Derek S Hinkle

US Patent:

6664480, Dec 16, 2003

Filed:

May 25, 2001

Appl. No.:

09/865336

Inventors:

Zane Drussel - Boise ID
Derek Hinkle - Boise ID

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

H05K 103

US Classification:

174255, 29846, 361771

Abstract:

A circuit board substrate assembly includes a generally planar circuit board substrate material having a longitudinal axis extending along a length of the substrate material between a first end and a second end thereof. The circuit board substrate material further has a first edge and a second edge extending along the length of the circuit board substrate material between the first end and the second end. A plurality of openings are defined in the substrate material. Each opening extends between a first distance from the first edge of the circuit board substrate and a second distance from the second edge of the circuit board substrate. Further, each opening separates adjacent circuit forming regions lying along the longitudinal axis and has first and second opposing end portions. The first end portions of each opening lie along a first singulation axis of the substrate material parallel to the longitudinal axis and the second end portions of each opening lie along a second singulation axis of the substrate material parallel to the longitudinal axis. Removing interconnect material along the first singulation axis and second singulation axis provide for singulation of the circuit forming regions and any circuits thereof.

US Patent:

6886247, May 3, 2005

Filed:

Dec 2, 2003

Appl. No.:

10/725981

Inventors:

Zane Drussel - Boise ID, US
Derek Hinkle - Boise ID, US

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

H05K003/02

US Classification:

29847, 29835, 29830, 29846, 29415, 29412, 174250, 361719

Abstract:

Methods to singulate circuit forming regions of a circuit board substrate assembly includes providing a plurality of circuit forming regions including at least one pair of adjacent circuit forming regions separated by at least one opening defined in substrate material between each pair of adjacent circuit forming regions. At least a portion of interconnection regions along singulation axes are removed to singulate the circuit forming regions.

US Patent:

6047470, Apr 11, 2000

Filed:

Aug 20, 1997

Appl. No.:

8/915159

Inventors:

Zane Drussel - Boise ID
Derek Hinkle - Boise ID

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

H05K 302

US Classification:

29847

Abstract:

A circuit board substrate assembly includes a generally planar circuit board substrate material having a longitudinal axis extending along a length of the substrate material between a first end and a second end thereof. The circuit board substrate material further has a first edge and a second edge extending along the length of the circuit board substrate material between the first end and the second end. A plurality of openings are defined in the substrate material. Each opening extends between a first distance from the first edge of the circuit board substrate and a second distance from the second edge of the circuit board substrate. Further, each opening separates adjacent circuit forming regions lying along the longitudinal axis and has first and second opposing end portions. The first end portions of each opening lie along a first singulation axis of the substrate material parallel to the longitudinal axis and the second end portions of each opening lie along a second singulation axis of the substrate material parallel to the longitudinal axis. Removing interconnect material along the first singulation axis and second singulation axis provide for singulation of the circuit forming regions and any circuits thereof.

US Patent:

62393804, May 29, 2001

Filed:

Aug 24, 1999

Appl. No.:

9/382304

Inventors:

Zane Drussel - Boise ID
Derek Hinkle - Boise ID

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

H05K 100
H05K 302

US Classification:

174250

Abstract:

A circuit board substrate assembly includes a generally planar circuit board substrate material having a longitudinal axis extending along a length of the substrate material between a first end and a second end thereof. The circuit board substrate material further has a first edge and a second edge extending along the length of the circuit board substrate material between the first end and the second end. A plurality of openings are defined in the substrate material. Each opening extends between a first distance from the first edge of the circuit board substrate and a second distance from the second edge of the circuit board substrate. Further, each opening separates adjacent circuit forming regions lying along the longitudinal axis and has first and second opposing end portions. The first end portions of each opening lie along a first singulation axis of the substrate material parallel to the longitudinal axis and the second end portions of each opening lie along a second singulation axis of the substrate material parallel to the longitudinal axis. Removing interconnect material along the first singulation axis and second singulation axis provide for singulation of the circuit forming regions and any circuits thereof.