Meta M Rohde from Upper Saddle River, NJ, age 78

Microwave Frequency Surface Mount Components And Methods Of Forming Same
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US Patent:

6917265, Jul 12, 2005
Filed:

May 22, 2003
Appl. No.:

10/443510
Inventors:

Antonio Almeida - Clark NJ, US
Shankar Joshi - Warren NJ, US
Meta Rohde - Upper Saddle River NJ, US
Mahadevan Sridharan - Piscataway NJ, US
Assignee:

Synergy Microwave Corporation - Paterson NJ
International Classification:

H11P005/08
US Classification:

333246, 333238, 333164
Abstract:

A microwave frequency device includes: a first substrate having a dielectric layer and a conductive film disposed on opposing first and second sides of the dielectric layer, the conductive film on the first side of the dielectric layer of the first substrate including at least one signal line; and a second substrate having a dielectric layer, conductive film disposed on at least one of first and second opposing sides of the dielectric layer, and at least one cut-out where the dielectric layer and conductive film have been removed, wherein the first and second substrates are bonded together to form a bonded assembly such that (i) a portion of the signal line of the first substrate is sandwiched between the dielectric layers of the first and second substrates, and (ii) the at least one cut-out exposes a portion of the signal line, thereby forming a microstrip portion. A method of forming same is also disclosed.

Visually Inspectable Surface Mount Device Pad
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US Patent:

7612296, Nov 3, 2009
Filed:

Aug 31, 2005
Appl. No.:

11/216813
Inventors:

Meta Rohde - Upper Saddle River NJ, US
Ajay Kumar Poddar - Elmwood Park NJ, US
Klaus Juergen Schoepf - Ringwood NJ, US
Reimund Rebel - Ringwood NJ, US
Assignee:

Synergy Microwave Corporation - Paterson NJ
International Classification:

H01R 12/04
H05K 1/00
US Classification:

174262, 29852
Abstract:

A printed circuit board having one or more vias disposed in the surface area of a pad. The pad may serve as a connection point between the printed circuit board and another circuit board and is disposed along the edge of the board such that the vias do not form half vias.

Universal Surface Mount Package
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US Patent:

51226219, Jun 16, 1992
Filed:

May 7, 1990
Appl. No.:

7/519844
Inventors:

Meta Rohde - Upper Saddle River NJ
Shankar R. Joshi - Elmont NY
Assignee:

Synergy Microwave Corporation - Paterson NJ
International Classification:

H01L 2302
H01R 4300
US Classification:

174 524
Abstract:

A hermetically sealed surface mount electronic component package can be manufactured by converting standard, readily available flat-packs. The package has a base, with an opening through which a primary transmission lead extends, a glass-to-metal seal surrounding the transmission lead in the opening, and a secondary transmission lead extends from the primary transmission lead so that it is spaced from the base and its end is at least flush with the bottom of the base. An insulator can be provided between the primary transmission lead and the secondary transmission lead. A method of converting a standard flat-pack by providing a composite piece having a dielectric insulator, a secondary transmission lead for connection to the transmission lead of the flat-pack, and a connecting member for connecting the insulator and secondary transmission lead to the base of the flat-pack is also described.

Encasement For Circuit Having Plural Transformers
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US Patent:

53810848, Jan 10, 1995
Filed:

Jan 12, 1993
Appl. No.:

8/003114
Inventors:

Shankar R. Joshi - Elmont NY
Meta Rohde - Upper Saddle River NJ
Assignee:

Synergy Microwave Corporation - Paterson NJ
International Classification:

H01F 4010
US Classification:

323361
Abstract:

A mass of dielectric material intimately surrounds a high frequency circuit having plural transformers in relative close proximity to one anther and provides mechanical stability and electrical protection to the circuit. The mass of dielectric material surrounding the circuit has a dielectric constant less than about 2. 6 and a loss tangent less than about 0. 009.

Surface Mountable Transformer
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US Patent:

58054316, Sep 8, 1998
Filed:

Jan 17, 1996
Appl. No.:

8/588074
Inventors:

Shankar R. Joshi - Elmont NY
Meta Rohde - Upper Saddle River NJ
Assignee:

Synergy Microwave Corporation - Paterson NJ
International Classification:

H01F 2730
H01F 2704
US Classification:

361836
Abstract:

A surface mount package particularly suitable for transformers and other components having numerous windings of fragile, difficult to handle wire has a housing which includes openings along the lower edge, the housing being plated with an electrically conductive material on portions of the lower edge and in areas surrounding the opening. A component is held within the housing, and the leads of the component are disposed in the openings at a point above the lower edge of the housing, and the leads are electrically connected to the plating surrounding the openings and the plating at the flat portions of the lower edge. The plating on the flat portions of the lower edge can be at any suitable location, i. e. , remote from or adjacent to the openings. Additional components can be stacked on the exterior of the housing, as connected to the plating surrounding the openings.

Universal Surface Mount Package
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US Patent:

51608103, Nov 3, 1992
Filed:

Jan 21, 1992
Appl. No.:

7/823374
Inventors:

Meta Rohde - Upper Saddle River NJ
Shankar R. Joshi - Elmont NY
Assignee:

Synergy Microwave Corporation - Paterson NJ
International Classification:

H01L 2302
US Classification:

174 524
Abstract:

A hermetically sealed surface mount electronic component package can be manufactured by converting standard, readily available flat-packs. The package has a base, with an opening through which a primary transmission lead extends, a glass-to-metal seal surrounding the transmission lead in the opening, and a secondary transmission lead extends from the primary transmission lead so that it is spaced from the base and its end is at least flush with the bottom of the base. An insulator can be provided between the primary transmission lead and the secondary transmission lead. A method of converting a standard flat-pack by providing a composite piece having a dielectric insulator, a secondary transmission lead for connection to the transmission lead of the flat-pack, and a connecting member for connecting the insulator and secondary transmission lead to the base of the flat-pack is also described.

Plural Transformers With Elongated Cores
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US Patent:

53903498, Feb 14, 1995
Filed:

Aug 26, 1992
Appl. No.:

7/935549
Inventors:

Shankar R. Joshi - Elmont NY
Meta Rohde - Upper Saddle River NJ
Assignee:

Synergy Microwave Corporation - Paterson NJ
International Classification:

H04B 126
H03B 1916
H01F 2730
US Classification:

455330
Abstract:

A manner of using a plurality of transformers having cylindrical cores such that operation of the transformers at high frequencies allows the cores of the transformers to be disposed parallel to each other and in relatively close proximity without substantial interference.