Lawrence E Felton

US Patent:

6759273, Jul 6, 2004

Filed:

Dec 5, 2001

Appl. No.:

10/006967

Inventors:

Lawrence E. Felton - Hopkinton MA
Jing Luo - Lexington MA

Assignee:

Analog Devices, Inc. - Norwood MA

International Classification:

H01L 2144

US Classification:

438113, 438114, 438458, 438460, 438464

Abstract:

A wafer cap protects micro electromechanical system (âMEMSâ) structures during a dicing of a MEMS wafer to produce individual MEMS dies. A MEMS wafer is prepared having a plurality of MEMS structure sites thereon. Upon the MEMS wafer, the wafer cap is mounted to produce a laminated MEMS wafer. The wafer cap is recessed in areas corresponding to locations of the MEMS structure sites on the MEMS wafer. The capped MEMS wafer can be diced into a plurality of MEMS dies without causing damage to or contaminating the MEMS die.

US Patent:

6893574, May 17, 2005

Filed:

Oct 23, 2001

Appl. No.:

10/002953

Inventors:

Lawrence E. Felton - Hopkinton MA, US
Peter W. Farrell - Lunenburg MA, US
Jing Luo - Lexington MA, US
David J. Collins - Windham NH, US
John R. Martin - Foxborough MA, US
William A. Webster - Tewksbury MA, US

International Classification:

C23F001/00
H01L021/44
H01L021/48
H01L021/50

US Classification:

216 2, 438113

Abstract:

A MEMS capping method and apparatus uses a cap structure on which is formed a MEMS cavity, a cut capture cavity, and a cap wall. The cap wall is essentially the outer wall of the MEMS cavity and the inner wall of the cut capture cavity. The cap structure is bonded onto a MEMS structure such that the MEMS cavity covers protected MEMS components. The cap structure is trimmed by cutting through to the cut capture cavity from the top of the cap structure without cutting all the way through to the MEMS structure.

US Patent:

6931170, Aug 16, 2005

Filed:

Oct 18, 2002

Appl. No.:

10/274496

Inventors:

Chang-Han Yun - Boston MA, US
Shanti Bhattacharya - Chennai, IN
Yakov Reznichenko - Newton MA, US
John R. Martin - Foxborough MA, US
Lawrence E. Felton - Hopkinton MA, US
Jeffrey Swift - Andover MA, US
Kieran P. Harney - Andover MA, US
Michael W. Judy - Wakefield MA, US

Assignee:

Analog Devices, Inc. - Norwood MA

International Classification:

G02B006/26
G02B006/42

US Classification:

385 18, 385 47

Abstract:

A fiber-attached optical device with in-plane micromachined mirrors includes a cover having at least one reflector formed on one side and a substrate having a plurality of micromachined optical mirrors formed substantially on a single plane on a side facing toward the mirrored side of the cover. The micromachined optical mirrors are controllable to reflect optical signals between a plurality of optical fiber segments via the at least one reflector. The plurality of optical fiber segments can be attached to either the cover or the substrate so as to form an integrated package including the substrate, the cover, and the plurality of optical fiber segments. The mirrors can be controlled to variably attenuate the optical signals.

US Patent:

6933163, Aug 23, 2005

Filed:

Sep 27, 2002

Appl. No.:

10/259173

Inventors:

Chang-Han Yun - Boston MA, US
Lawrence E. Felton - Hopkinton MA, US
Maurice S. Karpman - Brookline MA, US
John A. Yasaitis - Lexington MA, US
Michael W. Judy - Wakefield MA, US
Colin Gormley - Belfast, GB

Assignee:

Analog Devices, Inc. - Norwood MA

International Classification:

H01L021/00

US Classification:

438 48

Abstract:

An intermediate electrode layer is used to fabricate an integrated micro-electromechanical system. An intermediate electrode layer is formed on an integrated circuit wafer. The intermediate electrode layer places drive electrodes a predetermined height above the surface of the integrated circuit wafer. A micro-electromechanical system wafer having micromachined optical mirrors is bonded to the integrated circuit wafer such that the drive electrodes are positioned a predetermined distance from the optical mirrors.

US Patent:

6936918, Aug 30, 2005

Filed:

Apr 19, 2004

Appl. No.:

10/827680

Inventors:

Kieran P. Harney - Andover MA, US
Lawrence E. Felton - Hopkinton MA, US
Thomas Kieran Nunan - Carlisle MA, US
Susan A. Alie - Stoneham MA, US
Bruce Wachtmann - Concord MA, US

Assignee:

Analog Devices, Inc. - Norwood MA

International Classification:

H01L023/12

US Classification:

257704, 257777, 257730, 257774, 257750, 257754

Abstract:

A MEMS device has at least one conductive path extending from the top facing side of its substrate (having MEMS structure) to the bottom side of the noted substrate. The at least one conductive path extends through the substrate as noted to electrically connect the bottom facing side with the MEMS structure.

US Patent:

6940636, Sep 6, 2005

Filed:

Sep 20, 2001

Appl. No.:

09/957117

Inventors:

Lawrence E. Felton - Hopkinton MA, US

Assignee:

Analog Devices, Inc. - Norwood MA

International Classification:

G02B026/08
G02F001/29

US Classification:

359298, 359290, 359291

Abstract:

In an optical switching apparatus having a mirror structure bonded to a substrate, the gap between the mirror structure and the substrate is controlled by mechanical standoffs placed between the mirror structure and the substrate. The mirror structure is bonded to the substrate using solder. The mechanical standoffs are formed from a material having a higher melting point than that of the solder. The mirror structure is bonded to the substrate under pressure at a temperature between the melting point of the solder and the melting point of the mechanical standoffs.

US Patent:

6964882, Nov 15, 2005

Filed:

Sep 27, 2002

Appl. No.:

10/259188

Inventors:

Chang-Han Yun - Boston MA, US
Lawrence E. Felton - Hopkinton MA, US
Maurice S. Karpman - Brookline MA, US
John A. Yasaitis - Lexington MA, US
Michael W. Judy - Wakefield MA, US
Colin Gormley - Belfast, GB

Assignee:

Analog Devices, Inc. - Norwood MA

International Classification:

H01L023/12

US Classification:

438108, 438455

Abstract:

A flip-bonding technique is used to fabricate complex micro-electromechanical systems. Various micromachined structures are fabricated on the front side of each of two wafers. One of the wafers is flipped over and bonded to the other wafer so that the front sides of the two wafers are bonded together in a flip-stacked configuration.

US Patent:

7033672, Apr 25, 2006

Filed:

Mar 19, 2002

Appl. No.:

10/101016

Inventors:

John R. Martin - Foxborough MA, US
Maurice Karpman - Brookline MA, US
Lawrence E. Felton - Hopkinton MA, US

Assignee:

Analog Devices, Inc. - Norwood MA

International Classification:

B32B 27/18
B32B 27/30
B32B 33/00
G02B 26/00

US Classification:

428422, 428457, 428500, 359224, 359225, 359291, 359295, 345 31

Abstract:

An optically transparent conductive material is used for static dissipation of a cover material for an optical switching device. The optically transparent conductive material is deposited directly or indirectly on the cover material. The optically transparent conductive material forms an electrically continuous film. The optically transparent conductive material can also be used for anti-reflection.