William L Brodsky

US Patent:

6375475, Apr 23, 2002

Filed:

Mar 6, 2001

Appl. No.:

09/800148

Inventors:

William Louis Brodsky - Binghamton NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01R 909

US Classification:

439 66

Abstract:

An electronic subassembly includes a printed circuit board and an electronic module, particularly a ceramic module, electrically connected to one another through a planar interposer. The interposer includes an insulator sheet and electrical spring elements joining contact sites on the module with contact pads on the PCB. The invention includes modifications that improve the integrity of electrical connections between the printed circuit board and the electronic module. This is achieved by compensating for non-planarity between the surfaces of the interposer and the module, particularly resulting from a convex curvature of the module, by minimizing relative movement, such as rocking in the x-z and y-z planes. It also includes modifications to the suspension of the module within the interposer housing to reduce the effects caused by any sliding that may occur between the interposer and the module in the x-y plane.

US Patent:

6386890, May 14, 2002

Filed:

Mar 12, 2001

Appl. No.:

09/804529

Inventors:

Anilkumar Chinuprasad Bhatt - Johnson City NY
William Louis Brodsky - Binghamton NY
Benson Chan - Vestal NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G01R 1200

US Classification:

439 67, 439 66

Abstract:

The present invention provides a method and structure for connecting a module to a printed circuit board, wherein a substantially rigid interposer having resilient conductors is disposed between a module and a printed circuit board. A clamping means urges the module and printed circuit board toward each other with compressive force upon an interposer positioned therebetween, preferably causing the module and printed circuit board to deform and thereby align their electrical contacts with the surfaces of the interposer. The interposer further comprises a plurality of apertures, each aperture further having a deformable resilient conductor means for connecting a module contact to a PCB contact. The conductor is deformable in shear, which may travel and, therefore, makeup the CTE dimensional mismatch between the module and the PCB. The conductors are detachable, electrically connecting the module and PCB contacts without the requirement of solder or other permanent means.

US Patent:

6407924, Jun 18, 2002

Filed:

Jan 9, 2001

Appl. No.:

09/757002

Inventors:

William L. Brodsky - Binghamton NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K 720

US Classification:

361704, 361707, 361709, 361710, 361718, 361719, 257706, 257717, 257718, 257719, 165 802, 165 803, 165185

Abstract:

A method and structure for interfacing a thermally conductive pad between a heat generating module and a heatsink, such that the pad is in substantial thermal contact with both the module and the heatsink despite the fact that both the module and the heatsink are under mechanical tension. The mechanical tension causes deflection of a surface of the module and a surface of the heatsink so as to generate an air gap between the pad and the heatsink, as well as between the pad and the module. The present invention overcomes the deflection by crowning the pad, crowning the heatsink, or crowning the module.

US Patent:

6423905, Jul 23, 2002

Filed:

May 1, 2000

Appl. No.:

09/562109

Inventors:

William L. Brodsky - Binghamton NY
Kevin T. Knadle - Endicott NY
John M. Lauffer - Waverly NY
Douglas O. Powell - Endicott NY
David J. Russell - Apalachin NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K 103

US Classification:

174256, 174262, 361750, 361762

Abstract:

A printed wiring board having a layered composite of metal planes and dielectric layers. At least one of the dielectric layers has a modulus lower than the modulus of the remaining dielectric material layers. A plating, extending through the layered composite, has a first land on a first external surface of the layered composite, a second land on a second external surface of the layered composite, and a barrel extending between the first land and the second land. The lower modulus dielectric material layer deforms during thermal excursions of the printed wiring board in such a way as to reduce the strains imposed on both the lands and the barrel of the plated through holes.

US Patent:

6433283, Aug 13, 2002

Filed:

May 21, 2001

Appl. No.:

09/860549

Inventors:

William L. Brodsky - Binghamton NY
David V. Caletka - Apalachin NY
William Infantolino - Vestal NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01B 708

US Classification:

174117F, 174 47

Abstract:

A ribbon cable includes electrical conductors surrounded by an insulator and vent tubes positioned adjacent and parallel to the conductors and insulator. The vent tubes allow airflow between an internal area of the enclosure and an external atmosphere and prevent access to the internal area of the enclosure.

US Patent:

6540528, Apr 1, 2003

Filed:

Apr 26, 2001

Appl. No.:

09/842029

Inventors:

William Louis Brodsky - Binghamton NY
Dennis Hurley Byrne - Tucson AZ
Alex Chliwnyj - Tucson AZ
David Michael Davis - Tucson AZ
James Mitchell Karp - Tucson AZ
George G. Zamora - Vail AZ

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01R 1200

US Classification:

439 67

Abstract:

An electrical connection of a transfer station releasably, repeatably electrically couples with respect to a matching connection of a portable cartridge. A substrate in the portable cartridge has electrical contacts on a facing surface. In the transfer station, a matching circuitized flexible substrate has electrical contacts on a facing surface thereof, which are arranged to match the portable cartridge electrical contacts when in a face-to-face relationship. An elastomeric compression element, at the rear of the matching substrate, has individual protruding compression members contacting the rear surface and registered with corresponding individual electrical contacts. Elongated electrical contacts are registered with two adjacent individual compression members. A loader engages the portable cartridge, registering the cartridge substrate contacts in face-to-face relation with the matching flexible substrate electrical contacts, and exerting a normal force to the cartridge to compress the compression element and create non-wiping contact between the facing electrical contacts.

US Patent:

6545226, Apr 8, 2003

Filed:

May 31, 2001

Appl. No.:

09/871556

Inventors:

William Louis Brodsky - Binghamton NY
Benson Chan - Vestal NY
Michael Anthony Gaynes - Vestal NY
Voya Rista Markovich - Endwell NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K 111

US Classification:

174260, 174262, 174264, 361760, 361769, 439 65, 439 91, 257698, 257738, 257778

Abstract:

The details of a printed wiring board (PWB) sub-assembly and the method of producing the same are described. The sub-assembly comprises a printed circuit board electrically joined through a plurality of connections to one or more area array devices, such as modules or printed wiring boards. The sub-assembly can serve as a part of an original assembly. The sub-assembly can function as an after market item that can be readily substituted as a replacement for a failed component wherein the dimensional space between the printed circuit board and one or both of the area array devices must provide sufficient clearance for surface mounted devices.

US Patent:

6595784, Jul 22, 2003

Filed:

May 15, 2001

Appl. No.:

09/855308

Inventors:

William Louis Brodsky - Binghamton NY
David Vincent Caletka - Apalachin NY

Assignee:

International Business Machines Corporation - Armonk NJ

International Classification:

H01R 1200

US Classification:

439 66, 174262

Abstract:

An interposer member having strategically positioned apertures for electrically connecting an electronic device to a circuitized substrate. The member includes a homogeneous elastomer core having strategically positioned apertures. The apertures are positioned through the member approximately equidistant between adjacent plated through holes and/or conductive pads. Such positioning relieves stress from the plated through holes and/or conductive pads, and increases the contact compliancy of the member.

Author:

William L. Brodsky

ISBN #:

0819416533

Author:

William A. Brodsky

ISBN #:

0897660706

Author:

William A. Brodsky

ISBN #:

0897660714