
Manufacturing Engineer
Manufacturing
Solutions
Automation
Industrial Automation

Us Patents

  • Thin-Film Deposition Methods And Apparatuses

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  • US Patent:
    7229669, Jun 12, 2007
  • Filed:
    Nov 13, 2003
  • Appl. No.:
    10/712444
  • Inventors:
    Dan W. Youngner - Maple Grove MN, US
    Leonard A. Hilton - Buffalo MN, US
  • Assignee:
    Honeywell International Inc. - Morristown NJ
  • International Classification:
    C23C 16/00
    B05D 1/36
  • US Classification:
    42725515, 427 971, 427402
  • Abstract:
    Described are structures useful in microelectronic or MEMS devices such as atomic clocks, sensors, and RF switches, wherein a first material is deposited onto a substrate to define a first material area of coverage and a second material is deposited over the first material area of coverage to define a second material area of coverage that includes the first material area of coverage and that additionally includes area that surrounds the first material area of coverage, such that the first material is enclosed by the second material over the entire area and past the edges of the first material.
  • Chip Scale Atomic Gyroscope

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  • US Patent:
    7359059, Apr 15, 2008
  • Filed:
    May 18, 2006
  • Appl. No.:
    11/419052
  • Inventors:
    Lisa M. Lust - Plymouth MN, US
    Dan W. Youngner - Maple Grove MN, US
  • Assignee:
    Honeywell International Inc. - Morristown NJ
  • International Classification:
    G01C 19/64
  • US Classification:
    356459
  • Abstract:
    A chip-scale atomic gyroscope and methods for sensing and measuring mechanical rotation of an object are disclosed. The chip-scale atomic gyroscope can include a vapor cell including a vapor cavity adapted to contain a vaporized source of alkali-metal atoms and noble gas atoms, a pump laser source adapted to produce a first laser beam along an optical pumping axis for optically pumping the alkali-metal atoms within the vapor cavity to an excited state, and a sense laser source adapted to produce a second laser beam along a sense axis transverse to the optical pumping axis for probing the polarization angle of the noble gas atoms within the vapor cavity. The pump and sense laser sources can each be connected to a servo mechanism, which can be configured to maintain the laser beams at a wavelength corresponding to the carrier wavelength of the alkali-metal atoms and a wavelength detuned from the carrier wavelength.
  • Mems Frequency Standard For Devices Such As Atomic Clock

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  • US Patent:
    20040084395, May 6, 2004
  • Filed:
    Aug 14, 2002
  • Appl. No.:
    10/218429
  • Inventors:
    Dan Youngner - Maple Grove MN, US
    James Detry - Plymouth MN, US
    J. Zook - Golden Valley MN, US
  • Assignee:
    Honeywell International Inc.
  • International Classification:
    C23F001/00
  • US Classification:
    216/002000
  • Abstract:
    A frequency standard has a cell formed in a cavity of a substrate. The cell contains a metal alkali vapor. The substrate has an optical path that intersects the cell. A light source is supported by the substrate and supplies light through the first optical path to the cell, and a light detector is supported by the substrate and receives light through the second optical path from the cell. The sealed vapor-filled cell is surrounded by a vacuum cavity enclosure. Bridges between the cell and the substrate may be used to thermally isolate the cell in the cavity and allow closed loop temperature control of the cell.
  • Equipment And Process For Creating A Custom Sloped Etch In A Substrate

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  • US Patent:
    20050133479, Jun 23, 2005
  • Filed:
    Dec 19, 2003
  • Appl. No.:
    10/739521
  • Inventors:
    Dan Youngner - Maple Grove MN, US
    James Detry - Plymouth MN, US
    John Starzynski - Brooklyn Park MN, US
  • International Classification:
    C23F001/00
  • US Classification:
    216041000
  • Abstract:
    Equipment and processes for creating a custom sloped etch in a substrate are disclosed. An illustrative process may include the steps of providing a substrate having a surface to be etched, providing a control layer on the surface of the substrate, forming a mask above the control layer, and then selectively etching each of the control layer and substrate at variable rates to form a sloped etch in the substrate.
  • Passive Analog Thermal Isolation Structure

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  • US Patent:
    20070205473, Sep 6, 2007
  • Filed:
    Mar 3, 2006
  • Appl. No.:
    11/276538
  • Inventors:
    Dan Youngner - Maple Grove MN, US
    Lisa Lust - Plymouth MN, US
  • Assignee:
    HONEYWELL INTERNATIONAL INC. - Morristown NJ
  • International Classification:
    H01L 29/82
  • US Classification:
    257414000
  • Abstract:
    A thermal isolation structure for use in passively regulating the temperature of a microdevice is disclosed. The thermal isolation structure can include a substrate wafer and a cap wafer defining an interior cavity, and a number of double-ended or single-ended thermal bimorphs coupled to the substrate wafer and thermally actuatable between an initial position and a deformed position. The thermal bimorphs can be configured to deform and make contact with the cap wafer at different temperatures, creating various thermal shorts depending on the temperature of the substrate wafer. When attached to a microdevice such as a MEMS device, the thermal isolation structure can be configured to maintain the attached device at a constant temperature or within a particular temperature range.
  • Microcontainer For Hermetically Encapsulating Reactive Materials

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  • US Patent:
    20080057619, Mar 6, 2008
  • Filed:
    Aug 30, 2006
  • Appl. No.:
    11/468527
  • Inventors:
    Dan W. Youngner - Maple Grove MN, US
    Son T. Lu - Plymouth MN, US
    Terry D. Stark - Golden Valley MN, US
    Elenita M. Chanhvongsak - Lakeville MN, US
  • Assignee:
    Honeywell International Inc. - Morristown NJ
  • International Classification:
    H01L 21/00
  • US Classification:
    438106
  • Abstract:
    A microcontainer device for micro-electro-mechanical systems such as atomic clocks is provided. The microcontainer device includes a substrate and a cavity in the substrate defined by a sidewall having an upper edge. The cavity is configured to hold a reactive material such as rubidium or cesium. A lid having a lower surface is configured to sealingly cover the cavity. A first hermetic material is disposed around an outer perimeter of the upper edge of the sidewall, and a second hermetic material is disposed around a perimeter of the lower surface of the lid. A sealing material chemically compatible with the reactive material is disposed around an inner perimeter of the upper edge of the sidewall adjacent to the first hermetic material.

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Dan Youngner Photo 2

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Bioethics Scholarship, Advocacy, and Politics...

BIOETHICS. INTERNATIONAL WORKSHOP, 12-13 septiembre 2012, CSIC, Madrid...

  • Category:
    Science & Technology
  • Uploaded:
    04 Mar, 2013
  • Duration:
    10m 33s

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