Don S. Mamayek - Mountiain View CA Dennis Mendoza - Tracy CA Veijo Suorsa - Sunnyvale CA
Assignee:
Scimed Life Systems, Inc. - Maple Grove MN
International Classification:
H01L 4108
US Classification:
310327
Abstract:
A transducer backing material includes a sticky epoxy resin containing tungsten particles and silver particles. A method of applying a backing material to a transducer includes pouring a mixture of epoxy resin, tungsten particles, and silver particles into a mold containing a layer of piezoelectric material, degassing the mixture, and curing the mixture at a pressure of approximately one atmosphere until the mixture dries.
Method Of Application Of A Transducer Backing Material
Don S. Mamayek - Mountain View CA Dennis Mendoza - Tracy CA Veijo Suorsa - Sunnyvale CA
Assignee:
SciMed Life Systems, Inc. - Maple Grove MN
International Classification:
B29C 3502 B29C 3910 B29C 7060 B29C 7068 B29C 7088
US Classification:
264102
Abstract:
A transducer backing material includes a sticky epoxy resin containing tungsten particles and silver particles. A method of applying a backing material to a transducer includes pouring a mixture of epoxy resin, tungsten particles, and silver particles into a mold containing a layer of piezoelectric material, degassing the mixture, and curing the mixture at a pressure of approximately one atmosphere until the mixture dries.
Rizza A. Garcia - Newark CA Dennis M. Mendoza - Tracy CA
Assignee:
Scimed Life Systems, Inc. - Maple Grove MN
International Classification:
A61B 812
US Classification:
600459
Abstract:
An ultrasonic transducer assembly includes a transducer mounted in a housing, the transducer including a piezoelectric element and respective matching and backing layers formed on the opposite sides thereof, the transducer mounted in the housing encapsulated with a non-conductive potting material. A portion of the matching layer is removed, e. g. , by etching, to expose a portion of an underlying electrode formed between the piezoelectric element and the matching layer. A portion of the non-conductive potting material between the etched portion of the matching layer and a signal wire disposed in the housing is also removed. The respective voided portions of the matching layer and non-conductive potting material are filled with an electrically conductive matching material to electrically couple the electrode, and, thus, the piezoelectric element, to the signal wire.
Veijo T. Suorsa - Sunnyvale CA Dennis Mendoza - Tracy CA Richard Bautista - Palo Alto CA
Assignee:
Scimed Life Systems, Inc. - Maple Grove MN
International Classification:
A61B 814
US Classification:
600459
Abstract:
The present invention provides ultrasound transducers, and imaging assemblies and catheters employing such transducers, that provide improved imaging capabilities. In one embodiment, an ultrasound imaging assembly (50) includes a housing having a distal end (56), a proximal end (57) and a longitudinal axis. A transducer element (54) is included having an outer face. The outer face has a first radius of curvature along a first axis and a second radius of curvature along a second axis. The transducer element is operably attached to the distal end to position the first axis to be generally parallel to the longitudinal axis to provide improved cross-plane resolution.
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Thomas Edison Elementary School Union City NJ 2000-2001
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Dennis Mendoza
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Dennis Mendoza
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Pampanga Agricultural College - Bachelor of Science in Information & Technology