Frank E. Andros - Binghamton NY Ghazaros K. Kerjilian - Vestal NY Bert E. Stevens - Vestal NY Reinhold E. Tomek - Endwell NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H05K 720
US Classification:
361384
Abstract:
Metallized ceramic modules (MC), which are mounted on printed circuit cards, and multi-layer ceramic modules (MLC), which are mounted on a printed circuit planar board, are combined into one hybrid package. An air cooling distribution system is provided wherein air is first caused to impinge against the multi-layer ceramic modules after which it is directed to flow serially across the metallized ceramic modules.