Shin Low - Plano TX, US Mike Pierce - Plano TX, US
International Classification:
H01L023/48
US Classification:
257/690000
Abstract:
A packaged integrated circuit including a substrate including a metal grid over a top surface of the substrate and an integrated circuit chip mounted on the substrate over the grid. The metal grid can be electrically isolated from the integrated circuit or it can be electrically connected to the integrated circuit, through electrical ground for example.
Integrated Circuit Package And Method Of Assembling An Integrated Circuit Package
Shin S. Low - Cupertino CA, US Inderjit Singh - Saratoga CA, US
Assignee:
XILINX, INC. - San Jose CA
International Classification:
H01L 23/49 H01L 21/56
US Classification:
257784, 438127, 257E23024, 257E21502
Abstract:
A method of assembling an integrated circuit package is disclosed. The method comprises placing a die on a substrate of the integrated circuit package; coupling a plurality of wire bonds from a plurality of bond pads on the die to corresponding bond pads on the substrate; applying a non-conductive material to the plurality of wire bonds; and encapsulating the die and the plurality of wire bonds. An integrated circuit package is also disclosed.