Kaveh Azar

US Patent:

6452799, Sep 17, 2002

Filed:

Sep 15, 2000

Appl. No.:

09/662423

Inventors:

Kaveh Azar - Westwood MA

Assignee:

Lucent Technologies Inc. - Murray Hill NJ

International Classification:

H05K 720

US Classification:

361700, 622592, 165 804, 16510433, 174 152, 361701, 361704, 361707, 361719, 361720, 361715

Abstract:

A integrated circuit cooling system includes a thermally conductive element sandwiched between two integrated circuits. The thermally conductive element of this thermal sandwich conducts heat away from both of the attached integrated circuits. The thermally conductive element may be a solid slab of thermally conductive material, such as copper, it may be a hollow, substantially planar thermal conductor with an internally circulating cooling fluid, or it may be a substantially planar heat pipe for example.

US Patent:

6510053, Jan 21, 2003

Filed:

Sep 15, 2000

Appl. No.:

09/663736

Inventors:

Kaveh Azar - Westwood MA

Assignee:

Lucent Technologies Inc. - Murray Hill NJ

International Classification:

H05K 720

US Classification:

361704, 361692, 361698, 361735, 257719, 174 163

Abstract:

A circuit board cooling system includes a thermally conductive element sandwiched between two circuit boards. The thermally conductive element of this thermal sandwich conducts heat away from both of the attached circuit cards. The thermally conductive element may be a solid slab of thermally conductive material, such as copper, it may be a hollow, substantially planar thermal conductor with an internally circulating cooling fluid, or it may be a substantially planar heat pipe, for example.

US Patent:

6538885, Mar 25, 2003

Filed:

Sep 15, 2000

Appl. No.:

09/662995

Inventors:

Kaveh Azar - Westwood MA

Assignee:

Lucent Technologies Inc. - Murray Hill NJ

International Classification:

H05K 720

US Classification:

361695, 16510434, 361796

Abstract:

One or more impingement plates, each of which includes one or more apertures, is located within an card cage running from top to bottom and from back to front of the card cage. Each impingement plate is located adjacent to one or more electronic components to be cooled. Channels formed on either side of the impingement plate allow for the ingress of a cooling fluid, the forcing of the cooling fluid through the one or more apertures within the impingement plate toward the electronics to be cooled, and the egress of the cooling fluid after its contact with the electronics.

US Patent:

6691766, Feb 17, 2004

Filed:

Sep 15, 2000

Appl. No.:

09/663735

Inventors:

Kaveh Azar - Westwood MA

Assignee:

Lucent Technologies Inc. - Murray Hill NJ

International Classification:

F28D 2700

US Classification:

165 45, 16510433, 16510434, 62260, 622592, 312236

Abstract:

An electronics cooling system in accordance with the principles of the present invention includes an electronics cabinet that is thermally connected with the ground in the vicinity of the cabinet. The cabinet may or may not sit directly on the earth, but the thermal connection is made with the earth below, and in the near vicinity of, the cabinet, thereby employing the earth as a heat sink. In an illustrative embodiment, an enclosed cabinet includes a heat pipe that makes thermal contact with the ground in the immediate vicinity of the electronics cabinet. An electronics cabinet in accordance with the principles of the present invention is particularly suited for use in uncontrolled environments, such as may be encountered by remote telecommunications switches and wireless telecommunications equipment, for example.

US Patent:

7567435, Jul 28, 2009

Filed:

Mar 7, 2005

Appl. No.:

11/073831

Inventors:

Kaveh Azar - Westwood MA, US
Joseph P. Mennucci - Manville RI, US
Carlo Mandrone - Newburyport MA, US

Assignee:

Advanced Thermal Solutions, Inc. - Norwood MA

International Classification:

H05K 5/00
H05K 7/00
H05K 7/20

US Classification:

36167954, 361703, 361709

Abstract:

A heat sink assembly mount is provided. Generally the invention has a frame clip and a spring clip. The frame clip has one or more inwardly extending tabs and two or more vertically extending side portions. The one or more tabs are sized to fit over and removably couple to a heat producing device. The distance between the two or more vertically extending side portions is sized to hold a base portion of a heat sink and prevent horizontal motion of the heat sink. The spring clip couples to the frame clip and has a spring bias sized to produce a vertical force that presses the heat sink against a heat producing device.

US Patent:

8063485, Nov 22, 2011

Filed:

Jun 27, 2008

Appl. No.:

12/163531

Inventors:

Kaveh Azar - North Quincy MA, US

Assignee:

Advanced Thermal Solutions, Inc. - Norwood MA

International Classification:

H05K 7/20

US Classification:

257727, 257706, 257E23026

Abstract:

A board mounted integrated electronics package assembly is provided with one or more securing elements to attach a heat dissipating device directly to the package. The securing element(s) is located along a periphery of the package and anchors a base of the heat dissipating device to the package, thereby eliminating employment of a secondary heat dissipating material between the package and the heat dissipating device.

US Patent:

8125782, Feb 28, 2012

Filed:

Jul 28, 2009

Appl. No.:

12/510874

Inventors:

Kaveh Azar - Westwood MA, US
Joseph P. Mennucci - Manville RI, US
Carlo Mandrone - Newburyport MA, US

Assignee:

Advanced Thermal Solutions, Inc. - Norwood MA

International Classification:

H05K 7/20

US Classification:

361709, 361707, 361715, 361717, 361719, 165121, 257719

Abstract:

A heat sink assembly mount is provided. Generally the invention has a frame clip and a spring clip. The frame clip has one or more inwardly extending tabs and two or more vertically extending side portions. The one or more tabs are sized to fit over and removably couple to a heat producing device. The distance between the two or more vertically extending side portions is sized to hold a base portion of a heat sink and prevent horizontal motion of the heat sink. The spring clip couples to the frame clip and has a spring bias sized to produce a vertical force that presses the heat sink against a heat producing device.

US Patent:

20010003302, Jun 14, 2001

Filed:

May 10, 1999

Appl. No.:

09/307655

Inventors:

KAVEH AZAR - WESTWOOD MA, US

International Classification:

F28F007/00
H05K007/20
H01L023/34

US Classification:

165/080300, 165/185000, 174/016300, 257/722000, 361/704000

Abstract:

A heat exchanger and a method of manufacturing the heat exchanger is disclosed for dissipating heat from a heat generating component. The heat exchanger comprises a thermally conductive base in thermal communication with the component, a plurality of thermally conductive plate fins affixed to the base wherein the plate fins define a fin field and channels, and fluid control for controlling the fluid flow within the fin field. The individual fins of the heat exchanger are tapered with the cross-sectional area of the individual fins decreasing from an inlet region of the heat exchanger toward a middle region of the heat exchanger. The tapering of the fins function to minimize formation of high pressure with the fin field. In an alternative embodiment, the heat exchanger may comprise an aperture for enhancing ventilation of fluid within the fin field, and thereby reducing formation of high pressure within the fin field. Alternatively or in conjunction with the above-outlined embodiments, the heat exchanger may comprise a fluid control feature for substantially preventing premature egress of fluid from a top region of the fin field caused by the high pressure region within the fin field.

Author:

Kaveh Azar

ISBN #:

0849332796