Joseph J Lalak

US Patent:

40186385, Apr 19, 1977

Filed:

Aug 22, 1975

Appl. No.:

5/606967

Inventors:

Barry M. Singer - New York NY
Joseph J. Lalak - Briarcliff Manor NY

Assignee:

North American Philips Corporation - New York NY

International Classification:

C23F 102

US Classification:

156626

Abstract:

A method of reducing the thickness of a wafer of fragile material, e. g. pyroelectric material, by placing the wafer, supported only at its rim, in a holder filled with a non-corrosive liquid. The holder with the exposed surface of wafer is placed in an etch bath to reduce the thickness of the wafer. The wafer is removed from the etch bath, without removing it from the holder, to measure its thickness, using its index of refraction, which is facilitated by the presence of a bubble in the non-corrosive liquid.

US Patent:

43494102, Sep 14, 1982

Filed:

Oct 27, 1980

Appl. No.:

6/200714

Inventors:

Edward H. Stupp - Spring Valley NY
Joseph Lalak - Briarcliff Manor NY

Assignee:

North American Philips Corporation - New York NY

International Classification:

C23F 104

US Classification:

156654

Abstract:

A method of manufacturing a target from a pyroelectric material exhibiting ferroelectric domains includes the steps of poling the target in a uniform direction and then etching a central region of the target to produce a thin target with a thick support rim around an outer edge. An apparatus for poling wafers of pyroelectric material includes two electrodes spaced a fixed distance apart by an electrode separator. The pyroelectric material is mounted in the separator at a fixed position between the electrodes. An electrically insulating liquid dielectric fills the spaces between the electrodes and the pyroelectric material in order to maximize the electric field across the material. A pyroelectric target produced by poling prior to etching exhibits reduced surface anomolies and improved image quality.