James R Ronemus

US Patent:

6681482, Jan 27, 2004

Filed:

Feb 2, 2000

Appl. No.:

09/496989

Inventors:

David Lischner - Allentown PA
Raymond J. Nika - Whitehall PA
James Robert Ronemus - Lehighton PA

Assignee:

Agere Systems, Inc. - Allentown PA

International Classification:

H05K 334

US Classification:

29840, 29834, 29835, 29874, 29DIG 37

Abstract:

A method of connecting a heatspreader to an integrated circuit device that is connected to a substrate in a flip-chip configuration includes forming a heatspreader from a single flat sheet of metal. The heatspreader has a heatspreader plate and a plurality of legs. The legs are flat plate portions substantially parallel to the heatspreader plate. A first thermal interface material is used to connect the heatspreader plate to a non-active side of the integrated circuit device. A second thermal interface material is used to connect each of the plurality of legs to the substrate.

US Patent:

61181773, Sep 12, 2000

Filed:

Nov 17, 1998

Appl. No.:

9/193832

Inventors:

David Lischner - Allentown PA
Raymond J. Nika - Whitehall PA
James Robert Ronemus - Lehighton PA

Assignee:

Lucent Technologies, Inc. - Murray Hill NJ

International Classification:

H01L 2310
H01L 2334
H01L 2312

US Classification:

257706

Abstract:

A circuit board assembly includes an integrated circuit package. A first substrate has first and second surfaces. Each surface of the first substrate has a plurality of terminal pads. An integrated circuit device has first and second faces. The first face has a plurality of electrical interconnections to the terminal pads in the first surface of the first substrate. A heatspreader plate has a plurality of legs. For example, the heatspreader may be shaped like a table with four legs. The heatspreader may be formed of copper. The second face of the integrated circuit device is connected to the heatspreader plate by a first thermal interface material. Each of the plurality of legs is connected to the first surface of the first substrate by a second thermal interface material. The first and second thermal interface materials may both be, for example, a conductive silver-filled epoxy. The heatspreader provides an open package that is easily cleaned and drained.

US Patent:

44534140, Jun 12, 1984

Filed:

Jun 3, 1982

Appl. No.:

6/384446

Inventors:

James R. Ronemus - Lehighton PA
Lowell Sentman - Catasauqua PA
William R. Wanesky - Wescosville PA

Assignee:

AT&T Technologies, Inc. - New York NY

International Classification:

G01N 308

US Classification:

73827

Abstract:

The bond strength of electrical leads (12) bonded to a device (13), such as a silicon integrated circuit chip, is tested by mounting the device (13) onto a pedestal (22) and then pulling on such lead with a freely manipulatable grasping tool (52). The pedestal (22) is coupled to a load sensitive mechanism, such as a simple balance arm (19), or a movable element (21) coupled to a load cell (56). Such mechanism is adjusted to register that part of the pulling force exerted by the grasping tool (52), which is transmitted through the interface between the lead (12) and the device (13).