Mark A Shalkey

Address:

2014 Riff Rd, Corning, NY 14830

VIN:

5J6YH28767L011015

Make:

HONDA

Model:

ELEMENT

Year:

2007

US Patent:

7276194, Oct 2, 2007

Filed:

Aug 29, 2003

Appl. No.:

10/651553

Inventors:

Mark A Shalkey - Corning NY, US

Assignee:

Corning Incorporated - Corning NY

International Classification:

B29C 47/68
B29C 47/08
B01D 46/24

US Classification:

26417712, 264630, 264631, 4253824, 425197, 425198

Abstract:

A method is provided for manufacturing a thin-walled honeycomb ceramic substrate by extruding a plasticized ceramic batch material through a filter screen having wedge shaped filter wires to remove foreign particulate and agglomerated batch material. The filter wires are supported by a set of support wires attached substantially perpendicular to the filter wires. The support wires are may also be advantageously wedge shaped. The filter screen of the present invention may have a wear resistant layer at the surface of the screen, typically a boride or a nitride. The wear resistant coating may also be a nickel-based coating.

US Patent:

7303782, Dec 4, 2007

Filed:

Nov 30, 2004

Appl. No.:

11/000690

Inventors:

James F. Avery - Horseheads NY, US
Thomas W. Brew - Corning NY, US
Samir Khanna - Painted Post NY, US
Mark A. Shalkey - Corning NY, US
Yawei Sun - Horseheads NY, US

Assignee:

Corning Incorporated - Corning NY

International Classification:

C23C 16/00
B05D 1/32
B05D 5/00

US Classification:

4272481, 427282

Abstract:

Apparatus and a method for selectively vapor-coating an extrusion die to extrude honeycombs with desired distributions of web thicknesses, wherein at least one perforated impedance or preferential coating plate with a desired pattern of holes is positioned adjacent to, but spaced apart from, a face of the extrusion die to be coated, whereby a coating gas passed through the coating plate and into the die imparts a desired coating distribution to the extrusion die slots that is effective to closely control the web thickness distribution in honeycombs extruded therefrom.

US Patent:

7927092, Apr 19, 2011

Filed:

Dec 31, 2007

Appl. No.:

11/967818

Inventors:

Raymond Charles Cady - Horseheads NY, US
Michael John Moore - Corning NY, US
Mark Alex Shalkey - Corning NY, US
Mark Andrew Stocker - Market Harborough, GB

Assignee:

Corning Incorporated - Corning NY

International Classification:

B29C 43/36

US Classification:

425389, 100211, 425398, 4254052, 425423, 451548

Abstract:

Methods and apparatus for forming a semi-spherical polishing pad for polishing semiconductor surfaces, provide for: placing a polishing pad pre-form on a dome-shaped forming surface, the polishing pad pre-form including a circular body having a center and an outer peripheral edge, and a plurality of slots extending from the outer peripheral edge towards the center; disposing a bladder opposite to the dome-shaped forming surface and the polishing pad pre-form; inflating the bladder with a fluid such that the dome-shaped forming surface of the bonnet form presses against the polishing pad pre-form from one side and the bladder presses against the polishing pad pre-form from an opposite side; and maintaining the pressing step for a predetermined period of time to achieve the semi-spherical polishing pad.

US Patent:

7934435, May 3, 2011

Filed:

Dec 6, 2006

Appl. No.:

11/634598

Inventors:

Douglas E Brackley - Horseheads NY, US
Kiat Chyai Kang - Taichung, TW
Paul Maynard Schermerhorn - Painted Post NY, US
Mark Alex Shalkey - Corning NY, US
Paul John Shustack - Elmira NY, US

Assignee:

Corning Incorporated - Corning NY

International Classification:

G01N 33/00
B32B 17/00

US Classification:

73866, 156 99

Abstract:

Systems, methods, and apparatus relate to a glass reference plate panel; to a modular glass reference plate assembly; and to creation of the modular glass reference plate assembly, which may include providing a plurality of glass reference plate panels, arranging the plurality of glass reference plate panels into an array of adjoining glass reference plate panels, and adhering together the adjoining glass reference plate panels. One or more embodiments may include 6. 8 mm-thick borosilicate glass, ground, and polished, with reference marks on a top side and a PVD aluminum coating on a bottom side, perforated with holes, arranged in a 4×4 array of 16 glass reference plate panels, each approximately 810 mmin size, abutting at interfaces formed by lap joints, and bonded together with a UV-curable adhesive into a contiguous piece.

US Patent:

8500934, Aug 6, 2013

Filed:

Mar 15, 2011

Appl. No.:

13/048399

Inventors:

Raymond Charles Cady - Horseheads NY, US
Michael John Moore - Corning NY, US
Mark Alex Shalkey - Corning NY, US
Mark Andrew Stocker - Market Harborough, GB

Assignee:

Corning Incorporated - Corning NY

International Classification:

B24B 7/00

US Classification:

156214, 451540

Abstract:

Methods and apparatus for forming a semi-spherical polishing pad for polishing semiconductor surfaces, provide for: placing a polishing pad pre-form on a dome-shaped forming surface, the polishing pad pre-form including a circular body having a center and an outer peripheral edge, and a plurality of slots extending from the outer peripheral edge towards the center; disposing a bladder opposite to the dome-shaped forming surface and the polishing pad pre-form; inflating the bladder with a fluid such that the dome-shaped forming surface of the bonnet form presses against the polishing pad pre-form from one side and the bladder presses against the polishing pad pre-form from an opposite side; and maintaining the pressing step for a predetermined period of time to achieve the semi-spherical polishing pad.

US Patent:

20130316631, Nov 28, 2013

Filed:

Jul 31, 2013

Appl. No.:

13/955683

Inventors:

Michael John Moore - Corning NY, US
Mark Alex Shalkey - Corning NY, US
Mark Andrew Stocker - Holcot, GB

Assignee:

CORNING INCORPORATED - CORNING NY

International Classification:

B24B 37/26

US Classification:

451527

Abstract:

Methods and apparatus for forming a semi-spherical polishing pad for polishing semiconductor surfaces, provide for: placing a polishing pad pre-form on a dome-shaped forming surface, the polishing pad pre-form including a circular body having a center and an outer peripheral edge, and a plurality of slots extending from the outer peripheral edge towards the center; disposing a bladder opposite to the dome-shaped forming surface and the polishing pad pre-form; inflating the bladder with a fluid such that the dome-shaped forming surface of the bonnet form presses against the polishing pad pre-form from one side and the bladder presses against the polishing pad pre-form from an opposite side; and maintaining the pressing step for a predetermined period of time to achieve the semi-spherical polishing pad.

US Patent:

60803487, Jun 27, 2000

Filed:

Sep 28, 1998

Appl. No.:

9/162115

Inventors:

Mark A. Shalkey - Corning NY

Assignee:

Corning Incorporated - Corning NY

International Classification:

B29C 4730

US Classification:

26417712

Abstract:

A honeycomb extrusion die comprising a die body incorporating an inlet face, a discharge face opposite the inlet face, a plurality of feedholes extending from the inlet face into the body, and an intersecting array of discharge slots extending into the body from the discharge face to connect with the feed holes, the intersecting array of discharge slots being formed by the side surfaces of a plurality of pins bounded by the slots and extending into the die body from the discharge face, wherein at least some of the side surfaces of the pins incorporate at least one geometrically designed flow-modifying surface discontinuity.

US Patent:

62998137, Oct 9, 2001

Filed:

Sep 23, 1999

Appl. No.:

9/401713

Inventors:

Thomas W. Brew - Corning NY
W. Neil Peters - Corning NY
Mark A. Shalkey - Corning NY

Assignee:

Corning Incorporated - Corning NY

International Classification:

B29C 4712

US Classification:

26417712

Abstract:

A honeycomb extrusion die comprising a die body incorporating an inlet face, a discharge face opposite the inlet face, a plurality of feedholes extending from the inlet face into the body, and an array of intersecting discharge slots extending into the body from the discharge face and interconnecting with the feed holes, the intersecting discharge slots being formed by the side surfaces of a plurality of pins bounded by the slots and extending into the die body from the discharge face, wherein a plurality of the pins include one or more multi-textured side surfaces, each side surface including at least two surface regions differing in surface finish from each other.