David C Broderick

US Patent:

6465729, Oct 15, 2002

Filed:

Mar 22, 2001

Appl. No.:

09/814880

Inventors:

Mark S. Granoff - Auburn NH
Phillip D. Demaine - Epping NH
David Broderick - Beverly MA
Stephen Ingemi - Melrose MA

Assignee:

University of New Hampshire - Durham NH

International Classification:

H05K 506

US Classification:

174 18, 174 14 BH, 174 5052, 174 5058, 174202

Abstract:

A method for producing an electrical feedthru wherein a thin liquid conductive film is deposited into a shallow trough of an insulating machinable substrate. The conductive film and substrate are fired and then the resulting bound composite is ground flush with the adjacent surface of the insulating machinable substrate. The surface cohesion of the fired composite, and the resulting high quality surface finish of the grinding operation, combined with an elastomeric seal, create low leakage barriers capable of supporting a pressure differential while allowing isolated electrical conduction across a pressure or vacuum envelope. The method produces a space saving feedthru which allows a high signal line density in a limited space, is relatively simple to assemble, allows for disassembly rework, can be âdesigned intoâ unique geometries of varied applications, and which has a single O-ring sealing across all traces. The resulting electrical trace can be soldered directly to a signal carrying wire, pin/socket, or attached via a contact spring or other mechanical attachment. No epoxies are used, thus avoiding thermal limitations and outgassing contamination.

US Patent:

62514717, Jun 26, 2001

Filed:

May 12, 1999

Appl. No.:

9/310435

Inventors:

Mark S. Granoff - Auburn NH
Phillip D. Demaine - Epping NH
David Broderick - Beverly MA
Stephen Ingemi - Melrose MA

Assignee:

University of New Hampshire - Durham NH

International Classification:

B05D 512

US Classification:

427 97

Abstract:

A method for producing an electrical feedthru wherein a thin liquid conductive film is deposited into a shallow trough of an insulating machinable substrate. The conductive film and substrate are fired and then the resulting bound composite is ground flush with the adjacent surface of the insulating machinable substrate. The surface cohesion of the fired composite, and the resulting high quality surface finish of the grinding operation, combined with an elastomeric seal, create low leakage barriers capable of supporting a pressure differential while allowing isolated electrical conduction across a pressure or vacuum envelope. The method produces a space saving feedthru which allows a high signal line density in a limited space, is relatively simple to assemble, allows for disassembly rework, can be `designed into` unique geometries of varied applications, and which has a single O-ring sealing across all traces. The resulting electrical trace can be soldered directly to a signal carrying wire, pin/socket, or attached via a contact spring or other mechanical attachnment. No epoxies are used, thus avoiding thermal limitations and outgassing contamination.

Author:

David Broderick

ISBN #:

1903464226