Puqi Ning

US Patent:

20130020694, Jan 24, 2013

Filed:

Jul 12, 2012

Appl. No.:

13/547937

Inventors:

Zhenxian Liang - Knoxville TN, US
Laura D. Martino - Oak Ridge TN, US
Puqi Ning - Knoxville TN, US
Fei Wang - Knoxville TN, US

International Classification:

H01L 23/52
H01L 21/60

US Classification:

257691, 438121, 257E21506, 257E23141

Abstract:

A double sided cooled power module package having a single phase leg topology includes two IGBT and two diode semiconductor dies. Each IGBT die is spaced apart from a diode semiconductor die, forming a switch unit. Two switch units are placed in a planar face-up and face-down configuration. A pair of DBC or other insulated metallic substrates is affixed to each side of the planar phase leg semiconductor dies to form a sandwich structure. Attachment layers are disposed on outer surfaces of the substrates and two heat exchangers are affixed to the substrates by rigid bond layers. The heat exchangers, made of copper or aluminum, have passages for carrying coolant. The power package is manufactured in a two-step assembly and heating process where direct bonds are formed for all bond layers by soldering, sintering, solid diffusion bonding or transient liquid diffusion bonding, with a specially designed jig and fixture.