Rainer Schoenfeld

US Patent:

7470451, Dec 30, 2008

Filed:

Jul 30, 2002

Appl. No.:

10/485759

Inventors:

Rainer Schoenfeld - New Berlin WI, US
Gerald Schreiber - Duesseldorf, DE
Felix Rustemeyer - Duesseldorf, DE

Assignee:

Henkel AG & Co. KGaA

International Classification:

B05D 7/16

US Classification:

427386, 4273881, 4273882, 156330

Abstract:

The invention relates to a binding agent composition, in particular an adhesive, containing at least one epoxy compound or at least one amino compound comprising at least two amino groups, or at least one hydroxy compound comprising at least two OH groups, or at least one mercapto compound comprising at least two mercapto groups, or at least one isocyanate comprising at least two NCO groups and a compound with chelating properties. The invention also relates to a method for producing binding agent compounds of this type and to the use of the same.

US Patent:

20030192643, Oct 16, 2003

Filed:

Mar 15, 2002

Appl. No.:

10/098963

Inventors:

Rainer Schoenfeld - New Berlin WI, US
James Hubert - Brookfield WI, US
Murteza Erman - New Berlin WI, US

International Classification:

C09J001/00

US Classification:

156/330000

Abstract:

In the preparation of an improved adhesive composition, a first reaction product is prepared by the reaction at an elevated temperature of a) 30 to 50 wt-% of an epoxy resin, solid at room temperature, which was prepared from bisphenol A and/or bisphenol F and epichlorohydrin with an epoxide equivalent weight of 400 to 700, b) 10 to 25 wt-% of an epoxy resin, liquid at room temperature, prepared from bisphenol A and/or bisphenol F and epichlorohydrin with an epoxide equivalent weight of 150 to 220, c) 35 to 50 wt-% amino-terminated polyethylene and/or polypropylene glycols and d) a carboxyl-terminated butadiene-nitrile rubber. The first reaction product is mixed with an acrylate terminated urethane resin, glass microspheres, expandable hollow plastic microspheres and a latent curing agent to make an adhesive composition which is pumpable at room temperature and capable of expansion to about 100% with high impact resistance after curing.

US Patent:

20030196753, Oct 23, 2003

Filed:

Mar 13, 2003

Appl. No.:

10/388304

Inventors:

Rainer Schoenfeld - New Berlin WI, US
James Hubert - Brookfield WI, US
Murteza Erman - New Berlin WI, US

International Classification:

C09J001/00

US Classification:

156/330000

Abstract:

In the preparation of an improved adhesive composition, an epoxy-based prepolymer is obtained by the reaction of one or more epoxy resins with amino-terminated polyethers and/or carboxyl-terminated butadiene-nitrile rubbers. In one embodiment of the invention, both a solid epoxy resin and a liquid epoxy resin, each of which is a diglycidyl ether of a polyphenol such as bisphenol A, are used. The epoxy-based prepolymer is mixed with an acrylate-terminated urethane resin (preferably, one based on a polyol having a number average molecular weight of at least about 400) and a heat-activated latent curing agent to make an adhesive composition which can be pumpable at room temperature. Curable adhesives capable of expansion to about 100% with high impact resistance after curing may be obtained by inclusion of expanding agents such as expandable microspheres.

US Patent:

20050215730, Sep 29, 2005

Filed:

Mar 24, 2004

Appl. No.:

10/808992

Inventors:

Rainer Schoenfeld - New Berlin WI, US

International Classification:

C08G059/16

US Classification:

525533000

Abstract:

Products prepared from polycarboxylic anhydrides and active hydrogen-functionalized elastomeric polymers, in particular polyoxyalkyleneamines, are suitable as builder components (prepolymers) for epoxy resin compositions. The reaction products are distinguished by having a plurality of carboxyl groups, but no imide groups, in each molecule. The reaction products may optionally be further reacted with epoxy resins and may optionally be formulated together with polymers having at least one glass transition temperature of −30 C. or lower and epoxy-reactive groups and/or reaction products of said polymers with epoxy resins to provide resin systems useful in adhesives. Such adhesive formulations may additionally contain liquid and/or solid epoxy resins and/or hardeners and/or accelerators and/or fillers and/or and/or other impact-modifying components and/or rheology auxiliaries. Such compositions exhibit excellent shelf life and are particularly suitable as impact-resistant and peel-resistant adhesives in vehicle construction and in electronics. Particularly at very low temperatures, these adhesives exhibit very good impact and peel properties combined with very good corrosion resistance and aging resistance of the adhesive bond.