Dennis T Mendoza

US Patent:

61246646, Sep 26, 2000

Filed:

May 1, 1998

Appl. No.:

9/071747

Inventors:

Don S. Mamayek - Mountiain View CA
Dennis Mendoza - Tracy CA
Veijo Suorsa - Sunnyvale CA

Assignee:

Scimed Life Systems, Inc. - Maple Grove MN

International Classification:

H01L 4108

US Classification:

310327

Abstract:

A transducer backing material includes a sticky epoxy resin containing tungsten particles and silver particles. A method of applying a backing material to a transducer includes pouring a mixture of epoxy resin, tungsten particles, and silver particles into a mold containing a layer of piezoelectric material, degassing the mixture, and curing the mixture at a pressure of approximately one atmosphere until the mixture dries.

US Patent:

63159333, Nov 13, 2001

Filed:

Mar 13, 2000

Appl. No.:

9/523777

Inventors:

Don S. Mamayek - Mountain View CA
Dennis Mendoza - Tracy CA
Veijo Suorsa - Sunnyvale CA

Assignee:

SciMed Life Systems, Inc. - Maple Grove MN

International Classification:

B29C 3502
B29C 3910
B29C 7060
B29C 7068
B29C 7088

US Classification:

264102

Abstract:

A transducer backing material includes a sticky epoxy resin containing tungsten particles and silver particles. A method of applying a backing material to a transducer includes pouring a mixture of epoxy resin, tungsten particles, and silver particles into a mold containing a layer of piezoelectric material, degassing the mixture, and curing the mixture at a pressure of approximately one atmosphere until the mixture dries.

US Patent:

61621781, Dec 19, 2000

Filed:

Jul 31, 1998

Appl. No.:

9/127252

Inventors:

Rizza A. Garcia - Newark CA
Dennis M. Mendoza - Tracy CA

Assignee:

Scimed Life Systems, Inc. - Maple Grove MN

International Classification:

A61B 812

US Classification:

600459

Abstract:

An ultrasonic transducer assembly includes a transducer mounted in a housing, the transducer including a piezoelectric element and respective matching and backing layers formed on the opposite sides thereof, the transducer mounted in the housing encapsulated with a non-conductive potting material. A portion of the matching layer is removed, e. g. , by etching, to expose a portion of an underlying electrode formed between the piezoelectric element and the matching layer. A portion of the non-conductive potting material between the etched portion of the matching layer and a signal wire disposed in the housing is also removed. The respective voided portions of the matching layer and non-conductive potting material are filled with an electrically conductive matching material to electrically couple the electrode, and, thus, the piezoelectric element, to the signal wire.

US Patent:

62872613, Sep 11, 2001

Filed:

Jul 21, 1999

Appl. No.:

9/362630

Inventors:

Veijo T. Suorsa - Sunnyvale CA
Dennis Mendoza - Tracy CA
Richard Bautista - Palo Alto CA

Assignee:

Scimed Life Systems, Inc. - Maple Grove MN

International Classification:

A61B 814

US Classification:

600459

Abstract:

The present invention provides ultrasound transducers, and imaging assemblies and catheters employing such transducers, that provide improved imaging capabilities. In one embodiment, an ultrasound imaging assembly (50) includes a housing having a distal end (56), a proximal end (57) and a longitudinal axis. A transducer element (54) is included having an outer face. The outer face has a first radius of curvature along a first axis and a second radius of curvature along a second axis. The transducer element is operably attached to the distal end to position the first axis to be generally parallel to the longitudinal axis to provide improved cross-plane resolution.