A system and method is disclosed for bonding a substrate to a semiconductor die that is prone to curling when subjected to an elevated temperature in a solder reflow oven, for example, thereby improving the electrical and mechanical bonding for large dies, wafers, chips, and photovoltaic cells. In one embodiment, the substrate is adapted to curl to the same degree as the die to form a uniform gap between the substrate and die across the boundary there between. In another embodiment, solder used to bond the die and substrate is applied such that the volume deposited varies based on the expected gap between the die and substrate when heated to the melting temperature of the solder.
Apparatus And Method For Bonding Silicon Wafer To Conductive Substrate
A system and method is disclosed for bonding a substrate to a semiconductor die that is prone to curling when subjected to an elevated temperature in a solder reflow oven, for example, thereby improving the electrical and mechanical bonding for large dies, wafers, chips, and photovoltaic cells. In one embodiment, the substrate is adapted to curl to the same degree as the die to form a uniform gap between the substrate and die across the boundary there between. In another embodiment, solder used to bond the die and substrate is applied such that the volume deposited varies based on the expected gap between the die and substrate when heated to the melting temperature of the solder.
Andrew Homyk - South Pasadena CA, US Gregory A. Bone - Santa Monica CA, US
International Classification:
H01L 31/0232
US Classification:
136246, 136244, 136259
Abstract:
An automated tracking solar power collector is disclosed herein, the tracking solar powered collector includes at least one solar collector such as a solar concentrator and an actuator coupled to the at least one solar collector. The tracking solar power collector further includes a tracking controller configured to aim the at least one solar collector toward the sun with the actuator; and, a power controller configured to supply power to the actuator based on an energy collected by the at least one solar collector.
Gregory A. Bone - Santa Monica CA, US Jonathan M. Walton - Newport Beach CA, US
Assignee:
IQinVision, Inc. - San Juan Capistrano CA
International Classification:
H04N 5/225 H04N 5/228
US Classification:
34820711
Abstract:
A software development kit prioritizes certain aspects of an acquired image and introduces the prioritized aspects to a main processor. Alternatively, a coprocessor, or the coprocessor and the development kit, manipulate(s) the acquired image and introduce(s) the manipulated image to the processor. The reprogramming of either one of the development kit and the coprocessor may be initiated by either one of them or by the processor and the programming may be provided by the main processor. A central station and a gate array may also be individually reprogrammable by the main processor which sets up, programs and controls an intelligent imaging platform in accordance with the individual reprogrammings. A reprogramming of an audio acquisition stage may also be initiated by that stage and any of the other stages and the processor and may be provided by the processor. The audio information may be related to the acquired image.
Gregory Bone - Santa Monica CA, US Jonathan Walton - Newport Beach CA, US
International Classification:
H04N 5/232
US Classification:
348211300
Abstract:
A software development kit prioritizes certain aspects of an acquired image and introduces the prioritized aspects to a main processor. Alternatively, a coprocessor, or the coprocessor and the development kit, manipulate(s) the acquired image and introduce(s) the manipulated image to the processor. The reprogramming of either one of the development kit and the coprocessor may be initiated by either one of them or by the processor and the programming may be provided by the main processor. A central station and a gate array may also be individually reprogrammable by the main processor which sets up, programs and controls an intelligent imaging platform in accordance with the individual reprogramming. A reprogramming of an audio acquisition stage may also be initiated by that stage and any of the other stages and the processor and may be provided by the processor. The audio information may be related to the acquired image.
System And Method For Adhering Large Semiconductor Applications To Pcb
A system and method for reducing power losses in a semiconductor device, especially a photovoltaic cell. The system includes a semiconductor device that includes at least one conductive crossbar with a pattern and a substrate that includes similarly patterned supplemental crossbars. The crossbars are coated with the adhesive solder paste and superimposed on each other. The adhesive solder paste when heated forms a conductive path between the crossbars and the supplemental crossbars while simultaneously adhering the crossbars and the supplemental crossbars together. Thereafter an under-fill material is deposited into voids defined by gaps between the semiconductor device and the backplate.
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