Jon T Clinton

US Patent:

6432282, Aug 13, 2002

Filed:

Mar 2, 2000

Appl. No.:

09/518182

Inventors:

Shamouil Shamouilian - San Jose CA
Anada H. Kumar - Milpitas CA
Donald J. Olgado - Palo Alto CA
Joseph J. Stevens - San Jose CA
Ricardo Leon - Palo Alto CA
Jon Clinton - San Jose CA

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

B23H 704

US Classification:

2042281, 2042298, 2042302, 2042308, 2042861

Abstract:

The present invention relates to a device that supplies electricity to a substrate. In one embodiment, the device includes multiple contacts, a current sensor, and a current regulator. The current sensor is attached to each of the plurality of contacts to sense their electric current. A current regulator controls current applied to each of the multiple contacts in response to the current sensor. In another embodiment, a compliant ridge is formed about the periphery of each contact to seal the contact from undesired chemicals.

US Patent:

20020066664, Jun 6, 2002

Filed:

Oct 26, 2001

Appl. No.:

10/039808

Inventors:

Shamouil Shamouilian - San Jose CA, US
Anada Kumar - Milpitas CA, US
Donald Olgado - Palo Alto CA, US
Joseph Stevens - San Jose CA, US
Ricardo Leon - Palo Alto CA, US
Jon Clinton - San Jose CA, US

Assignee:

Applied Materials, Inc.

International Classification:

B23H003/02

US Classification:

204/228100

Abstract:

The present invention relates to a device that supplies electricity to a substrate. In one embodiment, the device includes multiple contacts, a current sensor, and a current regulator. The current sensor is attached to each of the plurality of contacts to sense their electric current. A current regulator controls current applied to each of the multiple contacts in response to the current sensor. In another embodiment, a compliant ridge is formed about the periphery of each contact to seal the contact from undesired chemicals.

US Patent:

20070079936, Apr 12, 2007

Filed:

Jun 2, 2006

Appl. No.:

11/445559

Inventors:

Maocheng Li - Fremont CA, US
John Holland - San Jose CA, US
Patrick Leahey - San Jose CA, US
Xueyu Qian - San Jose CA, US
Michael Barnes - San Ramon CA, US
Jon Clinton - Irvine CA, US
You Wang - Cupertino CA, US
Nianci Han - San Jose CA, US

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

B31B 1/60
C23F 1/00
C23C 16/00

US Classification:

156345480, 11872300R, 156060000

Abstract:

A bonded multi-layer RF window may include an external layer of dielectric material having desired thermal properties, an internal layer of dielectric material exposed to plasma inside a reaction chamber, and an intermediate layer of bonding material between the external layer and the internal layer. Heat produced by the chemical reaction inside the chamber and by the transmission of RF energy through the window may be conducted from the internal layer to the external layer, which may be cooled during a semiconductor wafer manufacturing process. A bonded multi-layer RF window may include cooling conduits for circulating coolant to facilitate cooling of the internal layer; additionally or alternatively, gas distribution conduits and gas injection apertures may be included for delivering one or more process gases into a reaction chamber. A system including a plasma reaction chamber may employ the inventive bonded multi-layer RF window.

US Patent:

6055150, Apr 25, 2000

Filed:

Nov 6, 1998

Appl. No.:

9/188038

Inventors:

Jon Clinton - San Jose CA
Mark Contreras - San Jose CA
Anand H. Kumar - Milpitas CA
Shamouil Shamouilian - San Jose CA
You Wang - Sunnyvale CA
Surinder Bedi - Fremont CA

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

H02N 1300

US Classification:

361234

Abstract:

A failure resistant electrostatic chuck 20 for holding a substrate 35 during processing of the substrate 35 comprises one or more electrodes 25 covered by an insulator 30, the electrodes 25 capable of electrostatically holding a substrate 35 when a voltage is applied thereto. An electrical power bus 40 comprises one or more output terminals 45 that conduct voltage to the electrodes 25. The fuses 50 are positioned in hollow cavities 55 in the insulator 30, and electrically connect the electrodes 25 in series to the output terminals 45 of the power bus 40. Each fuse 50 can electrically disconnect an electrode 25 from an output terminal 45 when the insulator 30 covering the electrode 25 punctures and exposes the electrode 25 to a plasma process environment thereby causing a plasma current discharge to flow through the fuse 50.

US Patent:

59868759, Nov 16, 1999

Filed:

Jan 29, 1998

Appl. No.:

9/015802

Inventors:

Arik Donde - Cupertino CA
Hyman J. Levinstein - Berkeley Heights NJ
Robert W. Wu - Pleasanton CA
Andreas Hegedus - San Francisco CA
Edwin C. Weldon - Los Gatos CA
Shamouil Shamouilian - San Jose CA
Jon T. Clinton - San Jose CA
Surinder S. Bedi - Fremont CA

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

H02N 1300

US Classification:

361234

Abstract:

A puncture resistant electrostatic chuck (20) is described. The chuck (20) comprises at least one electrode (25); and a composite insulator (30) covering the electrode. The composite insulator comprises a matrix material having a conformal holding surface (50) capable of conforming to the substrate (35) under application of an electrostatic force generated by the electrode to reduce leakage of heat transfer fluid held between the substrate and the holding surface. A hard puncture resistant layer, such a layer of fibers or an aromatic polyamide layer, is positioned below the holding surface (50) and is sufficiently hard to increase the puncture resistance of the composite insulator.

US Patent:

62786008, Aug 21, 2001

Filed:

Jan 13, 1999

Appl. No.:

9/231318

Inventors:

Shamouil Shamouilian - San Jose CA
Arnold Kholodenko - San Francisco CA
Semyon Kats - San Francisco CA
Semyon Sherstinsky - San Francisco CA
Jon Clinton - San Jose CA
Surinder Bedi - Fremont CA

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

H01G 2300

US Classification:

361234

Abstract:

Apparatus for supporting a workpiece and method of making same. The apparatus comprises a flex circuit laminated to a contoured support pedestal. The flex circuit includes a reinforced layer to improve puncture resistance of the flex circuit. The top surface of the chuck has a contoured topography that is achieved by machining the upper surface of the pedestal prior to lamination of the flex circuit to the pedestal. The contoured topography improves the flow of backside cooling gas resulting in a more uniform wafer temperature profile.

US Patent:

60943343, Jul 25, 2000

Filed:

Mar 2, 1999

Appl. No.:

9/261083

Inventors:

Surinder S. Bedi - Fremont CA
Shamouil Shamouilian - San Jose CA
Syed H. Askari - Santa Clara CA
Arnold Kholodenko - San Francisco CA
Jon T. Clinton - San Jose CA
Alexander M. Veytser - Mountain View CA
You Wang - Cupertino CA

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

H01G 2300

US Classification:

361234

Abstract:

An electrostatic chuck 20 for holding a substrate 25 in a process chamber 30 comprises an electrostatic member 115 comprising a polymer 120 covering an electrode 125, the polymer 120 having a receiving surface 135 for receiving the substrate 25. A heater 130 abutting the polymer 120 is provided to heat the substrate 25 during processing of the substrate 25. The heater 130 has a resistance that is sufficiently low to heat the substrate 25 without causing excessive thermal degradation of the polymer 120.

US Patent:

57294232, Mar 17, 1998

Filed:

Nov 25, 1996

Appl. No.:

8/755716

Inventors:

Arik Donde - Austin TX
Hyman J. Levinstein - Berkeley Heights NJ
Robert W. Wu - Pleasanton CA
Andreas Hegedus - San Francisco CA
Edwin C. Weldon - Los Gatos CA
Shamouil Shamouilian - San Jose CA
Jon T. Clinton - San Jose CA
Surinder S. Bedi - Fremont CA

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

H02N 1300

US Classification:

361234

Abstract:

A puncture resistant electrostatic chuck (20) is described. The chuck (20) comprises at least one electrode (25); and a composite insulator (30) covering the electrode. The composite insulator comprises a matrix material having a conformal holding surface (50) capable of conforming to the substrate (35) under application of an electrostatic force generated by the electrode to reduce leakage of heat transfer fluid held between the substrate and the holding surface. A hard puncture resistant layer, such a layer of fibers or an aromatic polyamide layer, is positioned below the holding surface (50) and is sufficiently hard to increase the puncture resistance of the composite insulator.

Author:

Jon Clinton

ISBN #:

0589006274

Author:

Jon Clinton

ISBN #:

0589070355

Author:

Jon Clinton

ISBN #:

0589070819

Author:

Jon Clinton

ISBN #:

0589071025