Myra M Boenke

US Patent:

59465522, Aug 31, 1999

Filed:

Aug 20, 1996

Appl. No.:

8/700210

Inventors:

Kenneth Alfred Bird - New Paltz NY
Myra Muth Boenke - Hopewell Junction NY
Jason Lee Frankel - Beacon NY
Sarah Huffsmith Knickerbocker - Hopewell Junction NY
Ahmed Sayeed Shah - Wappingers Falls NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 2144
H01L 2334

US Classification:

438107

Abstract:

A universal substrate includes an input/output (I/O) layer having a fixed I/O assignment of I/O locations for connection with a printed circuit board or the like. A chip receiving layer is provided for receiving one of at least two different but allied semiconductor chips, wherein each of the at least two different but allied chips include a set of bond pads and have a unique wire-out requirement. A first layer includes a plurality of bond pads and vias, the plurality of bond pads including at least two sets of bond pads, wherein each set is adapted for bond connection with a respective one of the at least two different semiconductor chips when received by said receiving means and further in accordance with a respective wire-out requirement. A second layer, different from the first layer, includes redistribution lines for coupling the plurality of bond pads and vias of the first layer to the I/O locations of the I/O layer in accordance with the wire-out requirements of the at least two different semiconductor chips and the fixed I/O assignment.

US Patent:

D473827, Mar 30, 1999

Filed:

Oct 24, 1996

Appl. No.:

D/061550

Inventors:

John V. Acciaioli - Tucson AZ
Myra M. Boenke - Hopewell Junction NY
Larry D. Gross - Poughkeepsie NY
Martin Marotti - Carmel IN
John B. Pavelka - Austin TX
Roland N. Zapfe - Rochester MN

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

1302

US Classification:

D13182

US Patent:

53053400, Apr 19, 1994

Filed:

Dec 16, 1992

Appl. No.:

7/991009

Inventors:

Arsam Antreasyan - Hopewell Junction NY
Myra N. Boenke - Hopewell Junction NY
Greg Costrini - Austin TX
Kurt R. Grebe - Beacon NY
Christoph Harder - Zurich, CH
Peter D. Hoh - Hopewell Junction NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01S 318

US Classification:

372 43

Abstract:

A protection configuration for a semiconductor ridge waveguide laser structure is disclosed wherein layers of protective metal in the form of walls, is applied on each side of the ridge element of the ridged layer of the laser structure. The laser structure is then bonded to a mounting plate in a junction side down orientation by solder or a junction side up orientation by wire bonding. The metal layer may be composed of gold.