James M Bovatsek from 1436 Cherry Valley Dr, San Jose, CA 95125, age 52

Us Patents

Method For Laser Drilling A Counter-Tapered Through-Hole In A Material
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US Patent:

6642477, Nov 4, 2003
Filed:

Oct 23, 2001
Appl. No.:

10/060231
Inventors:

Rajesh S. Patel - Fremont CA
James M. Bovatsek - San Jose CA
Assignee:

Imra America, Inc. - Ann Arbor MI
International Classification:

B23K 2600
US Classification:

21912171, 2191217
Abstract:

A method of forming a through-hole which is counter-tapered relative to a drilling laser involves directing, along an incidence axis and onto an impingement location on a first surface of a material, a laser beam of sufficient energy to ablate the material, the incidence axis being offset from a normal to the first surface at the impingement location. The material and the laser beam are then relatively rotated, for at least 360Â, such that a through-hole having a larger exit opening than entrance opening is formed.

Femtosecond Laser Processing System With Process Parameters, Controls And Feedback
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US Patent:

7486705, Feb 3, 2009
Filed:

Mar 31, 2004
Appl. No.:

10/813269
Inventors:

Lawrence Shah - San Ramon CA, US
James M Bovatsek - San Jose CA, US
Alan Y Arai - Fremont CA, US
Tadashi Yamamoto - Fremont CA, US
Rajesh S. Patel - Fremont CA, US
Donald J. Harter - Ann Arbor MI, US
Assignee:

IMRA America, Inc. - Ann Arbor MI
International Classification:

H01S 3/10
US Classification:

372 25, 372 6
Abstract:

A femtosecond laser based laser processing system having a femtosecond laser, frequency conversion optics, beam manipulation optics, target motion control, processing chamber, diagnostic systems and system control modules. The femtosecond laser based laser processing system allows for the utilization of the unique heat control in micromachining, and the system has greater output beam stability, continuously variable repetition rate and unique temporal beam shaping capabilities.

Transparent Material Processing With An Ultrashort Pulse Laser
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US Patent:

7626138, Dec 1, 2009
Filed:

Sep 8, 2006
Appl. No.:

11/517325
Inventors:

James Bovatsek - San Jose CA, US
Alan Y. Arai - Fremont CA, US
Fumiyo Yoshino - Santa Clara CA, US
Assignee:

Imra America, Inc. - Ann Arbor MI
International Classification:

B23K 26/00
US Classification:

21912169, 21912168, 347224, 362559
Abstract:

Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials. The laser is focused near the interface of the materials, generating a high energy fluence at the region to be welded.

Femtosecond Laser Processing System With Process Parameters, Controls And Feedback
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US Patent:

7912100, Mar 22, 2011
Filed:

Dec 19, 2008
Appl. No.:

12/339744
Inventors:

Lawrence Shah - San Ramon CA, US
James M. Bovatsek - San Jose CA, US
Alan Y. Arai - Fremont CA, US
Tadashi Yamamoto - Fremont CA, US
Rajesh S. Patel - Fremont CA, US
Donald J. Harter - Ann Arbor MI, US
Assignee:

IMRA America, Inc. - Ann Arbor MI
International Classification:

H01S 3/30
US Classification:

372 6, 372 9, 372 25, 372 30
Abstract:

A femtosecond laser based laser processing system having a femtosecond laser, frequency conversion optics, beam manipulation optics, target motion control, processing chamber, diagnostic systems and system control modules. The femtosecond laser based laser processing system allows for the utilization of the unique heat control in micromachining, and the system has greater output beam stability, continuously variable repetition rate and unique temporal beam shaping capabilities.

Femtosecond Laser Processing System With Process Parameters, Controls And Feedback
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US Patent:

8279903, Oct 2, 2012
Filed:

Feb 11, 2011
Appl. No.:

13/025408
Inventors:

Lawrence Shah - Maitland CA, US
James M. Bovatsek - San Jose CA, US
Alan Y. Arai - Fremont CA, US
Tadashi Yamamoto - Fremont CA, US
Rajesh S. Patel - Fremont CA, US
Donald J. Harter - Ann Arbor MI, US
Assignee:

Imra America, Inc. - Ann Arbor MI
International Classification:

H01S 3/13
US Classification:

372 30, 372 20, 372 25, 372 33
Abstract:

A femtosecond laser based laser processing system having a femtosecond laser, frequency conversion optics, beam manipulation optics, target motion control, processing chamber, diagnostic systems and system control modules. The femtosecond laser based laser processing system allows for the utilization of the unique heat control in micromachining, and the system has greater output beam stability, continuously variable repetition rate and unique temporal beam shaping capabilities.

Methods And Systems For Laser Welding Transparent Materials With An Ultrashort Pulsed Laser
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US Patent:

8314359, Nov 20, 2012
Filed:

Oct 16, 2009
Appl. No.:

12/580762
Inventors:

James Bovatsek - San Jose CA, US
Alan Y. Arai - Fremont CA, US
Fumiyo Yoshino - Santa Clara CA, US
Assignee:

IMRA America, Inc. - Ann Arbor MI
International Classification:

B23K 26/24
B23K 26/32
US Classification:

21912164, 21912163
Abstract:

Methods and systems for ultrashort pulse laser processing of optically transparent materials are disclosed. At least one embodiment includes a method for welding materials with ultrashort laser pulses to create a bond through localized heating, at least one material being transparent at a laser wavelength. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials. The laser is focused near the interface of the materials, generating sufficiently high fluence at the region to be welded. This minimizes damage to the rest of the material and enables fine weld lines. In various implementations the laser is focused near the sub-surface interface between two materials, generating high fluence at the region proximate to the laser focus with minimal modification to the surrounding region, including areas above and below the laser beam waist.

Transparent Material Processing With An Ultrashort Pulse Laser
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US Patent:

8389891, Mar 5, 2013
Filed:

Oct 16, 2009
Appl. No.:

12/580739
Inventors:

James Bovatsek - San Jose CA, US
Alan Y. Arai - Fremont CA, US
Fumiyo Yoshino - Santa Clara CA, US
Assignee:

IMRA America, Inc. - Ann Arbor MI
International Classification:

B23K 26/38
B23K 26/40
US Classification:

21912169, 438463
Abstract:

Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials. The laser is focused near the interface of the materials, generating a high energy fluence at the region to be welded.

Transparent Material Processing With An Ultrashort Pulse Laser
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US Patent:

8530786, Sep 10, 2013
Filed:

Oct 1, 2009
Appl. No.:

12/571598
Inventors:

James Bovatsek - San Jose CA, US
Alan Y. Arai - Fremont CA, US
Fumiyo Yoshino - Santa Clara CA, US
Assignee:

IMRA America, Inc. - Ann Arbor MI
International Classification:

B23K 26/00
US Classification:

21912169, 21912168, 347224, 362559
Abstract:

Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials. The laser is focused near the interface of the materials, generating a high energy fluence at the region to be welded.