Fukang Jiang

US Patent:

6511859, Jan 28, 2003

Filed:

Mar 10, 2000

Appl. No.:

09/523399

Inventors:

Fukang Jiang - Pasadena CA
Zhigang Han - Pasadena CA
Yu-Chong Tai - Pasadena CA

Assignee:

California Institute of Technology - Pasadena CA

International Classification:

H01L 2100

US Classification:

438 48, 438 24, 438 50, 438 52, 438 53, 438691, 438619, 438635

Abstract:

A combined IC/Mems process forms the IC parts first, and then forms the MEMS parts. One option forms a parylene overlayer, then forms a cavity under the parylene overlayer.

US Patent:

6639713, Oct 28, 2003

Filed:

Apr 25, 2001

Appl. No.:

09/843024

Inventors:

Chen-Wei Chiu - Pasadena CA
Aramais Avakian - Pasadena CA
Tom Tsao - Pasadena CA
Fukang Jiang - Pasadena CA
Jeff Dickson - Pasadena CA
Yu-Chong Tai - Pasadena CA

Assignee:

Umachines, Inc. - Pasadena CA

International Classification:

G02F 129

US Classification:

359318, 359198, 359223, 385 18

Abstract:

An apparatus at least partially intercepts a plurality of light beams propagating along a respective plurality of beam paths. The apparatus includes a single crystal silicon substrate and an array including a plurality of modules. Each module includes a reflector comprising single crystal silicon and a reflector surface lying in a reflector plane substantially perpendicular to the substrate surface. Each module further includes a reflector support which mounts the reflector to move substantially within the reflector plane with a displacement component along the surface normal direction of the substrate surface. Each module further includes a reflector driver responsive to electrical current to selectively move the reflector between a first position and a second position.

US Patent:

6709886, Mar 23, 2004

Filed:

Apr 25, 2001

Appl. No.:

09/843025

Inventors:

Chen-Wei Chiu - Pasadena CA
Tom Tsao - Pasadena CA
Fukang Jiang - Pasadena CA

Assignee:

Umachines, Inc. - Pasadena CA

International Classification:

H01L 2100

US Classification:

438 64, 438 57, 438 69

Abstract:

A method for fabricating a module for at least partially intercepting a light beam propagating along a beam path includes providing a single crystal silicon substrate with a first substrate surface and a second substrate surface. The method further includes forming a reflector support layer on the first substrate surface. The method further includes forming a support frame and at least one reflector by etching the substrate from the second substrate surface. The method further includes forming at least one electrical conduit on the reflector support layer. The method further includes forming a reflector support by etching the reflector support layer from the first substrate surface, the reflector support mechanically coupled to the support frame and the reflector, the reflector support movable such that the reflector is movable substantially perpendicularly to the first substrate surface.

US Patent:

6782755, Aug 31, 2004

Filed:

Jul 6, 2001

Appl. No.:

09/900743

Inventors:

Yu-Chong Tai - Pasadena CA
Yong Xu - Royal Oak MI
Fukang Jiang - Pasadena CA

Assignee:

California Institute of Technology - Pasadena CA
Schlumberger Technology Corporation - Ridgefield CT

International Classification:

G01L 916

US Classification:

73754, 73708, 73727

Abstract:

A surface-micromachined high-pressure sensor, formed by forming a cavity using a sacrificial layer. The sacrificial layer can be reflowed to make the edges of the cavity more rounded. The material that is used for the diaphragm can be silicon nitride, or multiple layers including silicon nitride and other materials. The pressure sensor is intended to be used in high pressure applications, e. g. pressure is higher than 6000, 10,000 or 30,000 P. S. I.

US Patent:

6953982, Oct 11, 2005

Filed:

May 9, 2000

Appl. No.:

09/567818

Inventors:

Yu-Chong Tai - Pasadena CA, US
Fukang Jiang - Pasadena CA, US
Chihming Ho - Brentwood CA, US

Assignee:

California Institute of Technology - Pasadena CA

International Classification:

H01L029/00

US Classification:

257522, 257664, 257738, 257792, 438 53, 438113

Abstract:

A flexible skin formed of silicon islands encapsulated in a polyimide film. The silicon islands preferably include a MEMS device and are connected together by a polyimide film (preferably about 1–100 μm thick). To create the silicon islands, silicon wafers are etched to a desirable thickness (preferably about 10–500 μm) by Si wet etching and then patterned from the back side by reactive ion etching (RIE).

US Patent:

D629503, Dec 21, 2010

Filed:

Sep 16, 2009

Appl. No.:

29/343629

Inventors:

Sean Caffey - Manhattan Beach CA, US
Fukang Jiang - Arcadia CA, US
Changlin Pang - Pasadena CA, US
Jason Shih - Yorba Linda CA, US
Jeffrey Brennan - Los Angeles CA, US
Raymond Peck - Los Angeles CA, US
Michelle Journey - Carlsbad CA, US

International Classification:

2401

US Classification:

D24108

US Patent:

8231608, Jul 31, 2012

Filed:

May 8, 2009

Appl. No.:

12/463251

Inventors:

Changlin Pang - Pasadena CA, US
Fukang Jiang - Pasadena CA, US
Jason Shih - Yorba Linda CA, US
Sean Caffey - Manhattan Beach CA, US
Mark Humayun - Glendale CA, US
Yu-Chong Tai - Pasedena CA, US

Assignee:

MiniPumps, LLC - Pasadena CA

International Classification:

A61K 9/22
A61M 5/142

US Classification:

6048911, 604500, 604132

Abstract:

Embodiments of an implantable electrolytic pump include a first expandable diaphragm and a second flexible diaphragm, and first and second chambers each for containing a fluid, wherein the first expandable diaphragm separates the first and second chambers and provides a fluid barrier therebetween, and the second chamber is formed between the first expandable diaphragm and the second flexible diaphragms. The pump may further include electrolysis electrodes within the first chamber for causing generation of a gas therein and to thereby expand the expandable diaphragm so that fluid is forced from the second chamber into a cannula.

US Patent:

8231609, Jul 31, 2012

Filed:

May 8, 2009

Appl. No.:

12/463254

Inventors:

Changlin Pang - Pasadena CA, US
Fukang Jiang - Pasadena CA, US
Jason Shih - Yorba Linda CA, US
Sean Caffey - Manhattan Beach CA, US
Mark Humayun - Glendale CA, US
Yu-Chong Tai - Pasedena CA, US

Assignee:

MiniPumps, LLC - Pasadena CA

International Classification:

A61K 9/22

US Classification:

6048911, 6048921

Abstract:

Embodiments of an implantable electrolytic pump include an electrolysis chamber, a drug chamber and an osmosis chamber, the osmosis chamber having a first portion in contact with the drug chamber and a second portion exposed to facilitate contact with a surrounding fluid. The pump further includes a cannula for conducting liquid from the drug chamber and electrolysis electrodes within the electrolysis chamber for causing generation of a gas therein, the electrolysis and drug chambers being in contact such that gas electrolysis within electrolysis chamber forces fluid from the drug chamber into the cannula, contact between the drug chamber and the osmosis chamber permitting fluid admitted into the osmotic chamber from the surrounding fluid to offset volume loss from the drug chamber and prevent buildup of vacuum pressure thereon.