Gang N Zhang

US Patent:

7172684, Feb 6, 2007

Filed:

Oct 15, 2002

Appl. No.:

10/272254

Inventors:

Adam L. Cohen - Los Angeles CA, US
Gang Zhang - Monterey Park CA, US
Qui T. Le - Anaheim CA, US

Assignee:

Microfabrica Inc. - Van Nuys CA

International Classification:

C25D 5/02
C25D 5/00

US Classification:

205118, 205135, 205137

Abstract:

Various embodiments of the invention provide techniques for forming structures (e. g. HARMS-type structures) via an electrochemical extrusion process. Preferred embodiments perform the extrusion processes via depositions through anodeless conformable contact masks that are initially pressed against substrates that are then progressively pulled away or separated as the depositions thicken. A pattern of deposition may vary over the course of deposition by including more complex relative motion between the mask and the substrate elements. Such complex motion may include rotational components or translational motions having components that are not parallel to an axis of separation. More complex structures may be formed by combining the electrochemical extrusion process with the selective deposition, blanket deposition, planarization, etching, and multi-layer operations of a multi-layer electrochemical fabrication process.

US Patent:

7198043, Apr 3, 2007

Filed:

Aug 23, 2006

Appl. No.:

11/466715

Inventors:

Gang Zhang - Monterey Park CA, US

International Classification:

B23C 5/28

US Classification:

125 39, 219 68, 83171, 409131

Abstract:

The present invention provides a method for extending diamond tool life in diamond machining of materials that chemically react with the diamond tool in which the surface electric potential of the workpiece is adjusted or tuned to be adequate to inhibit the chemical reaction between the diamond tool and the workpiece during the diamond machining operation. As the chemical reaction is inhibited, the chemical wear rate of the diamond tool is reduced and diamond tool life is extended. The surface electric potential of the workpiece can be adjusted by electrically charging the workpiece. In one embodiment, conduction charging is used to adjust the surface electric potential of the workpiece to inhibit the chemical reaction between the diamond tool and the workpiece. In another embodiment, induction charging is used to adjust the surface electric potential of the workpiece to inhibit the chemical reaction between the diamond tool and the workpiece.

US Patent:

7235166, Jun 26, 2007

Filed:

Oct 1, 2003

Appl. No.:

10/677498

Inventors:

Adam L. Cohen - Los Angeles CA, US
Dennis R. Smalley - Newhall CA, US
Gang Zhang - Monterey Park CA, US

Assignee:

Microfabrica Inc. - Van Nuys CA

International Classification:

C25D 5/02

US Classification:

205118, 205122

Abstract:

Multilayer structures are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. Selectivity of deposition is obtained via a multi-cell controllable mask. Alternatively, net selective deposition is obtained via a blanket deposition and a selective removal of material via a multi-cell mask. Individual cells of the mask may contain electrodes comprising depositable material or electrodes capable of receiving etched material from a substrate. Alternatively, individual cells may include passages that allow or inhibit ion flow between a substrate and an external electrode and that include electrodes or other control elements that can be used to selectively allow or inhibit ion flow and thus inhibit significant deposition or etching. Single cell masks having a cell size that is smaller or equal to the desired deposition resolution may also be used to form structures.

US Patent:

7288178, Oct 30, 2007

Filed:

Oct 15, 2002

Appl. No.:

10/271574

Inventors:

Adam L. Cohen - Los Angeles CA, US
Gang Zhang - Monterey Park CA, US
Qui T. Le - Anaheim CA, US
Michael S. Lockard - Lake Elizabeth CA, US
Dennis R. Smalley - Newhall CA, US

Assignee:

Microfabrica, Inc. - Van Nuys CA

International Classification:

C25D 5/00
C25D 5/02

US Classification:

205118, 205135, 205137

Abstract:

Various embodiments of the invention provide techniques for forming structures (e. g. HARMS-type structures) via an electrochemical extrusion process. Preferred embodiments perform the extrusion processes via depositions through anodeless conformable contact masks that are initially pressed against substrates that are then progressively pulled away or separated as the depositions thicken. A pattern of deposition may vary over the course of deposition by including more complex relative motion between the mask and the substrate elements. Such complex motion may include rotational components or translational motions having components that are not parallel to an axis of separation. More complex structures may be formed by combining the electrochemical extrusion process with the selective deposition, blanket deposition, planarization, etching, and multi-layer operations of a multi-layer electrochemical fabrication process.

US Patent:

7517462, Apr 14, 2009

Filed:

Jan 3, 2005

Appl. No.:

11/029014

Inventors:

Adam L. Cohen - Los Angeles CA, US
Michael S. Lockard - Lake Elizabeth CA, US
Kieun Kim - Pasadena CA, US
Qui T. Le - Anaheim CA, US
Gang Zhang - Monterey Park CA, US
Uri Frodis - Los Angeles CA, US
Dale S. McPherson - Kissimmee FL, US
Dennis R. Smalley - Newhall CA, US

Assignee:

Microfabrica Inc. - Van Nuys CA

International Classification:

B81C 1/00

US Classification:

216 2, 216 13, 216 38, 216 39, 216 56, 205118, 205223

Abstract:

Some embodiments of the present invention are directed to techniques for building up single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while other embodiments use an intervening adhesion layer material. Some embodiments use different seed layer materials and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while other embodiments apply the materials in blanket fashion. Some embodiments remove extraneous depositions (e. g. depositions to regions unintended to form part of a layer) via planarization operations while other embodiments remove the extraneous material via etching operations. Other embodiments are directed to the electrochemical fabrication of multilayer mesoscale or microscale structures which are formed using at least one conductive structural material, at least one conductive sacrificial material, and at least one dielectric material. In some embodiments the dielectric material is a UV-curable photopolymer.

US Patent:

7524427, Apr 28, 2009

Filed:

Jan 3, 2005

Appl. No.:

11/029218

Inventors:

Adam L. Cohen - Los Angeles CA, US
Michael S. Lockard - Lake Elizabeth CA, US
Kieun Kim - Pasadena CA, US
Qui T. Le - Anaheim CA, US
Gang Zhang - Monterey Park CA, US
Uri Frodis - Los Angeles CA, US
Dale S. McPherson - Kissimmee FL, US
Dennis R. Smalley - Newhall CA, US

Assignee:

Microfabrica Inc. - Van Nuys CA

International Classification:

B81C 1/00

US Classification:

216 2, 216 13, 216 38, 216 39, 216 56, 205118, 205223

Abstract:

Some embodiments of the present invention are directed to techniques for building up single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while other embodiments use an intervening adhesion layer material. Some embodiments use different seed layer materials and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while other embodiments apply the materials in blanket fashion. Some embodiments remove extraneous depositions (e. g. depositions to regions unintended to form part of a layer) via planarization operations while other embodiments remove the extraneous material via etching operations. Other embodiments are directed to the electrochemical fabrication of multilayer mesoscale or microscale structures which are formed using at least one conductive structural material, at least one conductive sacrificial material, and at least one dielectric material. In some embodiments the dielectric material is a UV-curable photopolymer.

US Patent:

7696102, Apr 13, 2010

Filed:

Mar 30, 2006

Appl. No.:

11/278137

Inventors:

Gang Zhang - Monterey Park CA, US

International Classification:

H01L 21/461

US Classification:

438738, 438751

Abstract:

A multi-layer fabrication method for making three-dimensional structures is provided. In one embodiment, the formation of a multi-layer three-dimensional structure comprises: 1) fabricating a plurality of layers with each layer comprising at least two materials; 2) aligning the layers; 3) attaching the layers together to form a multi-layer structure; and 4) removing at least a portion of at least one of the materials from the multi-layer structure. Fabrication methods for making the required layers are also disclosed. In another embodiment, the formation of a multi-layer three-dimensional structure comprises: 1) attaching a layer of a material to a substrate or a previously formed layer; 2) machining the attached layer to form a layer that comprises at least two materials; and 3) repeating the operations of 1) and 2) a plurality of times to form a multi-layer structure; and 4) removing at least a portion of at least one of the materials from the multi-layer structure to form a desired three-dimensional structure.

US Patent:

8216931, Jul 10, 2012

Filed:

Oct 10, 2006

Appl. No.:

11/548207

Inventors:

Gang Zhang - Monterey Park CA, US

International Classification:

H01L 21/4763

US Classification:

438619, 438 49, 438 50, 438 51, 438 52, 438 53, 438 54, 438 55, 438 56, 438 57, 438618, 438622

Abstract:

Embodiments are directed to the formation of multi-layer three-dimensional structures by forming and attaching a plurality of layers where each of the plurality of layers comprises at least one structural material forming a pattern and where at least one of the plurality of layers comprises at least one sacrificial material. In one embodiment, the formation of a multi-layer three-dimensional structure comprises (1) forming a plurality of individual layers and (2) attaching at least the formed plurality of individual layers together. In another embodiment, the formation of a multi-layer three-dimensional structure comprises (1) attaching an individual layer onto a substrate or onto a previously formed layer; (2) processing the attached individual layer to form a new layer comprising at least one material forming a pattern; and (3) repeating the steps of (1) and (2) one or more times.