An apparatus includes a circuit having a heat-generating circuit component, and structure for guiding a two-phase coolant along a path which brings the coolant into direct physical contact with either the circuit component or a highly thermally conductive part which is thermally coupled to the circuit component. The coolant absorbs heat generated by the circuit component, at least part of the coolant changing from a first phase to a second phase in response to the heat absorbed from the circuit component, where the second phase is different from the first phase.
Thermal Management System And Method For Electronic Equipment Mounted On Coldplates
George F. Barson - Plano TX, US Richard M. Weber - Prosper TX, US James L. Haws - McKinney TX, US
Assignee:
Raytheon Company - Waltham MA
International Classification:
H05K 7/20
US Classification:
361699, 361711, 257712, 257714, 174 151, 165 804
Abstract:
According to an embodiment of the present invention, a thermal management system for electronic components includes a plastic coldplate having a mounting surface for mounting one or more electronic components, one or more passageways configured to have a fluid flow therethrough disposed within the plastic coldplate, and a highly conductive material disposed within the plastic coldplate and thermally coupled to the mounting surface. The highly conductive material is operable to transfer heat from the mounting surface to the fluid flow.
Method And Apparatus For Cooling With A Phase Change Material And Heat Pipes
A cooling apparatus () includes a housing defined by two aluminum parts () which are brazed to each other. A plurality of sector-shaped recesses () are provided within the housing, and collectively define a chamber having a plurality of ribs () extending therethrough. Each recess contains a sector-shaped piece of porous material (), which is brazed to surfaces of the housing parts. The remaining space within the chamber is filled with a phase change material. Each of the ribs has therein a respective radially extending opening () which contains a heat pipe (). Expansion accumulators () are mounted on the housing, and communicate with the chamber therein, in order to accommodate expansion of the phase change material within the chamber as the phase change material is heated.
Thermal Management System And Method For Electronic Equipment Mounted On Coldplates
George F. Barson - Plano TX, US Richard M. Weber - Prosper TX, US James L. Haws - McKinney TX, US
Assignee:
Raytheon Company - Waltham MA
International Classification:
H05K 7/20
US Classification:
361699, 361711, 361719, 257714, 174 151, 165 804
Abstract:
According to an embodiment of the present invention, a thermal management system for electronic components includes a plastic coldplate having a mounting surface for mounting one or more electronic components, one or more passageways configured to have a fluid flow therethrough disposed within the plastic coldplate, and a highly conductive material disposed within the plastic coldplate and thermally coupled to the mounting surface. The highly conductive material is operable to transfer heat from the mounting surface to the fluid flow.
Method And Apparatus For Humidity Control Within A Housing
James L. Haws - McKinney TX, US Ronald J. Richardson - Dallas TX, US
Assignee:
Raytheon Company - Waltham MA
International Classification:
F24F 11/00 B01F 3/02 G08B 21/00
US Classification:
236 44A, 236 44 R, 340602
Abstract:
An apparatus includes a housing having a chamber, having a replaceable part which has a moisture adsorption characteristic and which is in communication with the chamber, and having a humidity monitoring section which is responsive to the humidity within the chamber. A method of controlling humidity within a chamber in a housing includes: providing a replaceable part which has a moisture adsorption characteristic and which is in communication with the chamber, and monitoring the humidity within the chamber using a humidity monitoring section which is responsive to the humidity within the chamber.
Method And Apparatus For Efficient Heat Exchange In An Aircraft Or Other Vehicle
A heat exchanger extracts heat from a two-phase fluid coolant so that the coolant changes from a vapor state to a liquid state. Two valves have respective inlets which communicate with the coolant in the heat exchanger, and which are physically spaced from each other. Valve control structure responds to the presence of liquid at the inlet to either valve by opening that valve, so that the liquid coolant flows through the valve to a discharge section. A different feature involves a housing with a heat exchanger therein, the heat exchanger having a plurality of coolant conduits that are axially spaced. A flow of air travels axially within the housing, then flows transversely past the conduits to the other side thereof, and then resumes flowing axially on the other side of the conduits.
Method And Apparatus For Cooling With A Phase Change Material And Heat Pipes
A cooling apparatus () includes a housing defined by two aluminum parts () which are brazed to each other. A plurality of sector-shaped recesses (-) are provided within the housing, and collectively define a chamber having a plurality of ribs (-) extending therethrough. Each recess contains a sector-shaped piece of porous material (), which is brazed to surfaces of the housing parts. The remaining space within the chamber is filled with a phase change material. Each of the ribs has therein a respective radially extending opening (-) which contains a heat pipe (). Expansion accumulators () are mounted on the housing, and communicate with the chamber therein, in order to accommodate expansion of the phase change material within the chamber as the phase change material is heated.
Method And Apparatus For Moisture Control Within A Phased Array
An apparatus includes a circuit having a heat-generating circuit component, and structure for guiding a two-phase coolant along a path which brings the coolant into direct physical contact with either the circuit component or a highly thermally conductive part which is thermally coupled to the circuit component. The coolant absorbs heat generated by the circuit component, at least part of the coolant changing from a first phase to a second phase in response to the heat absorbed from the circuit component, where the second phase is different from the first phase.