Grant H Wurdell from 4432 Tonkawood Rd, Hopkins, MN 55345, age 51, Phone: 9529253422

Medical Device Conductor Junctions
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US Patent:

7715926, May 11, 2010
Filed:

Apr 23, 2004
Appl. No.:

10/830597
Inventors:

Gregory A. Boser - Richfield MN, US
Ryan J. Collins - Minneapolis MN, US
Mark T. Marshall - Forest Lake MN, US
Grant H. Wurdell - Minnetonka MN, US
Assignee:

Medtronic, Inc. - Minneapolis MN
International Classification:

A61N 1/05
H01R 4/24
H01R 9/053
US Classification:

607122, 439394, 439578, 439909
Abstract:

A medical electrical lead includes a lead body, an inner assembly extending through the lead body, an outer insulative layer covering the inner assembly, and an electrode mounted outside the exterior surface of the outer insulative layer. The inner assembly includes an elongate inner structure forming a lumen, an elongate conductor extending along an outer surface of the inner structure, and a conductive fitting coupled to the elongate conductor.

Medical Device Conductor Junctions
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US Patent:

8271100, Sep 18, 2012
Filed:

Mar 18, 2010
Appl. No.:

12/726875
Inventors:

Gregory A. Boser - Richfield MN, US
Ryan J. Collins - Minneapolis MN, US
Mark T. Marshall - Forest Lake MN, US
Grant H. Wurdell - Minnetonka MN, US
Assignee:

Medtronic, Inc. - Minneapolis MN
International Classification:

A61N 1/05
H01R 4/24
H01R 9/053
US Classification:

607122, 439909
Abstract:

A medical electrical lead includes a lead body, an inner assembly extending throught the lead body, an outer insulative layer covering the inner assembly, and an electrode mounted outside the exterior surface of the outer insulative layer. The inner assembly includes an elongate inner structure forming a lumen, an elongate conductor extending along an outer surface of the inner structure, and a conductive fitting coupled to the elongate conductor.

Wasteless Laminator
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US Patent:

20040069401, Apr 15, 2004
Filed:

Jun 23, 2003
Appl. No.:

10/608583
Inventors:

Grant Wurdell - Minnetonka MN, US
Steven Fitzsimmons - Eden Prairie MN, US
International Classification:

C09J001/00
B32B031/00
B26D005/00
US Classification:

156/247000, 156/344000, 156/250000, 156/355000, 156/510000, 156/582000
Abstract:

A wasteless lamination mechanism that laminates a topcoat or lamina onto a substrate, without requiring cutting of the lamina down to the size of the substrate. The substrate is preferably a card, such as an identification card, a credit card, or other CR80 size card. A lamina to be laminated onto a substrate is separated from a web containing a plurality of lamina after lamination of the leading portion of the web to the substrate begins. As a result, the rollers of the lamination station can be used to transport the lamina, thereby avoiding the need for a separate transport mechanism for transporting the lamina to the lamination station.

Grant H Wurdell