Bradley P. Badke - Chandler AZ, US Michael L. Whitehead - Scottsdale AZ, US Walter J. Feller - Airdrie, CA Gregory J. Durnan - Tempe AZ, US
International Classification:
H04B 15/00
US Classification:
375350
Abstract:
An RF (e.g., GNSS) interference mitigation system and method uses a switchable bank of filters for selectively blocking signals in predetermined bandwidths based on detecting strong, interfering signals with an interference detection circuit including a sniffer antenna. A low-strength RF (e.g., GNSS) system can be combined with a spectrally-close high-strength, telecommunications receiver system for cooperative control. Alternatively, an RF receiver can detect tones, changes in DC bias or level changes to activate a filter selection switch.
A thermal increase system may include re-radiators disposed in a cavity for containing a load. Microwave energy may be generated by one or more microwave generation modules, and directed toward the cavity during operation of the thermal increase system, thereby creating an electromagnetic field in the cavity. A system controller may control switches coupled between the re-radiators and corresponding ground nodes to selectively activate and de-activate the re-radiators. The system controller may control a switch coupled between a pair of re-radiators to re-distribute the electromagnetic field in the cavity. A phase shifter may be disposed between a pair of re-radiators, which may provide a phase shift to energy passed between the re-radiators. The phase shifter may be a variable shifter that applies a variable phase shift to the energy according to commands received from the system controller.
Variable Time Division Multiplexing Of Electric Field Modes For Zonal Microwave Cooking
Embodiments include microwave cooking systems and methods of their operation, which are configured to heat food loads. Using a phased array, frequency and phase conditions and corresponding return losses are mapped in a cavity of the microwave cooking system. Using one or more thermal cameras, positions of E field maximums also are mapped in the cavity. The frequency and phase conditions are time division multiplexed so that heat maximums sum over a cooking cycle to provide a heating profile in a zone of interest.
Establishing Rf Excitation Signal Parameters In A Solid-State Heating Apparatus
- Austin TX, US Gregory J. Durnan - Tempe AZ, US Steven Y. Do - Chandler AZ, US
International Classification:
H05B 6/68 H05B 6/72 H05B 6/70 H05B 6/66
Abstract:
In a solid-state heating system, once a load with specific load characteristics has been placed in a heating cavity, a processing unit produces control signals that indicate an excitation signal frequency and one or more phase shifts, which constitute a combination of parameter values. Multiple microwave generation modules produce RF excitation signals characterized by the frequency and the phase shift(s). Multiple microwave energy radiators radiate, into the heating cavity, electromagnetic energy corresponding to RF excitation signals received from the microwave generation modules. Power detection circuitry takes reflected RF power measurements, and the processing unit determines a reflected power indication based on the measurements. The process is repeated for different combinations of the parameter values, and an acceptable combination of parameter values is determined and stored in a memory of the heating system. Acceptable combinations of parameter values similarly may be determined and stored for other loads with different load characteristics.
A semiconductor structure includes a packaged semiconductor device having at least one device, a conductive pillar, an encapsulant over the at least one device and surrounding the conductive pillar, wherein the conductive pillar extends from a first major surface to a second major surface of the encapsulant, and is exposed at the second major surface and the at least one device is exposed at the first major surface. The packaged device also includes a conductive shield layer on the second major surface of the encapsulant and on minor surfaces of the encapsulant and an isolation region at the second major surface of the encapsulant between the encapsulant and the conductive pillar such that the conductive shield layer is electrically isolated from the conductive pillar. The semiconductor structure also includes a radio-frequency connection structure over and in electrical contact with the conductive pillar at the second major surface of the encapsulant.
Establishing Rf Excitation Signal Parameters In A Solid-State Heating Apparatus
- Austin TX, US Gregory J. Durnan - Tempe AZ, US Steven Y. Do - Chandler AZ, US
International Classification:
H05B 6/68 H05B 6/66
Abstract:
In a solid-state heating system, once a load with specific load characteristics has been placed in a heating cavity, a processing unit produces control signals that indicate an excitation signal frequency and one or more phase shifts, which constitute a combination of parameter values. Multiple microwave generation modules produce RF excitation signals characterized by the frequency and the phase shift(s). Multiple microwave energy radiators radiate, into the heating cavity, electromagnetic energy corresponding to RF excitation signals received from the microwave generation modules. Power detection circuitry takes reflected RF power measurements, and the processing unit determines a reflected power indication based on the measurements. The process is repeated for different combinations of the parameter values, and an acceptable combination of parameter values is determined and stored in a memory of the heating system. Acceptable combinations of parameter values similarly may be determined and stored for other loads with different load characteristics.
- Austin TX, US Gregory J. Durnan - Tempe AZ, US Michael Watts - Scottsdale AZ, US
International Classification:
H01Q 1/24 H01Q 1/48 H01Q 1/36
Abstract:
A system with an integrated antenna includes a housing having a first surface and a second surface. The second surface of the housing defines a recess. A substrate is attached to first surface of the housing, and an amplifying device having an output node is on the substrate. An antenna is attached to the second surface of the housing over the recess. A conductive element is positioned through at least a portion of the housing. The conductive element electrically connects the antenna to the output node of the amplifying device. The conductive element is connected to the antenna at an antenna feed point over the recess in the housing.
A semiconductor structure includes a packaged semiconductor device having at least one device, a conductive pillar, an encapsulant over the at least one device and surrounding the conductive pillar, wherein the conductive pillar extends from a first major surface to a second major surface of the encapsulant, and is exposed at the second major surface and the at least one device is exposed at the first major surface. The packaged device also includes a conductive shield layer on the second major surface of the encapsulant and on minor surfaces of the encapsulant and an isolation region at the second major surface of the encapsulant between the encapsulant and the conductive pillar such that the conductive shield layer is electrically isolated from the conductive pillar. The semiconductor structure also includes a radio-frequency connection structure over and in electrical contact with the conductive pillar at the second major surface of the encapsulant.
Arizona State University
Principal R and D Electrical Engineer
Wolfspeed
Radio Frequency System Engineer
General Motors Dec 2018 - Jul 2019
Autonomous Antenna Engineer
Nxp Semiconductors Sep 2013 - Aug 2018
Senior Member of Technical Staff
Hemisphere Gnss Aug 2007 - Jul 2013
Principal Rf Design Engineer
Education:
Griffith University 1997 - 2004
Doctorates, Doctor of Philosophy, Philosophy
University of Tasmania 1992 - 1995
Bachelors, Electrical Engineering, Electronics
Kent State University
Masters
Royal Holloway, University of London
Master of Business Administration, Masters
Skills:
Rf Antennas Rf Circuits Rf Engineering Engineering Testing Antenna Design Program Management Systems Engineering Simulations Pcb Design Electronics Rf Design Electrical Engineering Engineering Management Analog Circuit Design Radio Frequency
Languages:
Japanese
Name / Title
Company / Classification
Phones & Addresses
Mr. Gregory Durnan Member
Acacia Information Technologies, LLC Computers-Service & Repair
2777 N Campbell Ave STE 207, Tucson, AZ 85719 5207510888
Gregory Durnan
Acacia Information Technologies, LLC Computers-Service & Repair
2777 N Campbell Ave STE 207, Tucson, AZ 85719 5207510888
Gregory J Durnan Owner
SALT RIVER RF LLC Business Services at Non-Commercial Site · Chemical Preparations, Nec, Nsk · Mfg Chemical Preparations
702 E Carver Rd, Tempe, AZ 85284
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