Ernest J Funk

US Patent:

39478670, Mar 30, 1976

Filed:

Dec 21, 1970

Appl. No.:

5/099904

Inventors:

Edward F. Duffek - Cupertino CA
Ernest J. Funk - Cupertino CA
Alfred S. Jankowski - San Jose CA
Jack C. Lane - Saratoga CA
William L. Lehner - Los Altos Hills CA
Floyd F. Oliver - Los Altos CA
Mark R. Schneider - San Jose CA

Assignee:

Signetics Corporation - Sunnyvale CA

International Classification:

H01L 2348

US Classification:

357 70

Abstract:

Semiconductor devices containing integrated circuits are attached directly to external package leads by pressing simultaneously a plurality of groups of leads against bonding pads on a plurality of face-up semiconductor dice and heating the composite structures. Solder bumps on the bonding pads contain hard pedestals which prevent the overlying leads from being pushed into the faces of the semiconductor devices while the solder on the solder bumps melts to form the bonds between the leads and the underlying semiconductor dice. The process for carrying out this operation lowers significantly the cost of each packaged semiconductor device and the resulting structure is more reliable than structures of the prior art.

US Patent:

42783488, Jul 14, 1981

Filed:

Nov 26, 1979

Appl. No.:

6/097331

Inventors:

Ernest J. Funk - Cupertino CA
Thomas Wing - Woodland Hills CA
Jack C. Lane - Saratoga CA
Edward S. Westbrook - Saratoga CA

Assignee:

Quintel Corporation - San Jose CA

International Classification:

G03B 2760

US Classification:

355 73

Abstract:

A locking device for use in the chuck of an optical alignment and exposure apparatus is disclosed. The locking device comprises a plurality of flat, flexible blades fastened in pairs to a chuck plate in the chuck. Between each pair of blades there is a stationary element fastened to a base member in the chuck. Vacuum cups are fastened to the blades so that the blades are clamped tightly against the stationary element when the vacuum cups are evacuated.

US Patent:

42531110, Feb 24, 1981

Filed:

Sep 25, 1978

Appl. No.:

5/945710

Inventors:

Ernest J. Funk - Cupertino CA
Russell Union - Ben Lomond CA
Margaret M. Pratt - San Jose CA

Assignee:

GCA Corporation - Bedford MA

International Classification:

H04N 718

US Classification:

358101

Abstract:

In the bonding apparatus disclosed herein, possible misalignment of a semiconductor chip at the work station is sensed by first optically scanning the workpiece using a video scanning head mounted on a common X-Y carriage with the bonding head. A zone signal is generated which defines, within the scanned area, a limited zone of consideration. The video signal is evaluated as a function of the zone signal to measure the extent of coincidence between the zone and a target area on the workpiece. The placement and dimensions of the zone are progressively adjusted responsive to the evaluation and in accordance with a search algorithm to locate at least two target areas on the workpiece and the bonding head is then traversed to adjusted target coordinates derived from the optically located target areas.