Michael A Cheperak

US Patent:

62548158, Jul 3, 2001

Filed:

Jul 29, 1994

Appl. No.:

8/282443

Inventors:

Michael Lan Cheperak - Tempe AZ

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

B29C 4514
B29C 7070
B29C 7072
B29C 7074

US Classification:

264135

Abstract:

A method forms a plastic package (28) for a sensing die (10) having a pressure sensitive diaphragm (22), wherein the diaphragm (22) has a first surface (24) and a second surface (26) disposed opposite the first surface (24). According to this method, the sensing die (10) is mounted overlying a hole (18) in a die bond pad (16), which is used to support the sensing die (10) in the package (28). Next, the sensing die (10) is enclosed within a mold (12,14), and a molding material is introduced into the mold's interior to form the package (28) around the sensing die (10). During molding, the pressures on the first and second surfaces (24,26) of the diaphragm (22) are sufficiently equal to substantially prevent damage to the sensing die (10).