Sarah H Felix

US Patent:

20130345780, Dec 26, 2013

Filed:

Mar 11, 2013

Appl. No.:

13/792708

Inventors:

Phillipe J. Tabada - Roseville CA, US
Kedar G. Shah - Oakland CA, US
Vanessa Tolosa - Oakland CA, US
Angela Tooker - Dublin CA, US
Terri Delima - Livermore CA, US
Heeral Sheth - Oakland CA, US
Sarah Felix - Oakland CA, US

International Classification:

A61N 1/04

US Classification:

607115, 216 14

Abstract:

Thin-film multi-electrode arrays (MEA) having one or more electrically conductive beams conformally encapsulated in a seamless block of electrically insulating material, and methods of fabricating such MEAs using reproducible, microfabrication processes. One or more electrically conductive traces are formed on scaffold material that is subsequently removed to suspend the traces over a substrate by support portions of the trace beam in contact with the substrate. By encapsulating the suspended traces, either individually or together, with a single continuous layer of an electrically insulating material, a seamless block of electrically insulating material is formed that conforms to the shape of the trace beam structure, including any trace backings which provide suspension support. Electrical contacts, electrodes, or leads of the traces are exposed from the encapsulated trace beam structure by removing the substrate.

US Patent:

20220245048, Aug 4, 2022

Filed:

Apr 20, 2022

Appl. No.:

17/724704

Inventors:

- Schenectady NY, US
Sarah FELIX - Niskayuna NY, US
Subhrajit ROYCHOWDHURY - Schenectady NY, US
Saikat RAY MAJUMDER - Niskayuna NY, US
Thomas SPEARS - Springdale OH, US

International Classification:

G06F 11/34
B29C 64/393
G06F 30/00
G06F 17/18

Abstract:

Generating fault indications for an additive manufacturing machine based on a comparison of the outputs of multiple process models to measured sensor data. The method receiving sensor data from the additive manufacturing machine during manufacture of at least one part. Models are selected from a model database, each model generating expected sensor values for a defined condition. Difference values are computed between the received sensor data and an output of each of the models. A probability density function is computed, which defines, for each of the models, a likelihood that a given difference value corresponds to each respective model. A probabilistic rule is applied to determine, for each of the models, a probability that the corresponding model output matches the received sensor data. An indicator is output of a defined condition corresponding to a model having the highest match probability.

US Patent:

20200218628, Jul 9, 2020

Filed:

Jan 8, 2019

Appl. No.:

16/242194

Inventors:

- Schenectady NY, US
Sarah FELIX - Niskayuna NY, US
Subhrajit ROYCHOWDHURY - Schenectady NY, US
Saikat RAY MAJUMDER - Niskayuna NY, US
Thomas SPEARS - Springdale OH, US

International Classification:

G06F 11/34
G06F 17/18
B29C 64/393
G06F 17/50

Abstract:

Generating fault indications for an additive manufacturing machine based on a comparison of the outputs of multiple process models to measured sensor data. The method receiving sensor data from the additive manufacturing machine during manufacture of at least one part. Models are selected from a model database, each model generating expected sensor values for a defined condition. Difference values are computed between the received sensor data and an output of each of the models. A probability density function is computed, which defines, for each of the models, a likelihood that a given difference value corresponds to each respective model. A probabilistic rule is applied to determine, for each of the models, a probability that the corresponding model output matches the received sensor data. An indicator is output of a defined condition corresponding to a model having the highest match probability.

US Patent:

20190322094, Oct 24, 2019

Filed:

Feb 25, 2019

Appl. No.:

16/285094

Inventors:

Kedar G. Shah - Oakland CA, US
Diane George - Livermore CA, US
Satinderpall S. Pannu - Pleasanton CA, US
Sarah Felix - Oakland CA, US

International Classification:

B32B 37/12
A61N 1/05
A61B 90/11
A61B 5/04

Abstract:

A stiffener-reinforced microelectrode array probe and fabrication method using wicking channel-distributed adhesives which temporarily adheres a flexible device onto a rigid stiffener for insertion and extraction. Assembly is by dispensing a liquid adhesive into a narrow open groove wicking channel formed on the stiffener so that the adhesive is wicked along and fills the channel by capillary action, and adhering the adhesive-filled bonding side of the elongated section of the rigid substrate to a flexible device.

US Patent:

20190054295, Feb 21, 2019

Filed:

Dec 9, 2016

Appl. No.:

15/764553

Inventors:

- Livermore CA, US
Kedar G. SHAH - Livermore CA, US
Supin CHEN - Livermore CA, US
Marissa CROSETTI - Livermore CA, US
Timir B. DATTA-CHAUDHURI - Livermore CA, US
Sarah H. FELIX - Livermore CA, US
Anna N. IVANOVSKAYA - Livermore CA, US
Jason JONES - Livermore CA, US
Kye Young LEE - Livermore CA, US
Susant PATRA - Livermore CA, US
Vanessa TOLOSA - Livermore CA, US
Angela C. TOOKER - Livermore CA, US

Assignee:

Lawrence Livermore National Security, LLC - Livermore CA

International Classification:

A61N 1/36
A61N 1/05
A61N 1/372
A61N 1/378
A61N 1/375

Abstract:

The present disclosure relates to a modular system for deep brain stimulation (DBS) and electrocorticography (ECoG). The system may have an implantable neuromodulator for generating electrical stimulation signals adapted to be applied to a desired region of a brain via an attached electrode array. An aggregator module may be used for collecting and aggregating electrical signals and transmitting the electrical signals to the neuromodulator. A control module may be used which is in communication with the aggregator module for controlling generation of the electrical signals and transmitting the electrical signals to the aggregator.

US Patent:

20180169406, Jun 21, 2018

Filed:

Jun 9, 2016

Appl. No.:

15/580640

Inventors:

- Livermore CA, US
Supin Chen - Palos Verdes CA, US
Sarah H. Felix - Oakland CA, US
Satinderpall S. Pannu - Pleasanton CA, US
Susant Patra - Brentwood CA, US
Venessa Tolosa - Oakland CA, US

International Classification:

A61N 1/05
A61B 5/04

Abstract:

A cylindrical microelectrode array having an elongated cylindrical core, and a multilayer structure conformally folded around and affixed to the cylindrical core so as to extend between opposite ends of the core. The multilayer structure has integrated sections including an electrode section with electrodes exposed through electrically insulating layers, a connector section with conductive bond pads for interfacing with external electronics, and a cable section with conductive traces encapsulated in electrically insulating layers and which connect between the electrodes and their corresponding bond pads. The array may be fabricated using a planar multilayer structure having the electrode, connector, and cable sections, and conformally folding the multilayer structure around and affixing to the cylindrical core. The cable section in particular may be conformally coiled around and affixed to the cylindrical core so that the electrical conduits helically extend between the connector and electrode sections.

US Patent:

20170348534, Dec 7, 2017

Filed:

Jun 29, 2017

Appl. No.:

15/637995

Inventors:

- Livermore CA, US
Satinderpall S. Pannu - Pleasanton CA, US
Heeral Sheth - Oakland CA, US
Angela C. Tooker - Dublin CA, US
Kedar G. Shah - San Francisco CA, US
Sarah H. Felix - Oakland CA, US

International Classification:

A61N 1/375
A61N 1/05
H05K 3/02
H05K 3/28

Abstract:

An implantable device has a cylindrical base, at least one electrode on the cylindrical base, at least one electrically conducting lead on the cylindrical base connected to the electrode wherein the electrically conducting lead has a feature size of

US Patent:

20170036012, Feb 9, 2017

Filed:

Oct 19, 2016

Appl. No.:

15/298140

Inventors:

Phillipe J. Tabada - Roseville CA, US
Satinderpall S. Pannu - Pleasanton CA, US
Kedar G. Shah - Oakland CA, US
Vanessa Tolosa - Oakland CA, US
Angela Tooker - Dublin CA, US
Terri Delima - Livermore CA, US
Heeral Sheth - Oakland CA, US
Sarah Felix - Oakland CA, US

International Classification:

A61N 1/05
A61B 5/04

Abstract:

Thin-film multi-electrode arrays (MEA) having one or more electrically conductive beams conformally encapsulated in a seamless block of electrically insulating material, and methods of fabricating such MEAs using reproducible, microfabrication processes. One or more electrically conductive traces are formed on scaffold material that is subsequently removed to suspend the traces over a substrate by support portions of the trace beam in contact with the substrate. By encapsulating the suspended traces, either individually or together, with a single continuous layer of an electrically insulating material, a seamless block of electrically insulating material is formed that conforms to the shape of the trace beam structure, including any trace backings which provide suspension support. Electrical contacts, electrodes, or leads of the traces are exposed from the encapsulated trace beam structure by removing the substrate.