Robert S. Chau - Beaverton OR Timothy E. Glassman - Portland OR Christopher G. Parker - Portland OR Matthew V. Metz - Hillsboro OR Lawrence J. Foley - Hillsboro OR Reza Arghavani - Aloha OR Douglas W. Barlage - Durham NC
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 21336
US Classification:
438287, 438591
Abstract:
A method for making a semiconductor device is described. That method comprises forming a high-k gate dielectric layer on a substrate. After forming a silicon nitride layer on the high-k gate dielectric layer, a gate electrode is formed on the silicon nitride layer.
Robert S. Chau - Beaverton OR, US Brian S. Doyle - Portland OR, US Jack Kavalieros - Portland OR, US Douglas Barlage - Durham NC, US Suman Datta - Portland OR, US Scott A. Hareland - Tigard OR, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L021/00 H01L021/84
US Classification:
438149, 438157, 438283
Abstract:
The present invention is a semiconductor device comprising a semiconductor body having a top surface and laterally opposite sidewalls formed on a substrate. A gate dielectric layer is formed on the top surface of the semiconductor body and on the laterally opposite sidewalls of the semiconductor body. A gate electrode is formed on the gate dielectric on the top surface of the semiconductor body and adjacent to the gate dielectric on the laterally opposite sidewalls of the semiconductor body.
Robert S. Chau - Beaverton OR, US Brian S. Doyle - Portland OR, US Jack Kavalieros - Portland OR, US Douglas Barlage - Durham NC, US Suman Datta - Portland OR, US Scott A. Hareland - Tigard OR, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L029/76 H01L029/94
US Classification:
257333, 257389, 257395
Abstract:
The present invention is a semiconductor device comprising a semiconductor body having a top surface and laterally opposite sidewalls formed on a substrate. A gate dielectric layer is formed on the top surface of the semiconductor body and on the laterally opposite sidewalls of the semiconductor body. A gate electrode is formed on the gate dielectric on the top surface of the semiconductor body and adjacent to the gate dielectric on the laterally opposite sidewalls of the semiconductor body.
Robert S. Chau - Beaverton OR, US Brian S. Doyle - Portland OR, US Jack Kavalieros - Portland OR, US Douglas Barlage - Durham NC, US Suman Datta - Portland OR, US Scott A. Hareland - Tigard OR, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 21/3205 H01L 21/4763
US Classification:
438591, 438595
Abstract:
The present invention is a semiconductor device comprising a semiconductor body having a top surface and laterally opposite sidewalls formed on a substrate. A gate dielectric layer is formed on the top surface of the semiconductor body and on the laterally opposite sidewalls of the semiconductor body. A gate electrode is formed on the gate dielectric on the top surface of the semiconductor body and adjacent to the gate dielectric on the laterally opposite sidewalls of the semiconductor body.
Robert S. Chau - Beaverton OR, US Brian S. Doyle - Portland OR, US Jack Kavalieros - Portland OR, US Douglas Barlage - Durham NC, US Suman Datta - Portland OR, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 21/00
US Classification:
438149, 438197, 438283
Abstract:
The present invention is a semiconductor device comprising a semiconductor body having a top surface and laterally opposite sidewalls formed on a substrate. A gate dielectric layer is formed on the top surface of the semiconductor body and on the laterally opposite sidewalls of the semiconductor body. A gate electrode is formed on the gate dielectric on the top surface of the semiconductor body and adjacent to the gate dielectric on the laterally opposite sidewalls of the semiconductor body.
Robert S. Chau - Beaverton OR, US Brian S. Doyle - Portland OR, US Jack Kavalieros - Portland OR, US Douglas Barlage - Durham NC, US Suman Datta - Portland OR, US Scott A. Hareland - Tigard OR, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 29/76 H01L 29/94
US Classification:
257333, 438149, 438283
Abstract:
The present invention is a semiconductor device comprising a semiconductor body having a top surface and laterally opposite sidewalls formed on a substrate. A gate dielectric layer is formed on the top surface of the semiconductor body and on the laterally opposite sidewalls of the semiconductor body. A gate electrode is formed on the gate dielectric on the top surface of the semiconductor body and adjacent to the gate dielectric on the laterally opposite sidewalls of the semiconductor body.
Robert S. Chau - Beaverton OR, US Brian S. Doyle - Portland OR, US Jack Kavalieros - Portland OR, US Douglas Barlage - Durham NC, US Suman Datta - Portland OR, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 29/80 H01L 31/112
US Classification:
257287, 257347, 438149
Abstract:
The present invention is a semiconductor device comprising a semiconductor body having a top surface and laterally opposite sidewalls formed on a substrate. A gate dielectric layer is formed on the top surface of the semiconductor body and on the laterally opposite sidewalls of the semiconductor body. A gate electrode is formed on the gate dielectric on the top surface of the semiconductor body and adjacent to the gate dielectric on the laterally opposite sidewalls of the semiconductor body.
Robert S. Chau - Beaverton OR, US Brian S. Doyle - Portland OR, US Jack Kavalieros - Portland OR, US Douglas Barlage - Durham NC, US Suman Datta - Portland OR, US Scott A. Hareland - Tigard OR, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 21/4763
US Classification:
438591, 438149, 257347
Abstract:
The present invention is a semiconductor device comprising a semiconductor body having a top surface and laterally opposite sidewalls formed on a substrate. A gate dielectric layer is formed on the top surface of the semiconductor body and on the laterally opposite sidewalls of the semiconductor body. A gate electrode is formed on the gate dielectric on the top surface of the semiconductor body and adjacent to the gate dielectric on the laterally opposite sidewalls of the semiconductor body.