Robert I Decottignies

age ~50

from San Carlos, CA

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Linked Vacuum Processing Tools And Methods Of Using The Same
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US Patent:

20140044503, Feb 13, 2014
Filed:

Aug 7, 2013
Appl. No.:

13/961538
Inventors:

Steve Szudarski - Fremont CA, US
Andrew Scott Cornelius - San Jose CA, US
Amitabh Puri - San Jose CA, US
Michael Robert Rice - Pleasanton CA, US
Jeffrey C. Hudgens - San Francisco CA, US
Steven V. Sansoni - Livermore CA, US
Robert Irwin Decottignies - Redwood City CA, US
Dean C. Hruzek - Cedar Park TX, US
Peter Irwin - Austin TX, US
Nir Merry - Mountain View CA, US
International Classification:

H01L 21/677
US Classification:

414217
Abstract:

In some embodiments, a linked processing tool system is provided that includes (1) a first processing tool having at least a first transfer chamber configured to couple to a plurality of processing chambers; (2) a second processing tool having at least a second transfer chamber configured to couple to a plurality of processing chambers; (3) a third transfer chamber coupled between the first and second processing tools and configured to transfer substrates between the first and second processing tools; and (4) a single sequencer that controls substrate transfer operations between the first processing tool, the second processing tool and the third transfer chamber of the linked processing tool system. Numerous other aspects are provided.

Substrate Support Components Having Quartz Contact Tips
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US Patent:

20080105201, May 8, 2008
Filed:

Oct 29, 2007
Appl. No.:

11/927120
Inventors:

TIMOTHY RONAN - San Jose CA, US
Yuanhong Guo - San Jose CA, US
Robert Decottignies - Redwood City CA, US
Todd W. Martin - Mountain View CA, US
Darryl K. Angelo - Sunnyvale CA, US
Song-Moon Suh - San Jose CA, US
Nitin Khurana - Milpitas CA, US
Edward Ng - San Jose CA, US
International Classification:

B05C 13/00
US Classification:

118500
Abstract:

A support component comprises a support structure having a support surface with one or more quartz contact tips. In one version, the support component comprises a robot blade capable of transferring a substrate into and out of a chamber. The robot blade comprises a plate having a plurality of raised mesas, each raised mesa comprising a quartz contact tip which minimizes contact with the substrate thereby generating fewer contaminant particles during substrate transportation. Other versions of the support component include a heat exchange pedestal, lift pin assembly, and lifting fin assembly.

Gas Systems And Methods For Chamber Ports
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US Patent:

20160358792, Dec 8, 2016
Filed:

Aug 16, 2016
Appl. No.:

15/238604
Inventors:

- Santa Clara CA, US
Robert Irwin Decottignies - Redwood City CA, US
Andrew Nguyen - San Jose CA, US
Paul B. Reuter - Austin TX, US
Angela R. Sico - Round Rock TX, US
Michael Kuchar - Georgetown TX, US
Travis Morey - Austin TX, US
Mitchell DiSanto - Georgetown TX, US
International Classification:

H01L 21/67
C23C 16/455
Abstract:

An electronic device manufacturing system may include a chamber port assembly that provides an interface between a transfer chamber and a process chamber. In some embodiments, the chamber port assembly may be configured to direct a flow of purge gas into a substrate transfer area of the chamber port assembly. In other embodiments, a process chamber and/or the transfer chamber may be configured to direct a flow of purge gas into the substrate transfer area. The flow of purge gas into a substrate transfer area may prevent and/or reduce migration of particulate matter from chamber hardware onto a substrate being transferred between the transfer chamber and a process chamber. Methods of assembling a chamber port assembly are also provided, as are other aspects.

Gas Apparatus, Systems, And Methods For Chamber Ports
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US Patent:

20150083330, Mar 26, 2015
Filed:

Sep 25, 2013
Appl. No.:

14/036754
Inventors:

- Santa Clara CA, US
Robert Irwin Decottignies - Redwood City CA, US
Andrew Nguyen - San Jose CA, US
Paul B. Reuter - Austin TX, US
Angela R. Sico - Round Rock TX, US
Michael Kuchar - Georgetown TX, US
Travis Morey - Austin TX, US
Mitchell Disanto - Georgetown TX, US
International Classification:

C23C 16/44
C23C 14/56
H01L 21/67
US Classification:

15634531, 29890142, 118719, 239548
Abstract:

An electronic device manufacturing system may include a chamber port assembly that provides an interface between a transfer chamber and a process chamber. In some embodiments, the chamber port assembly may be configured to direct a flow of purge gas into a substrate transfer area of the chamber port assembly. In other embodiments, a process chamber and/or the transfer chamber may be configured to direct a flow of purge gas into the substrate transfer area. The flow of purge gas into a substrate transfer area may prevent and/or reduce migration of particulate matter from chamber hardware onto a substrate being transferred between the transfer chamber and a process chamber. Methods of assembling a chamber port assembly are also provided, as are other aspects.