David E Kellerman

US Patent:

49943022, Feb 19, 1991

Filed:

Jun 27, 1989

Appl. No.:

7/372059

Inventors:

David Kellerman - Littleton MA

Assignee:

Digital Equipment Corporation - Maynard MA

International Classification:

B05D 512
C04B 3334

US Classification:

427 96

Abstract:

To produce a layer in a multi-layer circuit structure, a "green ceramic tape" (16) comprising a sheet of particles of ceramic, glass ceramic, or a glass/ceramic composite in an organic binder is applied to a ceramic substrate (12) on which conductive paths (14) have been deposited. A slurry of hollow microspheres (20) is then deposited onto the green ceramic tape (16), and pressure is applied to drive the spheres into the tape. A further tape layer (22) is then applied, and the resultant structure is fired.

US Patent:

47819685, Nov 1, 1988

Filed:

Feb 28, 1986

Appl. No.:

6/834912

Inventors:

David Kellerman - Littleton MA

Assignee:

Digital Equipment Corporation - Maynard MA

International Classification:

B32B 300
B32B 516
B32B 900
H05K 100

US Classification:

428209

Abstract:

A low dielectric constant material for use in the formation of thick film circuits such as VLSI devices. The material comprises a thick film insulation matrix of standard viscosity; a thick film organic vehicle; and a plurality of dry, hollow, glass microspheres. The insulation matrix, vehicle, and microspheres are thoroughly combined into a homogeneous material of standard viscosity.

US Patent:

51789345, Jan 12, 1993

Filed:

Jun 20, 1990

Appl. No.:

7/540847

Inventors:

David Kellerman - Littleton MA

Assignee:

Digital Equipment Corporation - Maynard MA

International Classification:

B32B 300

US Classification:

428209

Abstract:

To produce a layer in a multi-layer circuit structure, a "green ceramic tape" (16) comprising a sheet of particles of ceramic, glass ceramic, or a glass/ceramic composite in an organic binder is applied to a ceramic substrate (12) on which conductive paths (14) have been deposited. A slurry of hollow microspheres (20) is then deposited onto the green ceramic tape (16), and pressure is applied to drive the spheres into the tape. A further tape layer (22) is then applied, and the resultant structure is fired.

US Patent:

48658758, Sep 12, 1989

Filed:

Mar 21, 1988

Appl. No.:

7/170914

Inventors:

David Kellerman - Littleton MA

Assignee:

Digital Equipment Corporation - Maynard MA

International Classification:

B05D 512

US Classification:

427 96

Abstract:

A low dielectric constant material for use in the formation of thick film circuits such as VLSI devices. The material comprises a thick film insulation matrix of standard viscosity; a thick film organic vehicle; and a plurality of dry, hollow, glass microspheres. The insulation matrix, vehicle, and microspheres are thoroughly combined into a homogeneous material of standard viscosity.