Gregory C Durnan

US Patent:

20130142295, Jun 6, 2013

Filed:

Dec 4, 2012

Appl. No.:

13/705018

Inventors:

Bradley P. Badke - Chandler AZ, US
Michael L. Whitehead - Scottsdale AZ, US
Walter J. Feller - Airdrie, CA
Gregory J. Durnan - Tempe AZ, US

International Classification:

H04B 15/00

US Classification:

375350

Abstract:

An RF (e.g., GNSS) interference mitigation system and method uses a switchable bank of filters for selectively blocking signals in predetermined bandwidths based on detecting strong, interfering signals with an interference detection circuit including a sniffer antenna. A low-strength RF (e.g., GNSS) system can be combined with a spectrally-close high-strength, telecommunications receiver system for cooperative control. Alternatively, an RF receiver can detect tones, changes in DC bias or level changes to activate a filter selection switch.

US Patent:

20200305244, Sep 24, 2020

Filed:

Mar 20, 2019

Appl. No.:

16/359900

Inventors:

- Austin TX, US
Gregory J. DURNAN - Tempe AZ, US

International Classification:

H05B 6/68
H05B 6/70
H05B 6/72

Abstract:

A thermal increase system may include re-radiators disposed in a cavity for containing a load. Microwave energy may be generated by one or more microwave generation modules, and directed toward the cavity during operation of the thermal increase system, thereby creating an electromagnetic field in the cavity. A system controller may control switches coupled between the re-radiators and corresponding ground nodes to selectively activate and de-activate the re-radiators. The system controller may control a switch coupled between a pair of re-radiators to re-distribute the electromagnetic field in the cavity. A phase shifter may be disposed between a pair of re-radiators, which may provide a phase shift to energy passed between the re-radiators. The phase shifter may be a variable shifter that applies a variable phase shift to the energy according to commands received from the system controller.

US Patent:

20190394841, Dec 26, 2019

Filed:

Jun 25, 2018

Appl. No.:

16/017889

Inventors:

- Austin TX, US
Gregory J. Durnan - Tempe AZ, US

International Classification:

H05B 6/68
H05B 6/64

Abstract:

Embodiments include microwave cooking systems and methods of their operation, which are configured to heat food loads. Using a phased array, frequency and phase conditions and corresponding return losses are mapped in a cavity of the microwave cooking system. Using one or more thermal cameras, positions of E field maximums also are mapped in the cavity. The frequency and phase conditions are time division multiplexed so that heat maximums sum over a cooking cycle to provide a heating profile in a zone of interest.

US Patent:

20190254127, Aug 15, 2019

Filed:

Apr 25, 2019

Appl. No.:

16/394080

Inventors:

- Austin TX, US
Gregory J. Durnan - Tempe AZ, US
Steven Y. Do - Chandler AZ, US

International Classification:

H05B 6/68
H05B 6/72
H05B 6/70
H05B 6/66

Abstract:

In a solid-state heating system, once a load with specific load characteristics has been placed in a heating cavity, a processing unit produces control signals that indicate an excitation signal frequency and one or more phase shifts, which constitute a combination of parameter values. Multiple microwave generation modules produce RF excitation signals characterized by the frequency and the phase shift(s). Multiple microwave energy radiators radiate, into the heating cavity, electromagnetic energy corresponding to RF excitation signals received from the microwave generation modules. Power detection circuitry takes reflected RF power measurements, and the processing unit determines a reflected power indication based on the measurements. The process is repeated for different combinations of the parameter values, and an acceptable combination of parameter values is determined and stored in a memory of the heating system. Acceptable combinations of parameter values similarly may be determined and stored for other loads with different load characteristics.

US Patent:

20190157216, May 23, 2019

Filed:

Jan 28, 2019

Appl. No.:

16/259396

Inventors:

- Austin TX, US
Gregory J. DURNAN - Tempe AZ, US

International Classification:

H01L 23/552
H01L 23/00
H01L 21/48
H01L 23/66
H01L 23/498
H01L 21/78
H01L 21/56
H01L 23/31

Abstract:

A semiconductor structure includes a packaged semiconductor device having at least one device, a conductive pillar, an encapsulant over the at least one device and surrounding the conductive pillar, wherein the conductive pillar extends from a first major surface to a second major surface of the encapsulant, and is exposed at the second major surface and the at least one device is exposed at the first major surface. The packaged device also includes a conductive shield layer on the second major surface of the encapsulant and on minor surfaces of the encapsulant and an isolation region at the second major surface of the encapsulant between the encapsulant and the conductive pillar such that the conductive shield layer is electrically isolated from the conductive pillar. The semiconductor structure also includes a radio-frequency connection structure over and in electrical contact with the conductive pillar at the second major surface of the encapsulant.

US Patent:

20180146518, May 24, 2018

Filed:

Nov 18, 2016

Appl. No.:

15/356211

Inventors:

- Austin TX, US
Gregory J. Durnan - Tempe AZ, US
Steven Y. Do - Chandler AZ, US

International Classification:

H05B 6/68
H05B 6/66

Abstract:

In a solid-state heating system, once a load with specific load characteristics has been placed in a heating cavity, a processing unit produces control signals that indicate an excitation signal frequency and one or more phase shifts, which constitute a combination of parameter values. Multiple microwave generation modules produce RF excitation signals characterized by the frequency and the phase shift(s). Multiple microwave energy radiators radiate, into the heating cavity, electromagnetic energy corresponding to RF excitation signals received from the microwave generation modules. Power detection circuitry takes reflected RF power measurements, and the processing unit determines a reflected power indication based on the measurements. The process is repeated for different combinations of the parameter values, and an acceptable combination of parameter values is determined and stored in a memory of the heating system. Acceptable combinations of parameter values similarly may be determined and stored for other loads with different load characteristics.

US Patent:

20180062241, Mar 1, 2018

Filed:

Sep 1, 2016

Appl. No.:

15/254227

Inventors:

- Austin TX, US
Gregory J. Durnan - Tempe AZ, US
Michael Watts - Scottsdale AZ, US

International Classification:

H01Q 1/24
H01Q 1/48
H01Q 1/36

Abstract:

A system with an integrated antenna includes a housing having a first surface and a second surface. The second surface of the housing defines a recess. A substrate is attached to first surface of the housing, and an amplifying device having an output node is on the substrate. An antenna is attached to the second surface of the housing over the recess. A conductive element is positioned through at least a portion of the housing. The conductive element electrically connects the antenna to the output node of the amplifying device. The conductive element is connected to the antenna at an antenna feed point over the recess in the housing.

US Patent:

20180005957, Jan 4, 2018

Filed:

Jun 30, 2016

Appl. No.:

15/199838

Inventors:

- AUSTIN TX, US
Gregory J. DURNAN - Tempe AZ, US

International Classification:

H01L 23/552
H01L 23/66
H01L 21/56
H01L 23/31
H01L 21/48
H01L 21/78
H01L 23/498

Abstract:

A semiconductor structure includes a packaged semiconductor device having at least one device, a conductive pillar, an encapsulant over the at least one device and surrounding the conductive pillar, wherein the conductive pillar extends from a first major surface to a second major surface of the encapsulant, and is exposed at the second major surface and the at least one device is exposed at the first major surface. The packaged device also includes a conductive shield layer on the second major surface of the encapsulant and on minor surfaces of the encapsulant and an isolation region at the second major surface of the encapsulant between the encapsulant and the conductive pillar such that the conductive shield layer is electrically isolated from the conductive pillar. The semiconductor structure also includes a radio-frequency connection structure over and in electrical contact with the conductive pillar at the second major surface of the encapsulant.