Thomas C Rezsonya

US Patent:

56715307, Sep 30, 1997

Filed:

Oct 30, 1995

Appl. No.:

8/550262

Inventors:

Christopher David Combs - Wheeling IL
Andrew Russell Baker - Kokomo IN
Steven Lee Davidson - Carmel IN
Thomas Rezsonya - Galveston IN

Assignee:

Delco Electronics Corporation - Kokomo IN

International Classification:

H05K 330
H05K 1302
H05K 1304
H05K 1308

US Classification:

29834

Abstract:

A vertical wafer compact flip chip feeder device includes a loading station for providing a loading location where a flip chip wafer having first and second planar surfaces is received such that the first and second planar surfaces are substantially perpendicular to a first plane. The flip chip feeder device further includes a pick-up station for providing a pick-up location where individual flip chips are retrieved from the flip chip wafer. A wafer translating assembly translates the flip chip wafer between the loading and pick-up stations with the first and second planar surfaces of the flip chip wafer remaining substantially perpendicular to the first plane. A chip pick-up assembly retrieves the individual flip chips from the flip chip wafer at the pick-up station and flips the individual flip chips to a flipped position such that first and second planar surfaces of the individual flip chips are substantially parallel with the first plane.