Mark D Wessel

US Patent:

6847525, Jan 25, 2005

Filed:

May 24, 2002

Appl. No.:

10/155266

Inventors:

Grant M. Smith - Bryn Athyn PA, US
Mark W. Wessel - Bala Cynwyd PA, US

Assignee:

Unisys Corporation - Blue Bell PA

International Classification:

H05K 720

US Classification:

361703, 361689, 361690, 361719, 174 161, 174 163, 165 803

Abstract:

A heat sink is provided for transferring heat to air flowing from an upstream path. The heat sink includes a support portion and a plurality of fins extending from the support portion. The fins and the support portion together define channels at least one of which has a portion angled with respect to the upstream path of flowing air. Redirection of the flowing air from the upstream path to at least one downstream path is thereby facilitated.

US Patent:

6862181, Mar 1, 2005

Filed:

Mar 17, 2003

Appl. No.:

10/390461

Inventors:

Grant M. Smith - Bryn Athyn PA, US
Daniel A. Jochym - Downingtown PA, US
Mark W. Wessel - Bala Cynwyd PA, US

Assignee:

Unisys Corporation - Blue Bell PA

International Classification:

H05K007/20

US Classification:

361690, 361688, 361796, 361818, 361719, 174 163, 174 35 R

Abstract:

An apparatus directs airflow adjacent a circuit board to provide cooling and provides shielding for the circuit board to reduce EMI. The apparatus comprises a barrier for directing airflow and a conductive layer, electrically grounded and physical associated with the barrier, for providing shielding for the circuit board to reduce EMI.

US Patent:

6992894, Jan 31, 2006

Filed:

Mar 17, 2003

Appl. No.:

10/390419

Inventors:

Keith D. Mease - Gibbstown NJ, US
Mark W. Wessel - Bala Cynwyd PA, US
Grant M. Smith - Bryn Athyn PA, US
Terry W. Louth - Narvon PA, US
Daniel A. Jochym - Downingtown PA, US
Ronald T. Gibbs - Paoli PA, US

Assignee:

Unisys Corporation - Blue Bell PA

International Classification:

H05K 7/20
H01L 23/40

US Classification:

361719, 361697, 361799, 361800, 257718

Abstract:

An apparatus and method are provided for dissipating heat from an electronic component mounted in a conductive enclosure and for shielding electromagnetic radiation generated by the electronic component. A heat sink is configured to be mounted in thermal contact with the electronic component. An electrical conductor is operatively connected to the heat sink and configured to provide electrical contact between the heat sink and a surface of the conductive enclosure, thereby at least partially shielding the electromagnetic radiation generated by the electronic component.

US Patent:

7646602, Jan 12, 2010

Filed:

Aug 29, 2008

Appl. No.:

12/201304

Inventors:

Vladimir Tamarkin - Huntingdon Valley PA, US
Mark W. Wessel - Aston PA, US

Assignee:

QLOGIC, Corporation - Aliso Viejo CA

International Classification:

H05K 7/20

US Classification:

361695, 361694

Abstract:

The disclosed embodiments include a plurality of plenums for distributing cooling air throughout the switch. The switch is divided into separate cooling domains. Each PCB receives a separate supply of cooling air, so that no PCB is located upstream or downstream from another PCB. The present embodiments thus eliminate the problem of stack rise, which can decrease switch performance.

US Patent:

7667985, Feb 23, 2010

Filed:

Aug 28, 2008

Appl. No.:

12/200649

Inventors:

Vladimir Tamarkin - Huntingdon Valley PA, US
Mark W. Wessel - Aston PA, US

Assignee:

QLogic, Corporation - Aliso Viejo CA

International Classification:

H05K 9/00

US Classification:

361818, 361800, 361816, 361753, 361799, 361758, 174350, 174377, 43960701, 43960707, 29830

Abstract:

One embodiment of the present computer network device comprises a subassembly. The subassembly includes a support plate, a standoff extending from the support plate, a printed circuit board (PCB) secured to the standoff, an electromechanical connector secured to the PCB, an electromagnetic interference (EMI) cage secured to the PCB, and an EMI gasket engaging the EMI cage. The computer network device further comprises a guiding and retaining member that engages the support plate and assists in securing the subassembly within an enclosure. In a method of assembling the computer network device, the subassembly is first assembled before the subassembly is secured within an enclosure. Relative motion of the PCB and the standoffs is thus eliminated during the assembly process.

US Patent:

7907414, Mar 15, 2011

Filed:

Mar 24, 2009

Appl. No.:

12/410294

Inventors:

Vladimir Tamarkin - Huntingdon Valley PA, US
Mark W. Wessel - Aston PA, US

Assignee:

QLOGIC, Corporation - Aliso Viejo CA

International Classification:

H05K 7/00

US Classification:

361747, 361801, 361802, 361752

Abstract:

A network device including a module. A chassis supports the module. A lever is secured to an enclosure of the module by a pivot. In one embodiment a pivot axis of the lever is parallel to a major axis of the module. In another embodiment the enclosure includes a clearance through which a portion of a lever from an adjacent module may pass. In another embodiment the lever includes a handle portion and a claw portion. A portion of the handle defines a first plane, the claw defines a second plane, and the first and second planes are parallel and spaced from one another. In another embodiment at least part of the claw portion protrudes outward from an envelope of the module enclosure.