Louis A. Abbagnaro - Silver Spring MD Bobby L. Mason - Alexandria VA
Assignee:
Pace Incorporated - Laurel MD
International Classification:
B23K 304 B23K 3704
US Classification:
228 62
Abstract:
A nozzle device is adjustably positionable over a component which is disposed on a substrate, for registering relatively precisely against the component relative to the substrate for delivering a flow of uniformly heated air. The heated air is directed to the sides of the component to melt solder associated with terminals thereon. A series of changeable nozzles can be used for various component and terminal configurations and can be moved into or out of registry with the component. A vacuum apparatus can be provided for contacting the component to remove the component from the substrate. Notched end portions of inwardly projecting walls on the nozzle provide accurate registration with upper edges of the component, and permit accurate spacing of a skirt portion of the device relatively evenly from the substrate and relatively evenly from the sidewalls of the component.
Desoldering Method And Apparatus With Minimum Vacuum On-Time Control
Charles H. McDavid - Baltimore MD Marshall Canaday - Odenton MD Louis A. Abbagnaro - Silver Spring MD
Assignee:
Pace Incorporated - Laurel MD
International Classification:
B23K 1018
US Classification:
228 205
Abstract:
A control circuit for a vacuum desoldering apparatus includes a timing mechanism to ensure that vacuum is maintained for a necessary minimum amount of time, even if a vacuum actuation switch of the desoldering tool is prematurely deactivated by the operator. If the operator presses the vacuum actuator switch for a period of time longer than the predetermined minimum time, vacuum will flow until the switch is released. However, if the operator actuates the switch very briefly, that is, for less than the predetermined minimum vacuum actuation time, the vacuum supply is maintained in an activated state for the predetermined minimum time.
Heater For Use As Either Primary Or Auxiliary Heat Source And Improved Circuitry For Controlling The Heater
Linus E. Wallgren - Rockville MD Bobby L. Mason - Alexandria VA William J. Siegel - Siver Spring MD Ole V. Olesen - Annapolis MD Louis A. Abbagnaro - Columbia MD
Assignee:
Pace, Incorporated - Laurel MD
International Classification:
H05B 102
US Classification:
219497
Abstract:
A heater unit and control circuitry therefor, the heater unit typically being employed as a preheater or primary heater for the installation and removal of electronic components from a PCB or the like and having various means for accommodating (a) an uneven surface or the presence of other components on the underside of the board or (b) an unlevel board. Moreover, a heater unit for sequentially providing preheat and primary heat from different zones of the heate is disclosed. A probe for use with the heater for sensing the temperature at various points on the board is also disclosed. The circuitry is characterized by ease of calibration of the heater temperature, the temperature transducing circuits, and the temperature setting circuits thereof. Moreover, circuitry is provided to insure the same voltage out of each input source in response to the input source measuring or setting a common temperature.
Apparatus For Removal And Installing Electronic Components With Respect To A Substrate
Louis A. Abbagnaro - Silver Spring MD Robert G. Brown - Annapolis MD William J. Siegel - Silver Spring MD William J. Kautter - Columbia MD Robert S. Quasney - Pasendena MD
Assignee:
Pace Incorporated - Laural MD
International Classification:
B23K 300
US Classification:
228 11
Abstract:
This invention relates to a method and apparatus for removing and installing surface mounted devices (SMD's) with respect to a substrate such as a printed circuit board (PCB).
Soldering Iron With Quick Change Heater Assembly With Static Dissipative And Strain Relieving Receiver For Detachable Power Cord-Heater Connections
Anthony Q. Tang - Ellicott City MD E. Raleigh Hodil - Timonium MD Louis A. Abbagnaro - Silver Spring MD William J. Siegel - Silver Spring MD Charles Cardno - Ellicott City MD
Assignee:
Pace, Incorporated - Laurel MD
International Classification:
H05B 100 H05B 342
US Classification:
219238
Abstract:
A soldering iron including an insulator, a dissipator, and a hollow, cylindrical handle through which the electrical cable travels, and in which the wires, extending from the electrical cable and connected to the heater unit by individual plug and socket connectors, are able to move freely for making it easier to exchange the heating element but prevent the wires from being accidentally disconnected by pulling on the electrical cord during use. More specifically, a single electrical insulator body, which fits inside the dissipator, receives all of the electrical connectors. Furthermore, the insulator provides unidirectional strain relief by trapping the wires against an inside tapered portion of the dissipator when mounted within the dissipator and releases the wires in the opposite direction simply by the act of being removed from the dissipator. Furthermore, the electrical insulator together with a minimal contact area joining of the dissipator to the handle serves to achieve a cool handpiece while making it possible to limit the use of expensive, high temperature resistant, static dissipative materials to only the dissipator, it being suitable to use high temperature resistant plastics that are not static dissipative for the electrical insulator and low temperature resistant, static dissipative plastic for the handle.
Probe For Use With Circuitry For Monitoring Signals Emanating From Heated Tip Of Soldering Iron Or Solder Extractor Or The Like
William J. Kautter - Columbia MD Mark D. Wecht - Reisterstown MD Louis A. Abbagnaro - Silver Spring MD
Assignee:
Pace Incorporated - Laurel MD
International Classification:
G01R 106
US Classification:
324158P
Abstract:
A probe for use with circuitry for monitoring signals emanating from a heated electrical appliance, the probe including a planar member having three layers, the first layer including at least a first electrically conductive portion adapted to support a piece of solder, the second layer being an electrically insulating layer disposed between the first layer and a third layer, the third layer being electrically conductive. A novel method and circuit using the above probe are also disclosed wherein a heated soldering iron or solder extractor tip or the like melts the piece of solder to establish good electrical connection for the signals from the tip to the monitor circuit through the molten solder and the first portion of the first layer.
Apparatus For Removal And Installing Electronic Components With Respect To A Substrate
Louis A. Abbagnaro - Silver Spring MD Robert G. Brown - Annapolis MD William J. Siegel - Silver Spring MD William J. Kautter - Columbia MD Robert S. Quasney - Pasendena MD
Assignee:
Pace Incorporated - Laurel MD
International Classification:
B23K 100
US Classification:
228 20
Abstract:
Apparatus for soldering and desoldering an electronic component to or from a printed circuit board includes an alignment station and a soldering/desoldering station. The printed circuit board is mounted upon an adjusable X-Y table which can be indexed between the alignment station and the soldering/desoldering station. To align an electronic component with respect to th PCB, a vacuum pickup device is operated at the alignment station to pickup and support the component within an optical field of view above the PCB and the X-Y table is adjusted in X, Y and. theta. directions with respect to the component. Upon alignment of the component, the pickup device is lowered to temporarily adhere the component to the PCB by an adhesive flux. Thereafter, the X-Y table is indexed to a preset position below a hot air soldering nozzle and the component soldered in a known manner. A rotary device for shearing a defective electronic device from a PCB is also attached to the bottom of the soldering/desoldering nozzle.
Soldering/Desoldering Apparatus With Spring-Loaded Floating Vacuum Pickup Device
Anthony Qingzhong Tang - Ellicott City MD William J. Siegel - N. Bethesda MD Elmer Raleigh Hodil - Timonium MD Louis Abbagnaro - Silver Spring MD
Assignee:
Pace, Incorporated - Laurel MD
International Classification:
B23K 1012 B23K 1018 B23K 3102
US Classification:
22818021
Abstract:
A soldering/desoldering apparatus has a handpiece with a handgrip portion from which a hot air tube extends, a vacuum pickup tube which extends through the handgrip portion and hot air tube, one end of which has a suction cup mounted thereon and an opposite end of which is connected to a flexible vacuum line. Furthermore, an adjustment knob for axially shifting the vacuum pickup tube is provided on the handgrip portion and the vacuum pickup tube is resiliently displaceably supported relative to a displacement mechanism formed by a slide rod fixed to an inner wall of the handgrip portion and a rack member slidably disposed on the slide rod and geared to the adjustment knob. The pickup tube is fixed to a slide bracket which is slidably disposed on the slide rod between the ends of the rack member and between a pair of coil springs which act to position the slide bracket in a neutral position between the ends of the rack member. Additionally, nozzles having a fixed vacuum pickup extension can be used. According to another advantageous feature, a vacuum on/off switch and a hot air on/off switch are provided on the handgrip portion, and the vacuum on/off switch has a time delay function built for preventing termination of the vacuum supply unless the switch is depressed for longer than a predetermined time period.