Richard John Schumacher

US Patent:

61347728, Oct 24, 2000

Filed:

Dec 18, 1998

Appl. No.:

9/215993

Inventors:

Roy Lynn Arldt - Georgetown TX
Christina Marie Boyko - Conklin NY
Burtran Joe Cayson - Austin TX
Richard Michael Kozlowski - Apalachin NY
Joseph Duane Kulesza - Binghamton NY
John Matthew Lauffer - Waverly NY
Philip Chihchau Liu - Endwell NY
Voya Rista Markovich - Endwell NY
Issa Said Mahmoud - Apalachin NY
James Francis Muska - Johnson City NY
Kostas Papathomas - Endicott NY
Joseph Gene Sabia - Norwich NY
Richard Anthony Schumacher - Endicott NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01C 1706

US Classification:

29620

Abstract:

The present invention permits solder joints to be made directly to via and through holes without the solder being wicked into the vias or through holes, by filling plated through holes with an epoxy or cyanate fill composition. When cured and overplated, the fill composition provides support for the solder joint and provides a flat solderable surface for the inter-connection. In certain embodiments, the cured fill compositions, offer a further advantage of being conductive. The invention also relates to several novel methods for filling through holes with such fill compositions, and to resistors located in through holes and vias.

US Patent:

52142507, May 25, 1993

Filed:

Sep 19, 1991

Appl. No.:

7/762201

Inventors:

Burtran J. Cayson - Austin TX
John A. Covert - Binghamton NY
Steven A. Duncan - Austin TX
John M. Lauffer - Waverly NY
Issa S. Mahmoud - Apalachin NY
Richard A. Schumacher - Endicott NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05G 100

US Classification:

174250

Abstract:

Disclosed is a method of reworking a circuit panel, and a reworked circuit panel structure. The method includes providing a conformal, polymeric, dielectric coating or coatings on the surface of the panel, providing conductive circuitization atop the conformal, polymeric, dielectric coating or coatings on the surface of the panel, and providing a top conformal, polymeric, dielectric coating atop the conductive circuitization layer. Also disclosed is a rerouted circuit panel having at least two surface features that are connected by a rerouted current lead. The current lead is formed of a dielectric encapsulated conductor electrically joining the two surface features. The dielectric encapsulated conductor structure includes a conformal, polymeric dielectric bottom layer adherent to a surface of the circuit board, with a provided conductor on the conformal, polymeric dielectric layer, and a conformal, polymeric dielectric layer provided atop the provided conductor. The polymeric dielectric bottom layer may include one or more layers atop one another.

US Patent:

57666709, Jun 16, 1998

Filed:

Nov 17, 1993

Appl. No.:

8/154341

Inventors:

Roy Lynn Arldt - Georgetown TX
Christina Marie Boyko - Conklin NY
Burtran Joe Cayson - Austin TX
Richard Michael Kozlowski - Apalachin NY
Joseph Duane Kulesza - Binghamton NY
John Matthew Lauffer - Waverly NY
Philip Chihchau Liu - Endwell NY
Voya Rista Markovich - Endwell NY
Issa Said Mahmoud - Apalachin NY
James Francis Muska - Johnson City NY
Kostas Papathomas - Endicott NY
Joseph Gene Sabia - Norwich NY
Richard Anthony Schumacher - Endicott NY

International Classification:

B05D 512

US Classification:

427 8

Abstract:

The present invention permits solder joints to be made directly to via and through holes without the solder being wicked into the vias or through holes, by filling plated through holes with an epoxy or cyanate fill composition. When cured and overplated, the fill composition provides support for the solder joint and provides a flat solderable surface for the inter-connection. In certain embodiments, the cured fill compositions, offer a further advantage of being conductive. The invention also relates to several novel methods for filling through holes with such fill compositions, and to resistors located in through holes and vias.

US Patent:

55715931, Nov 5, 1996

Filed:

Jun 6, 1995

Appl. No.:

8/467558

Inventors:

Roy L. Arldt - Georgetown TX
Christina M. Boyko - Conklin NY
Burtran J. Cayson - Austin TX
Richard M. Kozlowski - Apalachin NY
Joseph D. Kulesza - Binghamton NY
John M. Lauffer - Waverly NY
Philip C. Liu - Endwell NY
Voya R. Markovich - Endwell NY
Issa S. Mahmoud - Apalachin NY
James F. Muska - Johnson City NY
Kostas Papathomas - Endicott NY
Joseph G. Sabia - Norwich NY
Richard A. Schumacher - Endicott NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B32B 900

US Classification:

428131

Abstract:

The present invention permits solder joints to be made directly to via and through holes without the solder being wicked into the vias or through holes, by filling plated through holes with an epoxy or cyanate fill composition. When cured and overplated, the fill composition provides support for the solder joint and provides a flat solderable surface for the inter-connection. In certain embodiments, the cured fill compositions, offer a further advantage of being conductive. The invention also relates to several novel methods for filling through holes with such fill compositions, and to resistors located in through holes and vias.

US Patent:

61940240, Feb 27, 2001

Filed:

Jun 6, 1995

Appl. No.:

8/469449

Inventors:

Roy Lynn Arldt - Georgetown TX
Christina Marie Boyko - Conklin NY
Burtran Joe Cayson - Austin TX
Richard Michael Kozlowski - Apalachin NY
Joseph Duane Kulesza - Binghamton NY
John Matthew Lauffer - Waverly NY
Philip Chihchau Liu - Endwell NY
Voya Rista Markovich - Endwell NY
Issa Said Mahmoud - Apalachin NY
James Francis Muska - Johnson City NY
Kostas Papathomas - Endicott NY
Joseph Gene Sabia - Norwich NY
Richard Anthony Schumacher - Endicott NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B05D 512

US Classification:

427 97

Abstract:

The present invention permits solder joints to be made directly to via and through holes without the solder being wicked into the vias or through holes, by filling plated through holes with an epoxy or cyanate fill composition. When cured and overplated, the fill composition provides support for the solder joint and provides a flat solderable surface for the inter-connection. In certain embodiments, the cured fill compositions, offer a further advantage of being conductive. The invention also relates to several novel methods for filling through holes with such fill compositions, and to resistors located in through holes and vias.

US Patent:

20150232917, Aug 20, 2015

Filed:

Feb 18, 2015

Appl. No.:

14/625233

Inventors:

- Miami FL, US
Deepthi V. NORI - Miami FL, US
Nathan P. LAWRENCE - South Easton MA, US
Richard SCHUMACHER - South Easton MA, US

International Classification:

C12Q 1/68

Abstract:

The subject invention provides a two-step protocol using pressure cycling technology (PCT) and alkaline lysis for differential extraction of mixtures. In a preferred embodiment the procedure is used in forensic DNA applications such as, for example, DNA testing in the case of rape.