Yong Hua Sun

US Patent:

7743309, Jun 22, 2010

Filed:

Mar 17, 2006

Appl. No.:

11/384062

Inventors:

Jin Li - Sammamish WA, US
Yong Sun - Hoffman Estates IL, US

Assignee:

Microsoft Corporation - Redmond WA

International Classification:

H03M 13/00

US Classification:

714774, 714785

Abstract:

A process for distributed source coding (DSC) using context is presented. By forming contexts from prior coded bitplanes of both a reference and DSC coded peer, the DSC virtual channel is split into several virtual sub-channels of different characteristics. The selection of the sub-channel becomes side information that is known to the receiver. As a result, the DSC coding bitrate is reduced.

US Patent:

20200075286, Mar 5, 2020

Filed:

Aug 13, 2019

Appl. No.:

16/539943

Inventors:

- Bothell WA, US
Chloe A. M. Fabien - Seattle WA, US
Gary D. Foley - Mill Creek WA, US
Andrew T. Koch - Seattle WA, US
William Kokonaski - Edmonds WA, US
Andrew R. Lingley - Seattle WA, US
Tony S. Pan - Bellevue WA, US
Yong Sun - Belle Mead NJ, US

Assignee:

Modern Electron, LLC - Bothell WA

International Classification:

H01J 19/44
H01J 19/38
H01J 9/18

Abstract:

Disclosed embodiments include vacuum electronic devices and methods of fabricating a vacuum electronic device. In a non-limiting embodiment, a vacuum electronic device includes an electrode that defines discrete support structures therein. A first film layer is disposed on the electrode about a periphery of the electrode and on the support structures. A second film layer is disposed on the first film layer. The second film layer includes electrically conductive grid lines patterned therein that are supported by and suspended between the support structures.

US Patent:

20190043685, Feb 7, 2019

Filed:

Jul 20, 2018

Appl. No.:

16/041639

Inventors:

- Bellevue WA, US
Chloe A. M. Fabien - Seattle WA, US
Gary D. Foley - Mill Creek WA, US
Arvind Kannan - Bellevue WA, US
Andrew T. Koch - Seattle WA, US
Andrew R. Lingley - Seattle WA, US
Hsin-I Lu - Mercer Island WA, US
Max N. Mankin - Seattle WA, US
Tony S. Pan - Bellevue WA, US
Jason M. Parker - Redmond WA, US
Peter J. Scherpelz - Seattle WA, US
Yong Sun - Belle Mead NJ, US
Chuteng Zhou - Cambridge MA, US

Assignee:

Modern Electron, LLC - Bellevue WA

International Classification:

H01J 19/42
H01J 19/02
H01L 29/43

Abstract:

Disclosed embodiments include vacuum electronics devices and methods of fabricating a vacuum electronics device. In a non-limiting embodiment, a vacuum electronics device includes: an electrode; a plurality of grid supports disposed on the electrode, each of the plurality of grid supports having a first width; and a plurality of grid lines, each of the plurality of grid lines being supported on an associated one of the plurality of grid supports, each of the plurality of grid lines having a second width that is wider than the first width.

US Patent:

20180144915, May 24, 2018

Filed:

Nov 1, 2017

Appl. No.:

15/800912

Inventors:

- Bellevue WA, US
Max N. Mankin - Seattle WA, US
Tony S. Pan - Bellevue WA, US
Yong Sun - Belle Mead NJ, US

Assignee:

Modern Electron, LLC - Bellevue WA

International Classification:

H01J 45/00
C23C 16/455
B05D 1/02
B05D 1/00
C23C 14/22

Abstract:

Disclosed embodiments include conductive oxide-coated electrodes and methods of fabricating a conductive oxide-coated electrode. In a non-limiting embodiment, a conductive oxide-coated electrode includes: a conductive layer; and an oxide coating disposed on the conductive layer. In another non-limiting embodiment, a method of fabricating a conductive oxide-coated electrode includes: patterning a conductive layer; etching the patterned conductive layer; and disposing an oxide coating on the etched conductive layer.