Edward J Ossolinski

US Patent:

52474240, Sep 21, 1993

Filed:

Jun 16, 1992

Appl. No.:

7/899414

Inventors:

Willard S. Harris - Red Hook NY
Matthew A. Hutchinson - Cortland NY
Richard R. Konian - Poughkeepsie NY
Edward J. Ossolinski - Poughkeepsie NY
Vincent C. Vasile - Marlboro NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K 720
H01R 13533

US Classification:

361704

Abstract:

A gasket is fabricated with electrical flex cables extending through the gasket in order to electrically communicate from the outside of a vacuum chamber with the electrical devices positioned within a vacuum chamber of a cryogenically cooled module. The gasket is fabricated from elastomeric, dielectric materials such as neoprene to effect a seal between the portions of the vacuum chamber and also to seal between the gasket material and the conductors of the flex cables which pass through the gasket.

US Patent:

51212927, Jun 9, 1992

Filed:

Jan 23, 1990

Appl. No.:

7/468529

Inventors:

David F. Bell - Woodstock NY
Raymond D. Birchall - Ruby NY
Harry A. Carlson - High Falls NY
Willard S. Harris - Red Hook NY
Edward J. Ossolinski - Poughkeepsie NY
Vincent C. Vasile - Marlboro NY
James R. Warnot - Rhinebeck NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K 720

US Classification:

361385

Abstract:

A cryocooled field-replaceable logic unit for use with a cryogenic cold head such as that of a cryocooler comprises a thermally conductive plate adapted to be disposed in thermal contact with the cold head, a thermally insulating enclosure portion cooperating with the conductive plate to form a sealed enclosure detachable from the cold head, and one or logic chips mounted in the enclosure in thermal contact with the conductive plate. Preferably the conductive plate is attached to the thermally insulating portion through a resilient mounting which forms a recess for receiving the cold head and which is tension-loaded when the logic unit is mounted on the cold head to urge the plate into intimate thermal contact with the cold head. In one embodiment the enclosure receives from an external source a supply of gaseous nitrogen which is liquified by contact with the conductive plate to form a pool of liquid nitrogen in which the logic chips are immersed. In another embodiment plural logic units are detachably mounted on passive cold heads immersed in a cryostat.

US Patent:

53809556, Jan 10, 1995

Filed:

Dec 8, 1992

Appl. No.:

7/987932

Inventors:

Straty N. Argyrakis - Highland NY
Willard S. Harris - Red Hook NY
Richard W. Oldrey - Clintondale NY
Edward J. Ossolinski - Poughkeepsie NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01B 1726

US Classification:

174151

Abstract:

A device is provided for passing a member through the wall of a sealed chamber. The member has an outer surface having a portion thereof which is substantially formed of metal. A flange has an opening therein which surrounds and is spaced from the metal portion of the member. A solder member completely fills the space between the flange opening and the metal portion of the member for creating a seal therebetween which is capable of maintaining a high pressure differential between opposite sides of the sealed chamber wall. The member is preferably a flat, multi-conductor electrical cable having thin, flat, copper shielding layers on the top and bottom thereof. The metal portion preferably includes a wedge-shaped copper member which surrounds the electrical cable and is intricately affixed to the shielding layers. The solder member is preferably a solder compound comprising 52 percent indium and 48 percent tin.